JP2023503634A - 半導体デバイス、プリント回路基板(pcb)、および電池管理システム(bms)における、パワー半導体デバイス(mosfet)の制御ピン(ゲートピン)をプリント回路基板(pcb)にインターフェースする方法 - Google Patents
半導体デバイス、プリント回路基板(pcb)、および電池管理システム(bms)における、パワー半導体デバイス(mosfet)の制御ピン(ゲートピン)をプリント回路基板(pcb)にインターフェースする方法 Download PDFInfo
- Publication number
- JP2023503634A JP2023503634A JP2022531061A JP2022531061A JP2023503634A JP 2023503634 A JP2023503634 A JP 2023503634A JP 2022531061 A JP2022531061 A JP 2022531061A JP 2022531061 A JP2022531061 A JP 2022531061A JP 2023503634 A JP2023503634 A JP 2023503634A
- Authority
- JP
- Japan
- Prior art keywords
- gate
- printed circuit
- bms
- mosfet
- battery management
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 63
- 238000000034 method Methods 0.000 title claims description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 65
- 229910052802 copper Inorganic materials 0.000 claims abstract description 65
- 239000010949 copper Substances 0.000 claims abstract description 65
- 239000002184 metal Substances 0.000 claims abstract description 18
- 229910052751 metal Inorganic materials 0.000 claims abstract description 18
- 239000004020 conductor Substances 0.000 claims abstract description 10
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 claims description 11
- 229910001416 lithium ion Inorganic materials 0.000 claims description 11
- 239000013013 elastic material Substances 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 238000005476 soldering Methods 0.000 description 5
- 230000035939 shock Effects 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 239000011810 insulating material Substances 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002631 room-temperature vulcanizate silicone Polymers 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49548—Cross section geometry
- H01L23/49551—Cross section geometry characterised by bent parts
- H01L23/49555—Cross section geometry characterised by bent parts the bent parts being the outer leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
- H01M10/425—Structural combination with electronic components, e.g. electronic circuits integrated to the outside of the casing
- H01M10/4257—Smart batteries, e.g. electronic circuits inside the housing of the cells or batteries
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/50—Current conducting connections for cells or batteries
- H01M50/502—Interconnectors for connecting terminals of adjacent batteries; Interconnectors for connecting cells outside a battery casing
- H01M50/519—Interconnectors for connecting terminals of adjacent batteries; Interconnectors for connecting cells outside a battery casing comprising printed circuit boards [PCB]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
- H05K3/3426—Leaded components characterised by the leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
- H01M10/425—Structural combination with electronic components, e.g. electronic circuits integrated to the outside of the casing
- H01M2010/4271—Battery management systems including electronic circuits, e.g. control of current or voltage to keep battery in healthy state, cell balancing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10166—Transistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10287—Metal wires as connectors or conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10439—Position of a single component
