JP2023081857A - 液供給ユニット及びこれを含む基板処理装置 - Google Patents
液供給ユニット及びこれを含む基板処理装置 Download PDFInfo
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- 239000007788 liquid Substances 0.000 title claims abstract description 331
- 239000000758 substrate Substances 0.000 title claims abstract description 112
- 238000010438 heat treatment Methods 0.000 claims abstract description 91
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 25
- 239000010453 quartz Substances 0.000 claims abstract description 13
- 238000012545 processing Methods 0.000 claims description 282
- 239000004020 conductor Substances 0.000 claims description 58
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 48
- 238000011084 recovery Methods 0.000 claims description 39
- 239000012212 insulator Substances 0.000 claims description 18
- 235000012239 silicon dioxide Nutrition 0.000 claims description 18
- 239000000853 adhesive Substances 0.000 claims description 14
- 230000001070 adhesive effect Effects 0.000 claims description 14
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- 239000000377 silicon dioxide Substances 0.000 claims description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 239000004332 silver Substances 0.000 claims description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- 229910052681 coesite Inorganic materials 0.000 claims description 3
- 229910052906 cristobalite Inorganic materials 0.000 claims description 3
- 229910002804 graphite Inorganic materials 0.000 claims description 3
- 239000010439 graphite Substances 0.000 claims description 3
- 238000005245 sintering Methods 0.000 claims description 3
- 229910052682 stishovite Inorganic materials 0.000 claims description 3
- 229910052905 tridymite Inorganic materials 0.000 claims description 3
- 238000007599 discharging Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 7
- 230000008878 coupling Effects 0.000 abstract 1
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- 239000000126 substance Substances 0.000 description 12
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- 239000003960 organic solvent Substances 0.000 description 9
- 239000002245 particle Substances 0.000 description 7
- 239000012530 fluid Substances 0.000 description 6
- 230000001965 increasing effect Effects 0.000 description 6
- 238000004140 cleaning Methods 0.000 description 5
- 239000000356 contaminant Substances 0.000 description 5
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 238000009835 boiling Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000002923 metal particle Substances 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- 229910018487 Ni—Cr Inorganic materials 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- VNNRSPGTAMTISX-UHFFFAOYSA-N chromium nickel Chemical compound [Cr].[Ni] VNNRSPGTAMTISX-UHFFFAOYSA-N 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
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- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
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- 238000011069 regeneration method Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000004148 unit process Methods 0.000 description 1
