JP5819879B2 - 基板洗浄装置及び基板洗浄方法 - Google Patents
基板洗浄装置及び基板洗浄方法 Download PDFInfo
- Publication number
- JP5819879B2 JP5819879B2 JP2013095894A JP2013095894A JP5819879B2 JP 5819879 B2 JP5819879 B2 JP 5819879B2 JP 2013095894 A JP2013095894 A JP 2013095894A JP 2013095894 A JP2013095894 A JP 2013095894A JP 5819879 B2 JP5819879 B2 JP 5819879B2
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- JP
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- substrate
- housing
- drying
- process chamber
- processing
- Prior art date
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
Description
20 工程処理モジュール、
240 移送チャンバー、
260 第1工程チャンバー、
280 第2工程チャンバー、
300 第1基板洗浄、
320 容器、
340 スピンチャック、
360 乗降ユニット、
380 液供給部材、
400 第2基板洗浄装置、
410 乾燥ハウジング、
430 基板支持部材、
440 ヒーター、
460 ファジーガス供給部材、
470 排気部材、
500 搬送ユニット。
Claims (2)
- 基板に処理液を供給して液処理する第1工程チャンバーと、
前記第1工程チャンバーから前記基板を搬送する搬送ユニットと、
搬送される前記基板を乾燥させる乾燥部材と、を含み、
前記搬送ユニットは、
ベースと、
前記ベース上部に提供され、前記基板が乾燥される空間を提供するハウジングと、
前記基板が支持され、洗浄チャンバーの内部へ前記基板を移動させ得る第1位置と前記ハウジングの内部の前記基板が乾燥される第2位置との間に移動できるように提供されるロボットアームと、を含み、
前記乾燥部材は、前記搬送ユニットの前記ハウジングの内部に提供され、前記ハウジングの内部で前記ロボットアームの移動経路より上部に位置する基板洗浄装置。 - 前記ハウジングは、
ファジーガスを前記ハウジングの内部へ供給させるファジーガス供給部材と、
前記ハウジングの外部へ前記ファジーガス及びフュームを排気させる排気部材と、をさらに含む請求項1に記載の基板洗浄装置。
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20120045851 | 2012-04-30 | ||
KR10-2012-0045851 | 2012-04-30 | ||
KR10-2012-0110149 | 2012-10-04 | ||
KR1020120110149A KR20130122503A (ko) | 2012-04-30 | 2012-10-04 | 기판 세정 장치 및 기판 세정 방법 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015086009A Division JP2015156509A (ja) | 2012-04-30 | 2015-04-20 | 基板洗浄装置及び基板洗浄方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013232650A JP2013232650A (ja) | 2013-11-14 |
JP5819879B2 true JP5819879B2 (ja) | 2015-11-24 |
Family
ID=49462909
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013095894A Active JP5819879B2 (ja) | 2012-04-30 | 2013-04-30 | 基板洗浄装置及び基板洗浄方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20130284209A1 (ja) |
JP (1) | JP5819879B2 (ja) |
CN (1) | CN103377971A (ja) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9984867B2 (en) * | 2014-12-19 | 2018-05-29 | Applied Materials, Inc. | Systems and methods for rinsing and drying substrates |
US20170140975A1 (en) | 2015-11-17 | 2017-05-18 | Semes Co., Ltd. | Spin head, apparatus and method for treating a substrate including the spin head |
CN107293475B (zh) * | 2016-04-01 | 2021-01-01 | 上海新昇半导体科技有限公司 | 减少外延衬底缺陷的形成方法 |
KR102063322B1 (ko) | 2016-05-27 | 2020-01-08 | 세메스 주식회사 | 기판 처리 장치 및 방법 |
US10446416B2 (en) * | 2016-08-09 | 2019-10-15 | Lam Research Ag | Method and apparatus for processing wafer-shaped articles |
TWI765936B (zh) * | 2016-11-29 | 2022-06-01 | 美商東京威力科創Fsi股份有限公司 | 用以對處理腔室中之微電子基板進行處理的平移與旋轉夾頭 |
JP6966899B2 (ja) | 2017-08-31 | 2021-11-17 | 株式会社Screenホールディングス | 基板乾燥方法および基板処理装置 |
JP7010629B2 (ja) | 2017-08-31 | 2022-01-26 | 株式会社Screenホールディングス | 基板乾燥方法および基板処理装置 |
JP7000753B2 (ja) | 2017-09-08 | 2022-01-19 | 富士フイルムビジネスイノベーション株式会社 | 酸化チタンエアロゲル粒子、酸化チタンエアロゲル粒子の製造方法、光触媒形成用組成物、光触媒、及び構造体 |
