JP7778030B2 - 熱伝導性組成物および該組成物を使用する熱伝導性部材の製造方法 - Google Patents

熱伝導性組成物および該組成物を使用する熱伝導性部材の製造方法

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Publication number
JP7778030B2
JP7778030B2 JP2022063186A JP2022063186A JP7778030B2 JP 7778030 B2 JP7778030 B2 JP 7778030B2 JP 2022063186 A JP2022063186 A JP 2022063186A JP 2022063186 A JP2022063186 A JP 2022063186A JP 7778030 B2 JP7778030 B2 JP 7778030B2
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Japan
Prior art keywords
thermally conductive
component
conductive composition
mass
filler
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022063186A
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English (en)
Japanese (ja)
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JP2023154115A5 (cg-RX-API-DMAC7.html
JP2023154115A (ja
Inventor
俊介 山田
和哉 酒井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wacker Asahikasei Silicone Co Ltd
Original Assignee
Wacker Asahikasei Silicone Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2022063186A priority Critical patent/JP7778030B2/ja
Application filed by Wacker Asahikasei Silicone Co Ltd filed Critical Wacker Asahikasei Silicone Co Ltd
Priority to PCT/EP2023/056503 priority patent/WO2023194054A1/en
Priority to KR1020247033137A priority patent/KR20240157081A/ko
Priority to US18/837,902 priority patent/US20250145826A1/en
Priority to CN202380032576.3A priority patent/CN118974172A/zh
Priority to EP23711721.3A priority patent/EP4504835A1/en
Publication of JP2023154115A publication Critical patent/JP2023154115A/ja
Publication of JP2023154115A5 publication Critical patent/JP2023154115A5/ja
Application granted granted Critical
Publication of JP7778030B2 publication Critical patent/JP7778030B2/ja
Active legal-status Critical Current
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2022063186A 2022-04-06 2022-04-06 熱伝導性組成物および該組成物を使用する熱伝導性部材の製造方法 Active JP7778030B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2022063186A JP7778030B2 (ja) 2022-04-06 2022-04-06 熱伝導性組成物および該組成物を使用する熱伝導性部材の製造方法
KR1020247033137A KR20240157081A (ko) 2022-04-06 2023-03-14 열전도성 조성물 및 상기 조성물을 사용한 열전도성 구성요소의 생산 방법
US18/837,902 US20250145826A1 (en) 2022-04-06 2023-03-14 Thermally conductive composition and a production method of a thermal conductive component using the composition
CN202380032576.3A CN118974172A (zh) 2022-04-06 2023-03-14 导热组合物和使用该组合物的导热组件的生产方法
PCT/EP2023/056503 WO2023194054A1 (en) 2022-04-06 2023-03-14 Thermally conductive composition and a production method of a thermal conductive component using the composition
EP23711721.3A EP4504835A1 (en) 2022-04-06 2023-03-14 Thermally conductive composition and a production method of a thermal conductive component using the composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2022063186A JP7778030B2 (ja) 2022-04-06 2022-04-06 熱伝導性組成物および該組成物を使用する熱伝導性部材の製造方法

Publications (3)

Publication Number Publication Date
JP2023154115A JP2023154115A (ja) 2023-10-19
JP2023154115A5 JP2023154115A5 (cg-RX-API-DMAC7.html) 2025-03-11
JP7778030B2 true JP7778030B2 (ja) 2025-12-01

Family

ID=85703714

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022063186A Active JP7778030B2 (ja) 2022-04-06 2022-04-06 熱伝導性組成物および該組成物を使用する熱伝導性部材の製造方法

Country Status (6)

Country Link
US (1) US20250145826A1 (cg-RX-API-DMAC7.html)
EP (1) EP4504835A1 (cg-RX-API-DMAC7.html)
JP (1) JP7778030B2 (cg-RX-API-DMAC7.html)
KR (1) KR20240157081A (cg-RX-API-DMAC7.html)
CN (1) CN118974172A (cg-RX-API-DMAC7.html)
WO (1) WO2023194054A1 (cg-RX-API-DMAC7.html)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4410899A4 (en) * 2021-09-30 2025-04-09 Wacker Chemie AG Thermally conductive silicone composition and method for producing gap filler using said composition
CN118931185A (zh) * 2024-07-30 2024-11-12 东莞市鸿亿导热材料有限公司 一种高导热高弹性的导热硅胶及其制备方法和应用
WO2026105522A1 (ja) * 2024-11-12 2026-05-21 信越化学工業株式会社 熱伝導性硬化型シリコーン組成物及びその硬化方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106589954A (zh) 2017-02-13 2017-04-26 成都硅宝科技股份有限公司 低粘度阻燃室温硫化泡沫硅橡胶及其制备方法
JP2019172762A (ja) 2018-03-27 2019-10-10 積水化学工業株式会社 熱伝導性熱膨張性部材
CN112566983A (zh) 2018-08-15 2021-03-26 3M创新有限公司 有机硅密封剂组合物
WO2022000413A1 (en) 2020-07-02 2022-01-06 Wacker Chemie Ag Foamable silicone composition
WO2022038888A1 (ja) 2020-08-21 2022-02-24 ダウ・東レ株式会社 硬化性オルガノポリシロキサン組成物、熱伝導性部材および放熱構造体
JP2023500163A (ja) 2019-12-27 2023-01-04 スリーエム イノベイティブ プロパティズ カンパニー ２剤型シリコーン組成物並びにそれから作製されるシーラント及びアセンブリ

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5853989B2 (ja) 2013-05-16 2016-02-09 信越化学工業株式会社 リアクトル用熱伝導性シリコーン接着剤組成物及びリアクトル
WO2019120924A1 (en) 2017-12-20 2019-06-27 Henkel Ag & Co. Kgaa Thermally conductive polyurethane adhesive with exceptional combination of mechanical properties
DE112019002449T5 (de) 2018-05-14 2021-02-11 3M Innovative Properties Company Wärmeleitfähige spaltfüllstoffmaterialien mit kontrollierter härtung

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106589954A (zh) 2017-02-13 2017-04-26 成都硅宝科技股份有限公司 低粘度阻燃室温硫化泡沫硅橡胶及其制备方法
JP2019172762A (ja) 2018-03-27 2019-10-10 積水化学工業株式会社 熱伝導性熱膨張性部材
CN112566983A (zh) 2018-08-15 2021-03-26 3M创新有限公司 有机硅密封剂组合物
JP2023500163A (ja) 2019-12-27 2023-01-04 スリーエム イノベイティブ プロパティズ カンパニー ２剤型シリコーン組成物並びにそれから作製されるシーラント及びアセンブリ
WO2022000413A1 (en) 2020-07-02 2022-01-06 Wacker Chemie Ag Foamable silicone composition
WO2022038888A1 (ja) 2020-08-21 2022-02-24 ダウ・東レ株式会社 硬化性オルガノポリシロキサン組成物、熱伝導性部材および放熱構造体

Also Published As

Publication number Publication date
US20250145826A1 (en) 2025-05-08
KR20240157081A (ko) 2024-10-31
EP4504835A1 (en) 2025-02-12
JP2023154115A (ja) 2023-10-19
CN118974172A (zh) 2024-11-15
WO2023194054A1 (en) 2023-10-12

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