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24H—FLUID HEATERS, e.g. WATER OR AIR HEATERS, HAVING HEAT-GENERATING MEANS, e.g. HEAT PUMPS, IN GENERAL
- F24H1/00—Water heaters, e.g. boilers, continuous-flow heaters or water-storage heaters
- F24H1/10—Continuous-flow heaters, i.e. heaters in which heat is generated only while the water is flowing, e.g. with direct contact of the water with the heating medium
- F24H1/12—Continuous-flow heaters, i.e. heaters in which heat is generated only while the water is flowing, e.g. with direct contact of the water with the heating medium in which the water is kept separate from the heating medium
- F24H1/121—Continuous-flow heaters, i.e. heaters in which heat is generated only while the water is flowing, e.g. with direct contact of the water with the heating medium in which the water is kept separate from the heating medium using electric energy supply
- F24H1/122—Continuous-flow heaters, i.e. heaters in which heat is generated only while the water is flowing, e.g. with direct contact of the water with the heating medium in which the water is kept separate from the heating medium using electric energy supply combined with storage tank
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1042—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material provided with means for heating or cooling the liquid or other fluent material in the supplying means upstream of the applying apparatus
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/18—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor the conductor being embedded in an insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/40—Heating elements having the shape of rods or tubes
- H05B3/42—Heating elements having the shape of rods or tubes non-flexible
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/40—Heating elements having the shape of rods or tubes
- H05B3/42—Heating elements having the shape of rods or tubes non-flexible
- H05B3/46—Heating elements having the shape of rods or tubes non-flexible heating conductor mounted on insulating base
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/40—Heating elements having the shape of rods or tubes
- H05B3/42—Heating elements having the shape of rods or tubes non-flexible
- H05B3/48—Heating elements having the shape of rods or tubes non-flexible heating conductor embedded in insulating material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
- B08B2203/007—Heating the liquid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/013—Heaters using resistive films or coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/016—Heaters using particular connecting means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/021—Heaters specially adapted for heating liquids
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
- H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
- H05B3/145—Carbon only, e.g. carbon black, graphite
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- General Engineering & Computer Science (AREA)
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- Cleaning Or Drying Semiconductors (AREA)
Abstract
Description
610 第1タンク
620 第2タンク
630 液供給源
640 メイン循環ライン
