JP2023529004A5 - - Google Patents

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Publication number
JP2023529004A5
JP2023529004A5 JP2022576342A JP2022576342A JP2023529004A5 JP 2023529004 A5 JP2023529004 A5 JP 2023529004A5 JP 2022576342 A JP2022576342 A JP 2022576342A JP 2022576342 A JP2022576342 A JP 2022576342A JP 2023529004 A5 JP2023529004 A5 JP 2023529004A5
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JP
Japan
Prior art keywords
group
hydrogen
compounds
different
independently selected
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022576342A
Other languages
English (en)
Japanese (ja)
Other versions
JP7757324B2 (ja
JP2023529004A (ja
Filing date
Publication date
Priority claimed from EP20179696.8A external-priority patent/EP3922755A1/en
Application filed filed Critical
Publication of JP2023529004A publication Critical patent/JP2023529004A/ja
Publication of JP2023529004A5 publication Critical patent/JP2023529004A5/ja
Application granted granted Critical
Publication of JP7757324B2 publication Critical patent/JP7757324B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2022576342A 2020-06-12 2021-06-10 金属基材表面処理用の塩基性水系エッチング組成物 Active JP7757324B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP20179696.8 2020-06-12
EP20179696.8A EP3922755A1 (en) 2020-06-12 2020-06-12 An aqueous basic etching composition for the treatment of surfaces of metal substrates
PCT/EP2021/065663 WO2021250182A1 (en) 2020-06-12 2021-06-10 An aqueous basic etching composition for the treatment of surfaces of metal substrates

Publications (3)

Publication Number Publication Date
JP2023529004A JP2023529004A (ja) 2023-07-06
JP2023529004A5 true JP2023529004A5 (enExample) 2024-06-11
JP7757324B2 JP7757324B2 (ja) 2025-10-21

Family

ID=71094162

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022576342A Active JP7757324B2 (ja) 2020-06-12 2021-06-10 金属基材表面処理用の塩基性水系エッチング組成物

Country Status (6)

Country Link
US (1) US20230220558A1 (enExample)
EP (2) EP3922755A1 (enExample)
JP (1) JP7757324B2 (enExample)
KR (1) KR20230024301A (enExample)
CN (1) CN115702261A (enExample)
WO (1) WO2021250182A1 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20230243041A1 (en) * 2022-01-28 2023-08-03 Texas Instruments Incorporated Etching compositions

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3668131A (en) * 1968-08-09 1972-06-06 Allied Chem Dissolution of metal with acidified hydrogen peroxide solutions
US3809588A (en) * 1969-11-03 1974-05-07 R Zeblisky Peroxy containing compositions
US4311551A (en) * 1979-04-12 1982-01-19 Philip A. Hunt Chemical Corp. Composition and method for etching copper substrates
JPS5928035Y2 (ja) * 1979-10-09 1984-08-14 凸版印刷株式会社 残渣回収装置
US4784785A (en) * 1987-12-29 1988-11-15 Macdermid, Incorporated Copper etchant compositions
JPH0718472A (ja) * 1993-07-06 1995-01-20 Ebara Yuujiraito Kk 銅・銅合金材のための浸漬エッチング液
JP3252186B2 (ja) * 1993-07-19 2002-01-28 大塚化学株式会社 エッチング剤
DE10066028C2 (de) 2000-07-07 2003-04-24 Atotech Deutschland Gmbh Kupfersubstrat mit aufgerauhten Oberflächen
JP2009091656A (ja) 2007-09-19 2009-04-30 Nagase Chemtex Corp エッチング組成物
JP4521460B2 (ja) * 2008-02-20 2010-08-11 メック株式会社 エッチング液及びこれを用いた銅配線の形成方法
EP2099268A1 (en) 2008-03-07 2009-09-09 Atotech Deutschland Gmbh Non-etching adhesion composition, method of preparing a work piece and method of forming coppper structures on a circuit carrier substrate
JP6101421B2 (ja) * 2010-08-16 2017-03-22 インテグリス・インコーポレーテッド 銅または銅合金用エッチング液
JP6599322B2 (ja) * 2013-10-21 2019-10-30 フジフイルム エレクトロニック マテリアルズ ユー．エス．エー．， インコーポレイテッド 表面の残留物を除去するための洗浄配合物
EP3104398B1 (en) 2013-12-06 2020-03-11 Fujifilm Electronic Materials USA, Inc. Cleaning formulation and method for removing residues on surfaces
EP3159432B1 (en) 2015-10-23 2020-08-05 ATOTECH Deutschland GmbH Surface treatment agent for copper and copper alloy surfaces
CN109778194A (zh) * 2019-03-22 2019-05-21 深圳市祺鑫天正环保科技有限公司 碱性蚀刻再生液的添加剂和碱性蚀刻再生液

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