JP2023527963A - 水平発光を用いるマルチカラーｌｅｄピクセルユニットのシステム及び方法 - Google Patents

水平発光を用いるマルチカラーｌｅｄピクセルユニットのシステム及び方法 Download PDF

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JP2023527963A
JP2023527963A JP2022570733A JP2022570733A JP2023527963A JP 2023527963 A JP2023527963 A JP 2023527963A JP 2022570733 A JP2022570733 A JP 2022570733A JP 2022570733 A JP2022570733 A JP 2022570733A JP 2023527963 A JP2023527963 A JP 2023527963A
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layer
led
reflective
light
micro
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JP2023527963A5 (https=
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スー，クンチャオ
スー，フイウェン
リ，キミン
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ジェイド バード ディスプレイ（シャンハイ） リミテッド
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    • H—ELECTRICITY
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    • H10H20/80—Constructional details
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    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H10H20/832—Electrodes characterised by their material
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    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
    • H10H20/841—Reflective coatings, e.g. dielectric Bragg reflectors
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    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
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    • H10H20/80—Constructional details
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    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
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    • H10H20/855—Optical field-shaping means, e.g. lenses
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    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
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    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
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    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/822—Materials of the light-emitting regions
    • H10H20/824—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
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    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
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    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/822—Materials of the light-emitting regions
    • H10H20/824—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
    • H10H20/825—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP containing nitrogen, e.g. GaN
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    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
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    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07354—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in dispositions
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    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/322—Multilayered die-attach connectors, e.g. a coating on a top surface of a core
    • H10W72/323—Multilayered die-attach connectors, e.g. a coating on a top surface of a core characterised by the structures of the outermost layers, e.g. multilayered coatings
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    • H10W72/341—Dispositions of die-attach connectors, e.g. layouts
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    • H10W72/00—Interconnections or connectors in packages
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    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
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    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
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    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
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    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/355—Materials of die-attach connectors of outermost layers of multilayered die-attach connectors, e.g. material of a coating
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
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    • H10W72/874—On different surfaces
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    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/732—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between stacked chips

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  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Led Device Packages (AREA)
  • Electroluminescent Light Sources (AREA)
  • Led Devices (AREA)
JP2022570733A 2020-06-03 2021-06-03 水平発光を用いるマルチカラーｌｅｄピクセルユニットのシステム及び方法 Pending JP2023527963A (ja)

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Application Number Priority Date Filing Date Title
US202063034394P 2020-06-03 2020-06-03
US63/034,394 2020-06-03
PCT/US2021/035742 WO2021247894A1 (en) 2020-06-03 2021-06-03 Systems and methods for multi-color led pixel unit with horizontal light emission

Publications (2)

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JP2023527963A true JP2023527963A (ja) 2023-07-03
JP2023527963A5 JP2023527963A5 (https=) 2024-11-19

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US (2) US11967589B2 (https=)
EP (1) EP4162538A4 (https=)
JP (1) JP2023527963A (https=)
KR (1) KR20230022943A (https=)
CN (1) CN115843393A (https=)
AU (1) AU2021282566A1 (https=)
DE (1) DE21818011T1 (https=)
WO (1) WO2021247894A1 (https=)

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WO2025204187A1 (ja) * 2024-03-29 2025-10-02 ソニーグループ株式会社 発光装置および画像表示装置

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US10756162B2 (en) 2018-08-31 2020-08-25 Taiwan Semiconductor Manufacturing Co., Ltd. Structure and formation method of semiconductor device with magnetic element
CN114766065B (zh) * 2019-06-19 2025-06-24 上海显耀显示科技有限公司 用于多色led像素单元的系统和方法
WO2020263183A1 (en) * 2019-06-28 2020-12-30 Massachusetts Institute Of Technology Integrated structure for an optoelectronic device and method of fabricating the same
US11476299B2 (en) * 2020-08-31 2022-10-18 Hong Kong Beida Jade Bird Display Limited Double color micro LED display panel
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US12588326B2 (en) * 2021-11-12 2026-03-24 Lumileds Singapore Pte. Ltd. Composite cathode contact for monolithically integrated micro-LEDs, mini-LEDs and LED arrays
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JP2023154505A (ja) * 2022-04-07 2023-10-20 Ｔｏｐｐａｎホールディングス株式会社 表示装置
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KR102822777B1 (ko) * 2022-12-15 2025-06-19 엘지전자 주식회사 발광 구조를 구비한 디스플레이 장치
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WO2024207420A1 (en) * 2023-04-07 2024-10-10 Jade Bird Display (shanghai) Limited Micro led pixel and micro led panel
WO2025025072A1 (en) * 2023-07-31 2025-02-06 Jade Bird Display (shanghai) Limited Micro led and micro led display panel
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WO2025030492A1 (en) * 2023-08-10 2025-02-13 Jade Bird Display (shanghai) Limited Micro led pixel and micro led array panel
WO2025030493A1 (en) * 2023-08-10 2025-02-13 Jade Bird Display (shanghai) Limited Micro led pixel and micro led array panel
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CN117253883A (zh) * 2023-08-30 2023-12-19 上海显耀显示科技有限公司 Micro led显示面板及制造方法
US20250105220A1 (en) * 2023-09-27 2025-03-27 Rayleigh Vision Limited Vertically stacked light-emitting diode structure
CN117153971B (zh) * 2023-10-30 2024-01-23 盐城鸿石智能科技有限公司 一种高亮度MicroLED及其制备方法
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WO2025097378A1 (en) * 2023-11-09 2025-05-15 Jade Bird Display (shanghai) Limited Micro led, micro led display panel and epitaxial structure
US20240136339A1 (en) * 2023-12-11 2024-04-25 Meta Platforms Technologies, Llc Micro-display panel for near-eye display
WO2025205907A1 (ja) * 2024-03-27 2025-10-02 ソニーグループ株式会社 発光装置および画像表示装置
CN118248808B (zh) * 2024-04-02 2026-03-13 上海显耀显示科技股份有限公司 微显示面板、显示模组及其形成方法、电子设备
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CN119907413B (zh) * 2024-11-15 2026-01-27 合肥维信诺科技有限公司 显示面板及显示装置
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