JP2023154115A5 - - Google Patents
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- JP2023154115A5 JP2023154115A5 JP2022063186A JP2022063186A JP2023154115A5 JP 2023154115 A5 JP2023154115 A5 JP 2023154115A5 JP 2022063186 A JP2022063186 A JP 2022063186A JP 2022063186 A JP2022063186 A JP 2022063186A JP 2023154115 A5 JP2023154115 A5 JP 2023154115A5
- Authority
- JP
- Japan
- Prior art keywords
- thermally conductive
- conductive composition
- composition according
- component
- filler
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022063186A JP7778030B2 (ja) | 2022-04-06 | 2022-04-06 | 熱伝導性組成物および該組成物を使用する熱伝導性部材の製造方法 |
| KR1020247033137A KR20240157081A (ko) | 2022-04-06 | 2023-03-14 | 열전도성 조성물 및 상기 조성물을 사용한 열전도성 구성요소의 생산 방법 |
| US18/837,902 US20250145826A1 (en) | 2022-04-06 | 2023-03-14 | Thermally conductive composition and a production method of a thermal conductive component using the composition |
| CN202380032576.3A CN118974172A (zh) | 2022-04-06 | 2023-03-14 | 导热组合物和使用该组合物的导热组件的生产方法 |
| PCT/EP2023/056503 WO2023194054A1 (en) | 2022-04-06 | 2023-03-14 | Thermally conductive composition and a production method of a thermal conductive component using the composition |
| EP23711721.3A EP4504835A1 (en) | 2022-04-06 | 2023-03-14 | Thermally conductive composition and a production method of a thermal conductive component using the composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022063186A JP7778030B2 (ja) | 2022-04-06 | 2022-04-06 | 熱伝導性組成物および該組成物を使用する熱伝導性部材の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2023154115A JP2023154115A (ja) | 2023-10-19 |
| JP2023154115A5 true JP2023154115A5 (cg-RX-API-DMAC7.html) | 2025-03-11 |
| JP7778030B2 JP7778030B2 (ja) | 2025-12-01 |
Family
ID=85703714
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022063186A Active JP7778030B2 (ja) | 2022-04-06 | 2022-04-06 | 熱伝導性組成物および該組成物を使用する熱伝導性部材の製造方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20250145826A1 (cg-RX-API-DMAC7.html) |
| EP (1) | EP4504835A1 (cg-RX-API-DMAC7.html) |
| JP (1) | JP7778030B2 (cg-RX-API-DMAC7.html) |
| KR (1) | KR20240157081A (cg-RX-API-DMAC7.html) |
| CN (1) | CN118974172A (cg-RX-API-DMAC7.html) |
| WO (1) | WO2023194054A1 (cg-RX-API-DMAC7.html) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP4410899A4 (en) * | 2021-09-30 | 2025-04-09 | Wacker Chemie AG | Thermally conductive silicone composition and method for producing gap filler using said composition |
| CN118931185A (zh) * | 2024-07-30 | 2024-11-12 | 东莞市鸿亿导热材料有限公司 | 一种高导热高弹性的导热硅胶及其制备方法和应用 |
| WO2026105522A1 (ja) * | 2024-11-12 | 2026-05-21 | 信越化学工業株式会社 | 熱伝導性硬化型シリコーン組成物及びその硬化方法 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5853989B2 (ja) | 2013-05-16 | 2016-02-09 | 信越化学工業株式会社 | リアクトル用熱伝導性シリコーン接着剤組成物及びリアクトル |
| CN106589954B (zh) * | 2017-02-13 | 2020-04-21 | 成都硅宝科技股份有限公司 | 低粘度阻燃室温硫化泡沫硅橡胶及其制备方法 |
| WO2019120924A1 (en) | 2017-12-20 | 2019-06-27 | Henkel Ag & Co. Kgaa | Thermally conductive polyurethane adhesive with exceptional combination of mechanical properties |
| JP7120783B2 (ja) * | 2018-03-27 | 2022-08-17 | 積水化学工業株式会社 | 熱伝導性熱膨張性部材 |
| DE112019002449T5 (de) | 2018-05-14 | 2021-02-11 | 3M Innovative Properties Company | Wärmeleitfähige spaltfüllstoffmaterialien mit kontrollierter härtung |
| US12152146B2 (en) * | 2018-08-15 | 2024-11-26 | 3M Innovative Properties Company | Silicone sealer compositions |
| WO2021128273A1 (en) * | 2019-12-27 | 2021-07-01 | 3M Innovative Properties Company | Two-part siliconecomposition and sealant and assembly made therefrom |
| KR102899588B1 (ko) * | 2020-07-02 | 2025-12-11 | 와커 헤미 아게 | 발포성 실리콘 조성물 |
| CN115885381A (zh) * | 2020-08-21 | 2023-03-31 | 陶氏东丽株式会社 | 固化性聚有机硅氧烷组合物、导热性构件以及散热结构体 |
-
2022
- 2022-04-06 JP JP2022063186A patent/JP7778030B2/ja active Active
-
2023
- 2023-03-14 KR KR1020247033137A patent/KR20240157081A/ko active Pending
- 2023-03-14 WO PCT/EP2023/056503 patent/WO2023194054A1/en not_active Ceased
- 2023-03-14 US US18/837,902 patent/US20250145826A1/en active Pending
- 2023-03-14 EP EP23711721.3A patent/EP4504835A1/en active Pending
- 2023-03-14 CN CN202380032576.3A patent/CN118974172A/zh active Pending
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