JP2023058948A5 - - Google Patents

Download PDF

Info

Publication number
JP2023058948A5
JP2023058948A5 JP2021168778A JP2021168778A JP2023058948A5 JP 2023058948 A5 JP2023058948 A5 JP 2023058948A5 JP 2021168778 A JP2021168778 A JP 2021168778A JP 2021168778 A JP2021168778 A JP 2021168778A JP 2023058948 A5 JP2023058948 A5 JP 2023058948A5
Authority
JP
Japan
Prior art keywords
liquid ejection
ejection head
head according
base film
lead wires
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021168778A
Other languages
English (en)
Japanese (ja)
Other versions
JP7781588B2 (ja
JP2023058948A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2021168778A priority Critical patent/JP7781588B2/ja
Priority claimed from JP2021168778A external-priority patent/JP7781588B2/ja
Priority to US17/961,839 priority patent/US12246535B2/en
Publication of JP2023058948A publication Critical patent/JP2023058948A/ja
Publication of JP2023058948A5 publication Critical patent/JP2023058948A5/ja
Application granted granted Critical
Publication of JP7781588B2 publication Critical patent/JP7781588B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2021168778A 2021-10-14 2021-10-14 液体吐出ヘッド及びその製造方法 Active JP7781588B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2021168778A JP7781588B2 (ja) 2021-10-14 2021-10-14 液体吐出ヘッド及びその製造方法
US17/961,839 US12246535B2 (en) 2021-10-14 2022-10-07 Liquid ejection head and production method for producing same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021168778A JP7781588B2 (ja) 2021-10-14 2021-10-14 液体吐出ヘッド及びその製造方法

Publications (3)

Publication Number Publication Date
JP2023058948A JP2023058948A (ja) 2023-04-26
JP2023058948A5 true JP2023058948A5 (https=) 2024-10-22
JP7781588B2 JP7781588B2 (ja) 2025-12-08

Family

ID=85982299

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021168778A Active JP7781588B2 (ja) 2021-10-14 2021-10-14 液体吐出ヘッド及びその製造方法

Country Status (2)

Country Link
US (1) US12246535B2 (https=)
JP (1) JP7781588B2 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024022930A (ja) 2022-08-08 2024-02-21 キヤノン株式会社 液体吐出ヘッド及びインクジェット記録装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6341842B1 (en) * 2000-05-03 2002-01-29 Lexmark International, Inc. Surface modified nozzle plate
JP2002067337A (ja) * 2000-08-29 2002-03-05 Ricoh Co Ltd インクジェットヘッド及びその製造方法
JP2002331666A (ja) * 2001-05-08 2002-11-19 Canon Inc インクジェット記録ヘッド
US20030052101A1 (en) * 2001-09-14 2003-03-20 Jianhui Gu Method for cleaning debris off UV laser ablated polymer, method for producing a polymer nozzle member using the same and nozzle member produced thereby
JP4290154B2 (ja) * 2004-12-08 2009-07-01 キヤノン株式会社 液体吐出記録ヘッドおよびインクジェット記録装置

Similar Documents

Publication Publication Date Title
JP5400094B2 (ja) 半導体パッケージ及びその実装方法
CN108598243B (zh) 一种led封装器件、封装方法及显示面板
KR20110103413A (ko) 전기 전도성 물질의 에어로졸 응용에 의해 형성된 반도체 다이 배선
US7737452B2 (en) Light-emitting element package and light source apparatus using the same
CN1206496A (zh) 半导体器件及其制造方法、电路基板和薄膜载带
JP2023058948A5 (https=)
JP2003338587A5 (https=)
JP6040993B2 (ja) 半導体装置及びその製造方法
JP2011181697A (ja) 半導体パッケージおよびその製造方法
JP2010129591A (ja) リードフレーム、このリードフレームを用いた半導体装置及びその中間製品、並びにこれらの製造方法
KR100623606B1 (ko) 비지에이형 반도체 장치의 제조방법, 비지에이형 반도체 장치용 티에이비 테이프, 및 비지에이형 반도체 장치
CN104576622A (zh) 具有偏向堆叠元件的封装模块
JP5590567B2 (ja) 構成部品の配置構造および、構成部品の配置構造を製造する方法
CN1111823A (zh) 树脂封装半导体器件及其制造方法
JP2023055114A5 (https=)
US9870977B2 (en) Semiconductor device with heat information mark
JP5149688B2 (ja) 半導体パッケージ
JP6182928B2 (ja) 半導体装置
JP2570381B2 (ja) フレキシブルプリント基板へのｉｃチツプ搭載構造
CN109788626B (zh) 具有防水洗结构的模组
CN205564729U (zh) 封装基板及集成电路封装体
JP4181557B2 (ja) 半導体装置およびその製造方法
JP2024082107A5 (https=)
JP2010010653A (ja) 回路基板、リードフレーム、半導体装置及びその製造方法
JPWO2025027845A5 (https=)