CN118974172A - 导热组合物和使用该组合物的导热组件的生产方法 - Google Patents

导热组合物和使用该组合物的导热组件的生产方法 Download PDF

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Publication number
CN118974172A
CN118974172A CN202380032576.3A CN202380032576A CN118974172A CN 118974172 A CN118974172 A CN 118974172A CN 202380032576 A CN202380032576 A CN 202380032576A CN 118974172 A CN118974172 A CN 118974172A
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CN
China
Prior art keywords
component
thermally conductive
conductive composition
mass
heat
Prior art date
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Pending
Application number
CN202380032576.3A
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English (en)
Chinese (zh)
Inventor
酒井和哉
山田俊介
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Wacker Chemie AG
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Wacker Chemie AG
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Filing date
Publication date
Application filed by Wacker Chemie AG filed Critical Wacker Chemie AG
Publication of CN118974172A publication Critical patent/CN118974172A/zh
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN202380032576.3A 2022-04-06 2023-03-14 导热组合物和使用该组合物的导热组件的生产方法 Pending CN118974172A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022063186A JP7778030B2 (ja) 2022-04-06 2022-04-06 熱伝導性組成物および該組成物を使用する熱伝導性部材の製造方法
JP2022-063186 2022-04-06
PCT/EP2023/056503 WO2023194054A1 (en) 2022-04-06 2023-03-14 Thermally conductive composition and a production method of a thermal conductive component using the composition

Publications (1)

Publication Number Publication Date
CN118974172A true CN118974172A (zh) 2024-11-15

Family

ID=85703714

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380032576.3A Pending CN118974172A (zh) 2022-04-06 2023-03-14 导热组合物和使用该组合物的导热组件的生产方法

Country Status (6)

Country Link
US (1) US20250145826A1 (cg-RX-API-DMAC7.html)
EP (1) EP4504835A1 (cg-RX-API-DMAC7.html)
JP (1) JP7778030B2 (cg-RX-API-DMAC7.html)
KR (1) KR20240157081A (cg-RX-API-DMAC7.html)
CN (1) CN118974172A (cg-RX-API-DMAC7.html)
WO (1) WO2023194054A1 (cg-RX-API-DMAC7.html)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4410899A4 (en) * 2021-09-30 2025-04-09 Wacker Chemie AG Thermally conductive silicone composition and method for producing gap filler using said composition
CN118931185A (zh) * 2024-07-30 2024-11-12 东莞市鸿亿导热材料有限公司 一种高导热高弹性的导热硅胶及其制备方法和应用
WO2026105522A1 (ja) * 2024-11-12 2026-05-21 信越化学工業株式会社 熱伝導性硬化型シリコーン組成物及びその硬化方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5853989B2 (ja) 2013-05-16 2016-02-09 信越化学工業株式会社 リアクトル用熱伝導性シリコーン接着剤組成物及びリアクトル
CN106589954B (zh) * 2017-02-13 2020-04-21 成都硅宝科技股份有限公司 低粘度阻燃室温硫化泡沫硅橡胶及其制备方法
WO2019120924A1 (en) 2017-12-20 2019-06-27 Henkel Ag & Co. Kgaa Thermally conductive polyurethane adhesive with exceptional combination of mechanical properties
JP7120783B2 (ja) * 2018-03-27 2022-08-17 積水化学工業株式会社 熱伝導性熱膨張性部材
DE112019002449T5 (de) 2018-05-14 2021-02-11 3M Innovative Properties Company Wärmeleitfähige spaltfüllstoffmaterialien mit kontrollierter härtung
US12152146B2 (en) * 2018-08-15 2024-11-26 3M Innovative Properties Company Silicone sealer compositions
WO2021128273A1 (en) * 2019-12-27 2021-07-01 3M Innovative Properties Company Two-part siliconecomposition and sealant and assembly made therefrom
KR102899588B1 (ko) * 2020-07-02 2025-12-11 와커 헤미 아게 발포성 실리콘 조성물
CN115885381A (zh) * 2020-08-21 2023-03-31 陶氏东丽株式会社 固化性聚有机硅氧烷组合物、导热性构件以及散热结构体

Also Published As

Publication number Publication date
US20250145826A1 (en) 2025-05-08
KR20240157081A (ko) 2024-10-31
EP4504835A1 (en) 2025-02-12
JP2023154115A (ja) 2023-10-19
WO2023194054A1 (en) 2023-10-12
JP7778030B2 (ja) 2025-12-01

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