JP2023032758A - 描画装置、描画方法およびプログラム - Google Patents
描画装置、描画方法およびプログラム Download PDFInfo
- Publication number
- JP2023032758A JP2023032758A JP2021139063A JP2021139063A JP2023032758A JP 2023032758 A JP2023032758 A JP 2023032758A JP 2021139063 A JP2021139063 A JP 2021139063A JP 2021139063 A JP2021139063 A JP 2021139063A JP 2023032758 A JP2023032758 A JP 2023032758A
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- 238000000034 method Methods 0.000 title claims description 14
- 239000000758 substrate Substances 0.000 claims abstract description 165
- 238000003384 imaging method Methods 0.000 claims abstract description 52
- 238000001514 detection method Methods 0.000 claims abstract description 35
- 230000001678 irradiating effect Effects 0.000 claims description 17
- 239000011159 matrix material Substances 0.000 claims description 14
- 238000000605 extraction Methods 0.000 description 45
- 238000012545 processing Methods 0.000 description 14
- 238000010586 diagram Methods 0.000 description 12
- 230000002093 peripheral effect Effects 0.000 description 6
- 239000000284 extract Substances 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 239000010949 copper Substances 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 238000009877 rendering Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
- G03F7/70508—Data handling in all parts of the microlithographic apparatus, e.g. handling pattern data for addressable masks or data transfer to or from different components within the exposure apparatus
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70283—Mask effects on the imaging process
- G03F7/70291—Addressable masks, e.g. spatial light modulators [SLMs], digital micro-mirror devices [DMDs] or liquid crystal display [LCD] patterning devices
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70358—Scanning exposure, i.e. relative movement of patterned beam and workpiece during imaging
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Image Analysis (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021139063A JP2023032758A (ja) | 2021-08-27 | 2021-08-27 | 描画装置、描画方法およびプログラム |
TW111123555A TWI831264B (zh) | 2021-08-27 | 2022-06-24 | 描繪裝置、描繪方法以及記錄了程式的程式產品 |
KR1020220084630A KR20230031774A (ko) | 2021-08-27 | 2022-07-08 | 묘화 장치, 묘화 방법, 및 기억 매체에 기록된 프로그램 |
CN202210992521.4A CN115729053A (zh) | 2021-08-27 | 2022-08-18 | 绘制装置、绘制方法及记录有程序的存储介质 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021139063A JP2023032758A (ja) | 2021-08-27 | 2021-08-27 | 描画装置、描画方法およびプログラム |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2023032758A true JP2023032758A (ja) | 2023-03-09 |
Family
ID=85292838
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021139063A Pending JP2023032758A (ja) | 2021-08-27 | 2021-08-27 | 描画装置、描画方法およびプログラム |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2023032758A (zh) |
KR (1) | KR20230031774A (zh) |
CN (1) | CN115729053A (zh) |
TW (1) | TWI831264B (zh) |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4275345B2 (ja) * | 2002-01-30 | 2009-06-10 | 株式会社日立製作所 | パターン検査方法及びパターン検査装置 |
JP5015721B2 (ja) * | 2007-03-30 | 2012-08-29 | 大日本スクリーン製造株式会社 | 欠陥検査装置、欠陥検査プログラム、図形描画装置および図形描画システム |
US10867382B2 (en) * | 2018-05-24 | 2020-12-15 | Keysight Technologies, Inc. | Detecting mura defects in master panel of flat panel displays during fabrication |
-
2021
- 2021-08-27 JP JP2021139063A patent/JP2023032758A/ja active Pending
-
2022
- 2022-06-24 TW TW111123555A patent/TWI831264B/zh active
- 2022-07-08 KR KR1020220084630A patent/KR20230031774A/ko active IP Right Grant
- 2022-08-18 CN CN202210992521.4A patent/CN115729053A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
TWI831264B (zh) | 2024-02-01 |
KR20230031774A (ko) | 2023-03-07 |
TW202309476A (zh) | 2023-03-01 |
CN115729053A (zh) | 2023-03-03 |
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