US10538434B2 (en) | 2017-09-08 | 2020-01-21 | Fuji Xerox Co., Ltd. | Titanium oxide aerogel particle, photocatalyst forming composition, and photocatalyst |
KR102164067B1 (ko) * | 2017-09-29 | 2020-10-12 | 시바우라 메카트로닉스 가부시끼가이샤 | 기판 처리 장치 및 기판 처리 방법 |
JP7246147B2 (ja) * | 2017-09-29 | 2023-03-27 | 芝浦メカトロニクス株式会社 | 基板処理装置及び基板処理方法 |
KR102042789B1 (ko) * | 2017-11-30 | 2019-11-08 | 세메스 주식회사 | 기판 처리 방법 및 기판 처리 장치 |
US10658179B2 (en) * | 2018-08-17 | 2020-05-19 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method and structure of middle layer removal |
KR102254188B1 (ko) * | 2019-08-01 | 2021-05-21 | 무진전자 주식회사 | 오염 방지 기능이 구비된 기판 건조 장치 |
KR102603680B1 (ko) * | 2020-12-28 | 2023-11-20 | 세메스 주식회사 | 기판 처리 장치 및 기판 처리 방법 |
CN113394134B (zh) * | 2021-05-11 | 2022-10-25 | 桂林芯隆科技有限公司 | 一种用于芯片划片的自动喷液装置及其方法 |
Family Cites Families (16)
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JP2900334B2 (ja) * | 1992-03-09 | 1999-06-02 | 株式会社日立製作所 | 半導体製造方法 |
JPH11251281A (ja) * | 1998-02-27 | 1999-09-17 | Super Silicon Kenkyusho:Kk | 半導体ウエハ製造方法及び装置 |
JP3250154B2 (ja) * | 1999-03-31 | 2002-01-28 | 株式会社スーパーシリコン研究所 | 半導体ウエハ製造装置 |
JP2004104090A (ja) * | 1999-09-30 | 2004-04-02 | Nomura Micro Sci Co Ltd | 表面付着汚染物質の除去方法及び除去装置 |
US20020066475A1 (en) * | 2000-06-26 | 2002-06-06 | Steven Verhaverbeke | Chuck for holding wafer |
US6578853B1 (en) * | 2000-12-22 | 2003-06-17 | Lam Research Corporation | Chuck assembly for use in a spin, rinse, and dry module and methods for making and implementing the same |
JP3967677B2 (ja) * | 2002-12-25 | 2007-08-29 | 大日本スクリーン製造株式会社 | 乾燥処理装置および基板処理装置 |
JP4187540B2 (ja) * | 2003-01-31 | 2008-11-26 | 大日本スクリーン製造株式会社 | 基板処理方法 |
KR101127294B1 (ko) * | 2003-02-14 | 2012-03-30 | 어플라이드 머티어리얼스, 인코포레이티드 | 수소-함유 라디칼을 이용한 자연 산화물 세정 |
EP1781425A2 (en) * | 2004-07-09 | 2007-05-09 | Akrion Llc | Reduced pressure irradiation processing method and apparatus |
JP4394667B2 (ja) * | 2006-08-22 | 2010-01-06 | 日本碍子株式会社 | ヒータ付き静電チャックの製造方法 |
US20100258142A1 (en) * | 2009-04-14 | 2010-10-14 | Mark Naoshi Kawaguchi | Apparatus and method for using a viscoelastic cleaning material to remove particles on a substrate |
KR20110077604A (ko) * | 2009-12-30 | 2011-07-07 | 주식회사 하이닉스반도체 | 웨이퍼 세정 장치 및 이를 이용한 웨이퍼 세정방법 |
KR20110077045A (ko) * | 2009-12-30 | 2011-07-07 | 세메스 주식회사 | 로봇 세정 모듈 및 이를 포함하는 기판 세정 장치 |
JP5494146B2 (ja) * | 2010-04-05 | 2014-05-14 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法及び記憶媒体 |
KR20120008134A (ko) * | 2010-07-16 | 2012-01-30 | 세메스 주식회사 | 기판처리방법 |
-
2013
- 2013-04-28 CN CN2013101566801A patent/CN103377971A/zh active Pending
- 2013-04-30 JP JP2013095894A patent/JP5819879B2/ja active Active
- 2013-04-30 US US13/873,516 patent/US20130284209A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
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JP2013232650A (ja) | 2013-11-14 |
US20130284209A1 (en) | 2013-10-31 |
CN103377971A (zh) | 2013-10-30 |
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