- H05K2201/10492—Electrically connected to another device
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10628—Leaded surface mounted device
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10659—Different types of terminals for the same component, e.g. solder balls combined with leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/10757—Bent leads
- H05K2201/10772—Leads of a surface mounted component bent for providing a gap between the lead and the pad during soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/049—Wire bonding
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Chemical & Material Sciences (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Geometry (AREA)
- Battery Mounting, Suspending (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Multi-Conductor Connections (AREA)
- Electronic Switches (AREA)
- Connection Of Batteries Or Terminals (AREA)
- Charge And Discharge Circuits For Batteries Or The Like (AREA)
- Secondary Cells (AREA)
Abstract
Description
Claims (16)
- 電池管理システム(BMS)のプリント回路基板(PCB)と共に使用するためのMOSFETデバイスであって、
半導体本体と、
前記半導体本体の側面から外側に延在する金属導体と、
前記半導体本体の少なくとも1つの側面から外側に延在する複数の電源ピンであって、下方に屈曲された先端部を有する、複数の電源ピンと、
前記半導体本体の少なくとも1つの側面から外側に延在するゲートピンとを含み、
前記ゲートピンの前記先端部は、離間した銅板のうちの1つとの電気的接触を回避するように、前記電源ピンの前記先端部に対して隆起または上昇し、
前記ゲートピンの前記先端部は、前記電池管理システム(BMS)の回路に接続される、MOSFETデバイス。 - 前記ゲートピンは、直線状のゲートピンである、請求項1に記載のデバイス。
- 前記電源ピンが完全に屈曲した構成を有し、前記ゲートピンが部分的に屈曲した構成を有する、請求項1に記載のデバイス。
- 前記電源ピンの前記先端部の下面は、前記半導体本体の下面と同一平面内に位置する、請求項1に記載のデバイス。
- 前記ゲートピンは、前記ゲートピンを前記電池管理システム(BMS)の回路に接続するために前記プリント回路基板(PCB)のトレースに接続される、請求項1に記載のデバイス。
- 前記ゲートピンは、コネクタワイヤによって前記プリント回路基板の前記トレースに接続されている、請求項5に記載のデバイス。
- 前記ゲートピンは、前記ゲートピンを前記電池管理システム(BMS)の回路に接続するために前記プリント回路基板(PCB)に接続されたゲートプリント回路基板に接続される、請求項1に記載のデバイス。
- リチウムイオン電池の電池管理システム(BMS)と共に使用するためのプリント回路基板(PCB)デバイスであって、
離間した銅板を有するプリント回路基板、および
前記銅板を橋絡する複数のMOSFETであって、
半導体本体と、
前記半導体本体の少なくとも1つの側面から外側に延在する複数の電源ピンであって、下方に屈曲され、前記離間した銅板のうちの1つに接続された先端部を有する、複数の電源ピンと、
前記半導体本体の少なくとも1つの側面から外側に延在するゲートピンであって、前記電池管理システム(BMS)の回路に接続されるゲートピンと
を各々が含む複数のMOSFET
を含み、
前記ゲートピンの前記先端部は、前記離間した銅板のうちの前記1つとの電気的接触を回避するように、前記電源ピンの前記先端部に対して隆起または上昇しており、
前記ゲートピンの前記先端部は、前記電池管理システム(BMS)の回路に接続される、デバイス。 - 前記ゲートピンは、直線状のゲートピンである、請求項8に記載のデバイス。
- 前記ゲートピンは、部分的に屈曲したゲートピンである、請求項8に記載のデバイス。
- 電池管理システム(BMS)のプリント回路基板(PCB)にMOSFETを接続する方法であって、
MOSFETのゲートピンの先端部を、前記MOSFETの電源ピンの先端部に対して隆起または上昇した位置に配置するステップと、
前記電池管理システム(BMS)のプリント回路基板(PCB)上に位置する一対の離間した銅板を橋絡する前記MOSFETを設置するステップであって、前記電源ピンの前記先端部が前記離間した銅板のうちの1つに接続され、前記MOSFETの金属コネクタが前記離間した銅板のうちの他方に接続される、設置するステップと、
前記ゲートピンの前記隆起または上昇した先端部を前記電池管理システム(BMS)の回路に電気的に接続するステップと、を含む方法。 - 前記MOSFETの前記電源ピンが屈曲しており、前記MOSFETの前記ゲートピンが、隆起または上昇した先端部を有する直線状のゲートピンである、請求項11に記載の方法。
- 前記MOSFETの前記電源ピンが屈曲しており、前記MOSFETの前記ゲートピンが、隆起または上昇した先端部を有する部分的に屈曲した、ゲートピンである、請求項11に記載の方法。
- 前記ゲートピンは、接続ワイヤを用いて前記電池管理システム(BMS)の前記回路に電気的に接続される、請求項11に記載の方法。
- 前記ゲートピンは、ゲートプリント回路基板(PCB)を用いて前記電池管理システム(BMS)の前記回路に電気的に接続される、請求項11に記載の方法。
- 前記ゲートピンと前記電池管理システム(BMS)の前記回路との接続が、前記ゲートピンの前記接続と前記プリント回路基板(PCB)の表面との間に弾性材料を備えることによって、機械的に安定化される、請求項11に記載の方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2023214360A JP2024041768A (ja) | 2019-11-27 | 2023-12-20 | 半導体デバイス、プリント回路基板(pcb)、および電池管理システム(bms)における、パワー半導体デバイス(mosfet)の制御ピン(ゲートピン)をプリント回路基板(pcb)にインターフェースする方法 |
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201962941275P | 2019-11-27 | 2019-11-27 | |
