JP2023507820A5 - - Google Patents

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Publication number
JP2023507820A5
JP2023507820A5 JP2022538374A JP2022538374A JP2023507820A5 JP 2023507820 A5 JP2023507820 A5 JP 2023507820A5 JP 2022538374 A JP2022538374 A JP 2022538374A JP 2022538374 A JP2022538374 A JP 2022538374A JP 2023507820 A5 JP2023507820 A5 JP 2023507820A5
Authority
JP
Japan
Prior art keywords
transferring
material layer
adhesive material
micro
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022538374A
Other languages
English (en)
Japanese (ja)
Other versions
JP2023507820A (ja
Filing date
Publication date
Priority claimed from US17/122,995 external-priority patent/US11521887B2/en
Application filed filed Critical
Publication of JP2023507820A publication Critical patent/JP2023507820A/ja
Publication of JP2023507820A5 publication Critical patent/JP2023507820A5/ja
Pending legal-status Critical Current

Links

JP2022538374A 2019-12-18 2020-12-16 マイクロｌｅｄの転写方法およびマイクロｌｅｄの転写装置 Pending JP2023507820A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201962949701P 2019-12-18 2019-12-18
US62/949,701 2019-12-18
US17/122,995 2020-12-15
US17/122,995 US11521887B2 (en) 2019-12-18 2020-12-15 Method of transferring micro LED and micro LED transferring apparatus
PCT/KR2020/018414 WO2021125775A1 (ko) 2019-12-18 2020-12-16 마이크로 엘이디 전사 방법 및 마이크로 엘이디 전사 장치

Publications (2)

Publication Number Publication Date
JP2023507820A JP2023507820A (ja) 2023-02-27
JP2023507820A5 true JP2023507820A5 (https=) 2023-12-22

Family

ID=76253011

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022538374A Pending JP2023507820A (ja) 2019-12-18 2020-12-16 マイクロｌｅｄの転写方法およびマイクロｌｅｄの転写装置

Country Status (4)

Country Link
EP (1) EP4080550A4 (https=)
JP (1) JP2023507820A (https=)
KR (1) KR20220116182A (https=)
CN (2) CN114902387A (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113764546A (zh) * 2021-08-30 2021-12-07 东莞市中麒光电技术有限公司 一种Mini-LED器件、LED显示模块及其制作方法
CN115763644A (zh) * 2022-11-17 2023-03-07 闻泰通讯股份有限公司 芯片转移方法
WO2024203435A1 (ja) * 2023-03-29 2024-10-03 東レ株式会社 転写用積層体の製造方法、転写用積層体および半導体装置の製造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2780954B1 (en) * 2011-11-18 2019-10-16 Apple Inc. Method of forming a micro led structure
CN105493297B (zh) * 2015-05-21 2018-09-11 歌尔股份有限公司 微发光二极管的转移方法、制造方法、装置和电子设备
US10141287B2 (en) * 2015-07-14 2018-11-27 Goertek, Inc. Transferring method, manufacturing method, device and electronic apparatus of micro-LED
WO2017028207A1 (en) * 2015-08-18 2017-02-23 Goertek.Inc Pre-screening method, manufacturing method, device and electronic apparatus of micro-led
US10181546B2 (en) * 2015-11-04 2019-01-15 Goertek.Inc Transferring method, manufacturing method, device and electronic apparatus of micro-LED
US10325893B2 (en) * 2016-12-13 2019-06-18 Hong Kong Beida Jade Bird Display Limited Mass transfer of micro structures using adhesives
KR20180075310A (ko) * 2016-12-26 2018-07-04 주식회사 엘지화학 마이크로 전기 소자의 전사 방법
JP2019015899A (ja) * 2017-07-10 2019-01-31 株式会社ブイ・テクノロジー 表示装置の製造方法、チップ部品の転写方法、および転写部材
TWI648871B (zh) * 2017-09-22 2019-01-21 台灣愛司帝科技股份有限公司 發光模組的製作方法
JP6990577B2 (ja) * 2017-12-22 2022-01-12 東レエンジニアリング株式会社 実装方法および実装装置
CN108962789A (zh) * 2018-06-25 2018-12-07 开发晶照明（厦门）有限公司 微器件转移方法和微器件转移设备

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