JP2023079202A - ポリイミド系樹脂前駆体 - Google Patents

ポリイミド系樹脂前駆体 Download PDF

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Publication number
JP2023079202A
JP2023079202A JP2022187617A JP2022187617A JP2023079202A JP 2023079202 A JP2023079202 A JP 2023079202A JP 2022187617 A JP2022187617 A JP 2022187617A JP 2022187617 A JP2022187617 A JP 2022187617A JP 2023079202 A JP2023079202 A JP 2023079202A
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Japan
Prior art keywords
structural unit
formula
resin precursor
film
derived
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Pending
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JP2022187617A
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English (en)
Japanese (ja)
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JP2023079202A5 (enExample
Inventor
勇輔 小沼
Yusuke Konuma
洋行 塚田
Hiroyuki Tsukada
皓史 宮本
Koji Miyamoto
淳一 池内
Junichi Ikeuchi
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Sumitomo Chemical Co Ltd
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Sumitomo Chemical Co Ltd
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Publication of JP2023079202A publication Critical patent/JP2023079202A/ja
Publication of JP2023079202A5 publication Critical patent/JP2023079202A5/ja
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/16—Polyester-imides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1075—Partially aromatic polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2379/00—Other polymers having nitrogen, with or without oxygen or carbon only, in the main chain
    • B32B2379/08—Polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
JP2022187617A 2021-11-26 2022-11-24 ポリイミド系樹脂前駆体 Pending JP2023079202A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021192534 2021-11-26
JP2021192534 2021-11-26

Publications (2)

Publication Number Publication Date
JP2023079202A true JP2023079202A (ja) 2023-06-07
JP2023079202A5 JP2023079202A5 (enExample) 2025-10-21

Family

ID=86446902

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022187617A Pending JP2023079202A (ja) 2021-11-26 2022-11-24 ポリイミド系樹脂前駆体

Country Status (4)

Country Link
JP (1) JP2023079202A (enExample)
KR (1) KR20230078550A (enExample)
CN (1) CN116178712A (enExample)
TW (1) TW202337957A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025079540A1 (ja) * 2023-10-12 2025-04-17 Ｕｂｅ株式会社 ポリイミド前駆体組成物、ポリイミドフィルム、積層体およびそれらを含む電子デバイス基板
WO2026034345A1 (ja) * 2024-08-05 2026-02-12 住友化学株式会社 積層体

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009004720A (ja) * 2006-08-10 2009-01-08 Nippon Steel Chem Co Ltd 配線基板用積層体
JP2019059927A (ja) * 2017-09-27 2019-04-18 大日本印刷株式会社 フィルム、ポリイミドフィルム、積層体、ディスプレイ用部材、タッチパネル部材、液晶表示装置、及び有機エレクトロルミネッセンス表示装置
JP2019189872A (ja) * 2019-06-06 2019-10-31 宇部興産株式会社 ポリイミド、積層体およびそれらを含む電子デバイス
JP2020164772A (ja) * 2019-03-31 2020-10-08 株式会社カネカ ポリイミドフィルムおよびその製造方法
CN112375221A (zh) * 2020-11-27 2021-02-19 桂林电器科学研究院有限公司 一种低介电性聚酰亚胺复合薄膜及其制备方法
WO2021132279A1 (ja) * 2019-12-24 2021-07-01 株式会社カネカ 樹脂組成物およびフィルム

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6294116B2 (ja) 2013-03-29 2018-03-14 住友電気工業株式会社 ポリイミド前駆体樹脂組成物、ポリイミド樹脂膜、フレキシブルプリント配線板、回路付きサスペンション及びハードディスクドライブ
CN109789689A (zh) 2016-09-29 2019-05-21 日铁化学材料株式会社 聚酰亚胺膜、铜张层叠板及电路基板
JP6517399B2 (ja) 2018-05-01 2019-05-22 株式会社有沢製作所 ポリイミド樹脂前駆体

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009004720A (ja) * 2006-08-10 2009-01-08 Nippon Steel Chem Co Ltd 配線基板用積層体
JP2019059927A (ja) * 2017-09-27 2019-04-18 大日本印刷株式会社 フィルム、ポリイミドフィルム、積層体、ディスプレイ用部材、タッチパネル部材、液晶表示装置、及び有機エレクトロルミネッセンス表示装置
JP2020164772A (ja) * 2019-03-31 2020-10-08 株式会社カネカ ポリイミドフィルムおよびその製造方法
JP2019189872A (ja) * 2019-06-06 2019-10-31 宇部興産株式会社 ポリイミド、積層体およびそれらを含む電子デバイス
WO2021132279A1 (ja) * 2019-12-24 2021-07-01 株式会社カネカ 樹脂組成物およびフィルム
CN112375221A (zh) * 2020-11-27 2021-02-19 桂林电器科学研究院有限公司 一种低介电性聚酰亚胺复合薄膜及其制备方法

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
HIROYUKI FURUTANI ET AL.: "Novel Soluble Ethynyl-Terminated Ester-Imide Prepolymers: Their Syntheses and Characteristics", HIGH PERFORMANCE POLYMERS, vol. 12, no. 4, JPN6026025326, 2000, pages 461 - 469, ISSN: 0005891324 *
MASATOSHI HASEGAWA ET AL.: "Solution-processable transparent polyimides with low coefficients of thermal expansion and self-orie", EUROPEAN POLYMER JOURNAL, vol. 49, no. 11, JPN6026025325, 2013, pages 3657 - 3672, ISSN: 0005891323 *
MASATOSHI HASEGAWAET AL.: "Optically transparent aromatic poly(ester imide)s with low coefficients of thermal expansion (1). Se", POLYMER, vol. 74, JPN6026025324, 2015, pages 1 - 15, ISSN: 0005891322 *
MASATOSHIHASEGAWA ET AL.: "Optically transparent aromatic poly(ester imide)s with low coefficients of thermal expansion. 2: Eff", POLYMER INTERNATIONAL, vol. 67, no. 4, JPN6026025323, 15 February 2018 (2018-02-15), pages 431 - 444, ISSN: 0005891321 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025079540A1 (ja) * 2023-10-12 2025-04-17 Ｕｂｅ株式会社 ポリイミド前駆体組成物、ポリイミドフィルム、積層体およびそれらを含む電子デバイス基板
WO2026034345A1 (ja) * 2024-08-05 2026-02-12 住友化学株式会社 積層体

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KR20230078550A (ko) 2023-06-02
TW202337957A (zh) 2023-10-01
CN116178712A (zh) 2023-05-30

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