JP2023141616A5 - - Google Patents
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- JP2023141616A5 JP2023141616A5 JP2022048021A JP2022048021A JP2023141616A5 JP 2023141616 A5 JP2023141616 A5 JP 2023141616A5 JP 2022048021 A JP2022048021 A JP 2022048021A JP 2022048021 A JP2022048021 A JP 2022048021A JP 2023141616 A5 JP2023141616 A5 JP 2023141616A5
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Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022048021A JP7757223B2 (ja) | 2022-03-24 | 2022-03-24 | メモリデバイス |
| TW111130066A TWI834241B (zh) | 2022-03-24 | 2022-08-10 | 記憶裝置 |
| US17/822,248 US12388031B2 (en) | 2022-03-24 | 2022-08-25 | Memory device |
| CN202211070105.5A CN116867274A (zh) | 2022-03-24 | 2022-08-30 | 存储器装置 |
| US19/224,980 US20250293181A1 (en) | 2022-03-24 | 2025-06-02 | Memory device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022048021A JP7757223B2 (ja) | 2022-03-24 | 2022-03-24 | メモリデバイス |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2023141616A JP2023141616A (ja) | 2023-10-05 |
| JP2023141616A5 true JP2023141616A5 (https=) | 2024-09-26 |
| JP7757223B2 JP7757223B2 (ja) | 2025-10-21 |
Family
ID=88096429
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022048021A Active JP7757223B2 (ja) | 2022-03-24 | 2022-03-24 | メモリデバイス |
Country Status (4)
| Country | Link |
|---|---|
| US (2) | US12388031B2 (https=) |
| JP (1) | JP7757223B2 (https=) |
| CN (1) | CN116867274A (https=) |
| TW (1) | TWI834241B (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20240057523A (ko) * | 2022-10-24 | 2024-05-03 | 삼성전자주식회사 | 반도체 패키지 |
| EP4566095A1 (en) * | 2023-09-25 | 2025-06-11 | Yangtze Memory Technologies Co., Ltd. | Semiconductor device having dummy pad and method for forming the same |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106910746B (zh) * | 2017-03-08 | 2018-06-19 | 长江存储科技有限责任公司 | 一种3d nand存储器件及其制造方法、封装方法 |
| US11114171B2 (en) * | 2017-11-08 | 2021-09-07 | Samsung Electronics Co., Ltd. | Non-volatile memory device |
| JP2019153675A (ja) | 2018-03-02 | 2019-09-12 | ルネサスエレクトロニクス株式会社 | 固体撮像装置およびその製造方法 |
| KR102624170B1 (ko) * | 2018-04-30 | 2024-01-12 | 삼성전자주식회사 | 3차원 반도체 메모리 장치 |
| JP7273488B2 (ja) | 2018-12-04 | 2023-05-15 | ソニーセミコンダクタソリューションズ株式会社 | 半導体装置、及び電子機器 |
| US10665607B1 (en) | 2019-01-18 | 2020-05-26 | Sandisk Technologies Llc | Three-dimensional memory device including a deformation-resistant edge seal structure and methods for making the same |
| WO2021003635A1 (en) * | 2019-07-08 | 2021-01-14 | Yangtze Memory Technologies Co., Ltd. | Structure and method for forming capacitors for three-dimensional nand |
| KR102739662B1 (ko) * | 2019-09-02 | 2024-12-10 | 삼성전자주식회사 | 3차원 반도체 메모리 소자 |
| US11233043B2 (en) * | 2019-09-02 | 2022-01-25 | Samsung Electronics Co., Ltd. | Three-dimensional semiconductor memory device |
| JP2021136271A (ja) | 2020-02-25 | 2021-09-13 | キオクシア株式会社 | 半導体装置およびその製造方法 |
| JP2021136320A (ja) | 2020-02-26 | 2021-09-13 | キオクシア株式会社 | 半導体装置およびその製造方法 |
| JP2021150511A (ja) * | 2020-03-19 | 2021-09-27 | キオクシア株式会社 | 半導体記憶装置 |
| JP2022035158A (ja) | 2020-08-20 | 2022-03-04 | キオクシア株式会社 | 半導体記憶装置 |
| JP2022050233A (ja) | 2020-09-17 | 2022-03-30 | キオクシア株式会社 | 半導体記憶装置 |
| KR102942729B1 (ko) * | 2021-05-21 | 2026-03-24 | 삼성전자주식회사 | 반도체 장치 및 이를 포함하는 전자 시스템 |
| US12581930B2 (en) * | 2021-11-29 | 2026-03-17 | Samsung Electronics Co., Ltd. | Semiconductor device including electrodes each having a pad part and electronic system including the same |
| US20230255037A1 (en) * | 2022-02-04 | 2023-08-10 | Samsung Electronics Co., Ltd. | Three-dimensional non-volatile memory device including peripheral circuits |
-
2022
- 2022-03-24 JP JP2022048021A patent/JP7757223B2/ja active Active
- 2022-08-10 TW TW111130066A patent/TWI834241B/zh active
- 2022-08-25 US US17/822,248 patent/US12388031B2/en active Active
- 2022-08-30 CN CN202211070105.5A patent/CN116867274A/zh active Pending
-
2025
- 2025-06-02 US US19/224,980 patent/US20250293181A1/en active Pending
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