JP2023127856A - 基板処理方法、及び基板処理装置 - Google Patents

基板処理方法、及び基板処理装置 Download PDF

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Publication number
JP2023127856A
JP2023127856A JP2022031796A JP2022031796A JP2023127856A JP 2023127856 A JP2023127856 A JP 2023127856A JP 2022031796 A JP2022031796 A JP 2022031796A JP 2022031796 A JP2022031796 A JP 2022031796A JP 2023127856 A JP2023127856 A JP 2023127856A
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JP
Japan
Prior art keywords
nozzle
liquid
substrate
processing liquid
valve
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Pending
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JP2022031796A
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English (en)
Japanese (ja)
Inventor
紘太 谷川
Kota Tanikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Screen Holdings Co Ltd
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Screen Holdings Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Screen Holdings Co Ltd filed Critical Screen Holdings Co Ltd
Priority to JP2022031796A priority Critical patent/JP2023127856A/ja
Priority to PCT/JP2023/006358 priority patent/WO2023167064A1/ja
Priority to TW112107183A priority patent/TW202343630A/zh
Publication of JP2023127856A publication Critical patent/JP2023127856A/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
JP2022031796A 2022-03-02 2022-03-02 基板処理方法、及び基板処理装置 Pending JP2023127856A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2022031796A JP2023127856A (ja) 2022-03-02 2022-03-02 基板処理方法、及び基板処理装置
PCT/JP2023/006358 WO2023167064A1 (ja) 2022-03-02 2023-02-22 基板処理方法、及び基板処理装置
TW112107183A TW202343630A (zh) 2022-03-02 2023-03-01 基板處理方法以及基板處理裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2022031796A JP2023127856A (ja) 2022-03-02 2022-03-02 基板処理方法、及び基板処理装置

Publications (1)

Publication Number Publication Date
JP2023127856A true JP2023127856A (ja) 2023-09-14

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ID=87883565

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JP2022031796A Pending JP2023127856A (ja) 2022-03-02 2022-03-02 基板処理方法、及び基板処理装置

Country Status (3)

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JP (1) JP2023127856A (zh)
TW (1) TW202343630A (zh)
WO (1) WO2023167064A1 (zh)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6502050B2 (ja) * 2014-09-29 2019-04-17 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP7071209B2 (ja) * 2018-05-11 2022-05-18 株式会社Ｓｃｒｅｅｎホールディングス 処理液吐出装置、処理液吐出方法、および基板処理装置
JP7177628B2 (ja) * 2018-08-20 2022-11-24 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法、基板処理装置および基板処理システム

Also Published As

Publication number Publication date
WO2023167064A1 (ja) 2023-09-07
TW202343630A (zh) 2023-11-01

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