US29/715,105 | 2019-11-27 | ||
US62/941,275 | 2019-11-27 | ||
US29/715,103 | 2019-11-27 | ||
US29/715,103 USD920264S1 (en) | 2019-11-27 | 2019-11-27 | Semiconductor device |
US29/715,105 USD932452S1 (en) | 2019-11-27 | 2019-11-27 | Semiconductor device |
PCT/US2020/062417 WO2021108706A1 (en) | 2019-11-27 | 2020-11-25 | Semiconductor device, printed circuit board (pcb), and method of interfacing control pin (gate pin) of a power semiconductor device (mosfet) to a printed circuit board (pcb) in a battery management system (bms) |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023214360A Division JP2024041768A (ja) | 2019-11-27 | 2023-12-20 | 半導体デバイス、プリント回路基板(pcb)、および電池管理システム(bms)における、パワー半導体デバイス(mosfet)の制御ピン(ゲートピン)をプリント回路基板(pcb)にインターフェースする方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2023503634A true JP2023503634A (ja) | 2023-01-31 |
JP7408804B2 JP7408804B2 (ja) | 2024-01-05 |
Family
ID=76129990
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022531061A Active JP7408804B2 (ja) | 2019-11-27 | 2020-11-25 | 半導体デバイス、プリント回路基板(pcb)、および電池管理システム(bms)における、パワー半導体デバイス(mosfet)の制御ピン(ゲートピン)をプリント回路基板(pcb)にインターフェースする方法 |
JP2023214360A Pending JP2024041768A (ja) | 2019-11-27 | 2023-12-20 | 半導体デバイス、プリント回路基板(pcb)、および電池管理システム(bms)における、パワー半導体デバイス(mosfet)の制御ピン(ゲートピン)をプリント回路基板(pcb)にインターフェースする方法 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023214360A Pending JP2024041768A (ja) | 2019-11-27 | 2023-12-20 | 半導体デバイス、プリント回路基板(pcb)、および電池管理システム(bms)における、パワー半導体デバイス(mosfet)の制御ピン(ゲートピン)をプリント回路基板(pcb)にインターフェースする方法 |
Country Status (7)
Country | Link |
---|---|
JP (2) | JP7408804B2 (ja) |
CN (1) | CN114830439A (ja) |
AU (2) | AU2020393921B2 (ja) |
CA (1) | CA3163239A1 (ja) |
GB (1) | GB2605306A (ja) |
MX (1) | MX2022006313A (ja) |
WO (1) | WO2021108706A1 (ja) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003234442A (ja) * | 2002-02-06 | 2003-08-22 | Hitachi Ltd | 半導体装置及びその製造方法 |
JP2010087032A (ja) * | 2008-09-29 | 2010-04-15 | Tdk-Lambda Corp | 電子機器 |
US20140354238A1 (en) * | 2013-06-01 | 2014-12-04 | Fairchild Semiconductor Corporation | System for Battery Management and Protection |
JP2017212446A (ja) * | 2016-05-25 | 2017-11-30 | デルフィ・インターナショナル・オペレーションズ・ルクセンブルク・エス・アー・エール・エル | パワー整流モジュール |
WO2018180255A1 (ja) * | 2017-03-28 | 2018-10-04 | ローム株式会社 | 半導体装置および半導体装置の製造方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3846823A (en) * | 1971-08-05 | 1974-11-05 | Lucerne Products Inc | Semiconductor assembly |
JP3871486B2 (ja) * | 1999-02-17 | 2007-01-24 | 株式会社ルネサステクノロジ | 半導体装置 |
US7540788B2 (en) * | 2007-01-05 | 2009-06-02 | Apple Inc. | Backward compatible connector system |
US7875962B2 (en) * | 2007-10-15 | 2011-01-25 | Power Integrations, Inc. | Package for a power semiconductor device |
US9660244B2 (en) * | 2013-09-06 | 2017-05-23 | Johnson Controls Technology Company | System and method for establishing connections of a battery module |
-
2020
- 2020-11-25 CA CA3163239A patent/CA3163239A1/en active Pending
- 2020-11-25 MX MX2022006313A patent/MX2022006313A/es unknown
- 2020-11-25 GB GB2207806.7A patent/GB2605306A/en active Pending
- 2020-11-25 WO PCT/US2020/062417 patent/WO2021108706A1/en unknown
- 2020-11-25 CN CN202080081824.XA patent/CN114830439A/zh active Pending
- 2020-11-25 JP JP2022531061A patent/JP7408804B2/ja active Active