650 内部循環ライン
700 ヒーターモジュール
710 配管
720 発熱体
730 導体端子
740 端子台
750 伝導性接着剤
760 絶縁体
Claims (20)
- 基板を処理する装置であって、
処理空間を有するチャンバと、
前記処理空間で基板を支持して回転させる支持ユニットと、
前記支持ユニットに支持された前記基板で高温の処理液を供給するノズルと、
前記ノズルに前記高温の処理液を供給する液供給ユニットと、を含み、
前記液供給ユニットは、
前記処理液を貯蔵するタンクと、
前記タンクの内部空間から前記ノズルに前記処理液を供給するか、または前記タンクの内部空間へ前記処理液を回収するメイン循環ラインと、
前記メイン循環ラインに接続されて前記ノズルに前記処理液を供給する連結ラインと、を含み、
前記メイン循環ラインには、前記処理液を所定温度で加熱するヒーターモジュールが設置され、
前記ヒーターモジュールは、内部に前記処理液が流れて、石英材質で提供される配管と、前記配管の表面に提供される発熱体と、を含む基板処理装置。 - 前記発熱体は印刷方式で前記配管の表面に提供されることを特徴とする請求項1に記載の基板処理装置。
- 前記ヒーターモジュールは前記配管の表面に提供される導体端子と、前記導体端子上に結合されて外部から電力の印加を受ける端子台を含み、
前記導体端子の少なくとも一部は前記発熱体と接触されることを特徴とする請求項1に記載の基板処理装置。 - 前記発熱体は、
前記配管の表面に接触されて前記配管の長さ方向に延長される第1部分と、前記第1部分から上に延長される第2部分と、前記第2部分から前記配管の長さ方向に延長される第3部分と、を含み、
前記第2部分は前記導体端子の一端部と接触され、
前記第3部分は前記導体端子の表面に接触されることを特徴とする請求項3に記載の基板処理装置。 - 前記ヒーターモジュールは前記発熱体と、前記発熱体の露出された部分を覆う絶縁体と、を含むことを特徴とする請求項4に記載の基板処理装置。
- 前記導体端子と前記端子台は伝導性接着剤を通じて電気的に連結されることを特徴とする請求項3に記載の基板処理装置。
- 前記発熱体と前記導体端子は金属で提供されることを特徴とする請求項6に記載の基板処理装置。
- 前記発熱体はAgPdまたはグラファイト(Graphite)で提供され、
前記導体端子は銀(Ag)で提供され、
前記伝導性接着剤は銀ペースト(Ag sintering)で提供されることを特徴とする請求項7に記載の基板処理装置。 - 前記絶縁体は二酸化珪素(SiO2)で提供されることを特徴とする請求項5に記載の基板処理装置。
- 前記メイン循環ラインは、
前記タンクの内部空間に貯蔵された前記処理液を前記ノズルに供給する供給ラインと、前記ノズルから前記処理液を前記タンクに回収する回収ラインと、を含み、
前記ヒーターモジュールは、前記供給ラインに設置されることを特徴とする請求項1に記載の基板処理装置。 - 前記ヒーターモジュールは前記発熱体の温度を測定する温度センサーを含むことを特徴とする請求項1に記載の基板処理装置。
- 前記液供給ユニットは前記タンクの内部空間に貯蔵された前記処理液を循環させる内部循環ラインを含み、
前記ヒーターモジュールは前記内部循環ラインに設置されることを特徴とする請求項1に記載の基板処理装置。 - 前記処理液はイソプロピルアルコール(Isopropyl Alcohol:IPA)で提供されることを特徴とする請求項1に記載の基板処理装置。
- 基板に処理液を吐出するノズルに前記処理液を供給する液供給ユニットであって、
前記処理液を貯蔵するタンクと、
前記タンクの内部空間から前記ノズルに前記処理液を供給するか、または前記タンクの内部空間に前記処理液を回収するメイン循環ラインと、
前記メイン循環ラインに接続されて前記ノズルに前記処理液を供給する供給ラインと、
前記メイン循環ラインに設置され、前記メイン循環ラインを流れる前記処理液を所定温度で加熱するヒーターモジュールと、を含み、
前記ヒーターモジュールは、
内部に前記処理液が流れて、石英材質で提供される配管と、
前記配管の表面に提供される発熱体と、を含む液供給ユニット。 - 前記ヒーターモジュールは前記配管の表面に提供される導体端子と、前記導体端子の上に結合されて外部から電力の印加を受ける端子台と、を含み、
前記導体端子の少なくとも一部は前記発熱体と接触されることを特徴とする請求項14に記載の液供給ユニット。 - 前記導体端子は前記配管の表面に円筒印刷方式で提供され、
前記導体端子と前記端子台は伝導性接着剤を通じて電気的に連結されることを特徴とする請求項15に記載の液供給ユニット。 - 前記発熱体は、
前記配管の表面に接触されて前記配管の長さ方向に延長される第1部分と、前記第1部分から上に延長される第2部分と、前記第2部分から前記配管の長さ方向に延長される第3部分と、を含み、
前記第2部分は前記導体端子の一端部と接触され、
前記第3部分は前記導体端子の表面に接触されることを特徴とする請求項15に記載の液供給ユニット。 - 前記ヒーターモジュールは前記発熱体と、前記発熱体と前記導体端子の接触部分を覆う絶縁体を含むことを特徴とする請求項15に記載の液供給ユニット。
- 基板を処理する装置であって、
処理空間を有するチャンバと、
前記処理空間で基板を支持して回転させる支持ユニットと、
前記支持ユニットに支持された前記基板に高温の処理液を供給するノズルと、
前記ノズルに前記高温の処理液を供給する液供給ユニットと、を含み、
前記液供給ユニットは、
前記処理液を貯蔵する第1タンクと第2タンクと、
前記第1タンクと前記第2タンクを連結して前記ノズルに前記処理液を供給するか、または前記第1タンクの内部空間または前記第2タンクの内部空間に前記処理液を回収するメイン循環ラインと、
前記第1タンクと前記第2タンクを連結し、前記第1タンクの内部空間または前記第2タンクの内部空間に収容される処理液を加熱する内部循環ラインと、を含み、
前記メイン循環ラインは、
前記メイン循環ラインから分岐されて前記ノズルに前記処理液を供給する供給ラインと、前記メイン循環ラインから分岐されて前記ノズルから前記処理液を前記第1タンクまたは前記第2タンクに回収する回収ラインと、を含み、
前記内部循環ラインは、
前記第1タンクの下壁と前記第2タンクの下壁を連結する下部循環ラインと、前記第1タンクの上壁と前記第2タンクの上壁を連結する上部循環ラインと、前記下部循環ラインと前記上部循環ラインを連結する共有ラインと、を含み、
前記メイン循環ラインの前記供給ラインと前記内部循環ラインの前記共有ラインそれぞれにはその内部を流れる前記処理液を所定温度で加熱するヒーターモジュールが設置され、
前記ヒーターモジュールは、
内部に前記処理液が流れて、石英材質で提供される配管と、
前記配管の表面に印刷方式で提供される発熱体と、
前記配管の表面に印刷方式で提供され、少なくとも一部が前記発熱体と接触される導体端子と、
前記導体端子の上に伝導性接着剤を通じて結合され、外部から電力の印加を受ける端子台と、を含む基板処理装置。 - 前記ヒーターモジュールは前記発熱体の露出される部分を覆う絶縁体を含むことを特徴とする請求項19に記載の基板処理装置。
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