- 2020-11-25 AU AU2020393921A patent/AU2020393921B2/en active Active
-
2023
- 2023-07-06 AU AU2023204342A patent/AU2023204342A1/en active Pending
- 2023-12-20 JP JP2023214360A patent/JP2024041768A/ja active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003234442A (ja) * | 2002-02-06 | 2003-08-22 | Hitachi Ltd | 半導体装置及びその製造方法 |
JP2010087032A (ja) * | 2008-09-29 | 2010-04-15 | Tdk-Lambda Corp | 電子機器 |
US20140354238A1 (en) * | 2013-06-01 | 2014-12-04 | Fairchild Semiconductor Corporation | System for Battery Management and Protection |
JP2017212446A (ja) * | 2016-05-25 | 2017-11-30 | デルフィ・インターナショナル・オペレーションズ・ルクセンブルク・エス・アー・エール・エル | パワー整流モジュール |
WO2018180255A1 (ja) * | 2017-03-28 | 2018-10-04 | ローム株式会社 | 半導体装置および半導体装置の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
MX2022006313A (es) | 2022-06-22 |
CN114830439A (zh) | 2022-07-29 |
AU2020393921A1 (en) | 2022-06-09 |
CA3163239A1 (en) | 2021-06-03 |
GB202207806D0 (en) | 2022-07-13 |
AU2023204342A1 (en) | 2023-07-27 |
WO2021108706A1 (en) | 2021-06-03 |
JP7408804B2 (ja) | 2024-01-05 |
GB2605306A (en) | 2022-09-28 |
AU2020393921B2 (en) | 2023-04-06 |
JP2024041768A (ja) | 2024-03-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP7308289B2 (ja) | 傾斜配置を有するリチウムイオン電池管理システム(bms) | |
US8238108B2 (en) | Power semiconductor module system | |
KR101991917B1 (ko) | 모터 차량들을 위한 회로 배치 및 회로 배치의 이용 | |
CN104021933B (zh) | 电子部件和电子控制单元 | |
RU2585887C1 (ru) | Компоновка электронного блока питания | |
CN103872036A (zh) | 半导体模块及其制造方法 | |
CN102570404A (zh) | 电池单元保护电路模块和辅助印刷电路板 | |
JP5666090B2 (ja) | エネルギー蓄積組立品用相互接続システム | |
US9966212B2 (en) | Blinking device | |
JP6739642B2 (ja) | バッテリセルの電気的に固定された接続のための基板およびバッテリ | |
US7936571B2 (en) | Protection circuit module for secondary battery | |
JP2009501413A5 (ja) | ||
JPWO2008087875A1 (ja) | モータ制御装置 | |
JP7408804B2 (ja) | 半導体デバイス、プリント回路基板(pcb)、および電池管理システム(bms)における、パワー半導体デバイス(mosfet)の制御ピン(ゲートピン)をプリント回路基板(pcb)にインターフェースする方法 | |
US20220399256A1 (en) | Semiconductor device, printed circuit board (pcb), and method of interfacing control pin (gate pin) of a power semiconductor device (mosfet) to a printed circuit board (pcb) in a battery management system (bms) | |
EP4066317A1 (en) | Semiconductor device, printed circuit board (pcb), and method of interfacing control pin (gate pin) of a power semiconductor device (mosfet) to a printed circuit board (pcb) in a battery management system (bms) | |
RU2302686C2 (ru) | Силовой полупроводниковый модуль | |
KR20200090627A (ko) | 전지 시스템용 회로 캐리어 및 전지 시스템 | |
JP6452402B2 (ja) | 蓄電装置 | |
US10103096B2 (en) | Semiconductor device | |
US10944191B1 (en) | Offset ;lug connector on a board connection area | |
JP2001237368A (ja) | パワーモジュール | |
US11081828B2 (en) | Power module housing | |
CN110504818B (zh) | 一种点电源模块及电源组件 | |
EP4191801A1 (en) | Circuit board with high power interconnect conductive coil |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20220713 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20230627 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20230630 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20230925 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20231121 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20231220 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 7408804 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |