JP2023009740A - Grindstone - Google Patents

Grindstone Download PDF

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JP2023009740A
JP2023009740A JP2021113262A JP2021113262A JP2023009740A JP 2023009740 A JP2023009740 A JP 2023009740A JP 2021113262 A JP2021113262 A JP 2021113262A JP 2021113262 A JP2021113262 A JP 2021113262A JP 2023009740 A JP2023009740 A JP 2023009740A
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processed
processing
radial direction
grindstone
portions
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JP7441527B2 (en
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篤 ▲高▼田
Atsushi Takada
恭介 大橋
Kyosuke Ohashi
大地 ▲高▼田
Daichi Takada
大和 ▲高▼田
Yamato Takada
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Nano TEM Co Ltd
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Nano TEM Co Ltd
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Abstract

To provide a grindstone capable of improving sharpness.SOLUTION: A grindstone 10 includes multiple processing parts 11 arrayed on a processing surface 10a where a workpiece is polished or ground, and extends in a direction intersecting the processing surface 10a. The multiple processing parts 11 each extend along a radial direction R of the processing surface 10a and arrayed in the circumferential direction C and the radial direction R of the processing surface 10a.SELECTED DRAWING: Figure 1

Description

本発明は、砥石に関する。 The present invention relates to a grindstone.

例えば、特許文献１に記載の砥石は、加工面に沿って複数の筒部が並べられた構造を有する。この筒部は、被加工物であるワークを加工するための複数の砥粒を含有する。 For example, the whetstone described in Patent Document 1 has a structure in which a plurality of cylindrical portions are arranged along the processing surface. This tubular portion contains a plurality of abrasive grains for processing a workpiece, which is an object to be processed.

特開２０２０－４９５７４号公報JP 2020-49574 A

上記特許文献１に記載の砥石では、強度が高く、ワークの加工時に筒部が削られず、ワークに接触する砥粒が鋭利でなくなり、砥石の切れ味が低下するおそれがある。 The grindstone described in Patent Document 1 has a high strength, and the cylindrical portion is not ground during processing of the work, and the abrasive grains in contact with the work are not sharp, which may reduce the sharpness of the grindstone.

本発明は、上記実状を鑑みてなされたものであり、切れ味を向上させることができる砥石を提供することを目的とする。 SUMMARY OF THE INVENTION It is an object of the present invention to provide a whetstone capable of improving sharpness.

上記目的を達成するため、本発明に係る砥石は、被加工物を研磨又は研削する加工面に並べられ、前記加工面に交わる方向に延びる複数の加工部を備え、前記複数の加工部は、それぞれ前記加工面の径方向に沿って延び、前記加工面の周方向及び前記径方向に並べられている。 In order to achieve the above object, the grindstone according to the present invention includes a plurality of processing portions arranged on a processing surface for polishing or grinding a workpiece and extending in a direction intersecting the processing surface, the plurality of processing portions comprising: Each extends along the radial direction of the processing surface and is arranged in the circumferential direction and the radial direction of the processing surface.

また、前記複数の加工部は、前記径方向に沿って延びる第１仮想線上に配置される複数の第１加工部と、前記第１仮想線の前記周方向の隣に位置し前記径方向に沿って延びる第２仮想線上に配置される複数の第２加工部と、を備え、前記第１加工部及び前記第２加工部は、前記周方向に重ならないように形成されている、ようにしてもよい。 Further, the plurality of processed portions include a plurality of first processed portions arranged on a first imaginary line extending along the radial direction, and a plurality of first processed portions located adjacent to the first imaginary line in the circumferential direction and extending in the radial direction. and a plurality of second processed portions arranged on a second imaginary line extending along the second processed portion, wherein the first processed portion and the second processed portion are formed so as not to overlap in the circumferential direction. may

また、前記砥石は、前記複数の加工部の周囲に充填されて前記複数の加工部を保持する保持部を備え、前記砥石は表裏対称の板状に形成されている、ようにしてもよい。 Further, the grindstone may include a holding portion filled around the plurality of processed portions to hold the plurality of processed portions, and the grindstone may be formed in a plate shape with front and back symmetry.

また、前記砥石は、前記径方向に並ぶ前記複数の加工部、及び前記径方向に並ぶ前記複数の加工部を連結する連結部を有し、前記径方向に沿う板状に形成され、前記保持部により保持される加工シートを備える、ようにしてもよい。 Further, the grindstone has the plurality of processing portions arranged in the radial direction and a connection portion connecting the plurality of processing portions arranged in the radial direction, and is formed in a plate shape along the radial direction, and the holding A working sheet held by the part may be provided.

本発明によれば、切れ味を向上させることができる。 According to the present invention, sharpness can be improved.

本発明の一実施形態に係る砥石の底面図である。It is a bottom view of the whetstone concerning one embodiment of the present invention. 図１の範囲Ｄを拡大した図である。It is the figure which expanded the range D of FIG. 図１の３－３線の断面図である。FIG. 2 is a cross-sectional view taken along line 3-3 of FIG. 1;

本発明に係る砥石の一実施形態について図面を参照して説明する。
図３に示すように、砥石ユニット１は、被加工物Ｗを加工する砥石１０と、砥石１０を保持する砥石ホルダー２０と、を備える。 One embodiment of the whetstone according to the present invention will be described with reference to the drawings.
As shown in FIG. 3 , the grindstone unit 1 includes a grindstone 10 for processing the workpiece W and a grindstone holder 20 for holding the grindstone 10 .

砥石ホルダー２０は略円板状をなす。砥石ホルダー２０の中心には円柱状のシャフト２５が挿通されている。砥石ホルダー２０は、砥石１０とともに、シャフト２５に沿う回転軸Ｏを中心にモータ２７により回転する。砥石１０の下面である加工面１０ａに図示しないチャックに固定された被加工物Ｗが接触した状態で砥石１０が回転する。これにより、砥石１０は被加工物Ｗを加工、すなわち研磨又は研削する。被加工物Ｗは、例えば、セラミックス、シリコンウエハ、半導体基板、ＬＥＤ（Light Emitting Diode）基板、放熱基板、シリコンカーバイド、アルミナ、サファイア又は金属等である。 The whetstone holder 20 has a substantially disk shape. A cylindrical shaft 25 is inserted through the center of the grindstone holder 20 . The grindstone holder 20 rotates together with the grindstone 10 around a rotation axis O along a shaft 25 by a motor 27 . The grindstone 10 rotates while the workpiece W fixed to a chuck (not shown) is in contact with the processing surface 10a that is the lower surface of the grindstone 10 . Thereby, the grindstone 10 processes the workpiece W, that is, polishes or grinds it. The workpiece W is, for example, ceramics, a silicon wafer, a semiconductor substrate, an LED (Light Emitting Diode) substrate, a heat dissipation substrate, silicon carbide, alumina, sapphire, metal, or the like.

図１に示すように、砥石１０は円環の板状をなし、表面と裏面の何れかが加工面１０ａとなる。砥石１０は、加工面１０ａに直交する方向に延びる複数の加工部１１と、複数の加工部１１を保持する保持部１９と、を備える。
図１及び図２に示すように、複数の加工部１１は、円形の加工面１０ａの径方向Ｒに沿って延びる破線状に形成され、加工面１０ａの周方向Ｃに並べられる。複数の加工部１１は、径方向Ｒ及び周方向Ｃに千鳥状に配列されている。各加工部１１は削られながら被加工物Ｗを研磨又は研削する。各加工部１１は、加工面１０ａの径方向Ｒ及び回転軸Ｏに沿う方向に延びる平板状をなす。各加工部１１は、それぞれ同一の形状及びサイズで形成されている。加工面１０ａに占める複数の加工部１１の面積の割合は、１０％以下に設定されている。これにより、複数の加工部１１の被加工物Ｗへの加工圧力を高めることができる。図３に示すように、各加工部１１の回転軸Ｏに沿う方向の両端部がそれぞれ砥石１０の表面と裏面に露出する。 As shown in FIG. 1, the grindstone 10 has an annular plate shape, and either the front surface or the back surface serves as a processing surface 10a. The grindstone 10 includes a plurality of working portions 11 extending in a direction orthogonal to the working surface 10 a and a holding portion 19 holding the plurality of working portions 11 .
As shown in FIGS. 1 and 2, the plurality of processed portions 11 are formed in a broken line shape extending along the radial direction R of the circular processed surface 10a and arranged in the circumferential direction C of the processed surface 10a. The plurality of processed portions 11 are arranged in a zigzag pattern in the radial direction R and the circumferential direction C. As shown in FIG. Each processing unit 11 polishes or grinds the workpiece W while being scraped. Each processed portion 11 has a flat plate shape extending in the radial direction R of the processed surface 10a and in the direction along the rotation axis O. As shown in FIG. Each processed portion 11 is formed in the same shape and size. The ratio of the area of the plurality of processed portions 11 to the processed surface 10a is set to 10% or less. As a result, the processing pressure applied to the workpiece W by the plurality of processing units 11 can be increased. As shown in FIG. 3, both end portions of each processing portion 11 in the direction along the rotation axis O are exposed on the front surface and the back surface of the grindstone 10, respectively.

図２に示すように、複数の加工部１１は、第１仮想線Ｌ１上に配置される複数、本例では２つの第１加工部１１ａと、第２仮想線Ｌ２上に配置される複数、本例では２つの第２加工部１１ｂと、を備える。第１仮想線Ｌ１及び第２仮想線Ｌ２は、それぞれ加工面１０ａ上に径方向Ｒに沿って延び、周方向Ｃに等角度間隔で交互に並べられる。
複数の第１加工部１１ａ及び複数の第２加工部１１ｂは、周方向Ｃに重ならないように形成されている。すなわち、径方向Ｒにおける第１加工部１１ａと第２加工部１１ｂの間には、隙間として非重複領域Ｓｋが形成されている。非重複領域Ｓｋが形成されることにより、加工面１０ａに占める複数の加工部１１の面積の割合が小さくなる。これにより、各加工部１１の被加工物Ｗへの加工圧力が高まり、加工時に各加工部１１が削られて、鋭利な砥粒１５（図３参照）が露出し、砥石１０の切れ味が高まる。 As shown in FIG. 2, the plurality of processed portions 11 includes a plurality of first processed portions 11a arranged on the first virtual line L1, two first processed portions 11a in this example, a plurality of arranged on the second virtual line L2, In this example, two second processing portions 11b are provided. The first virtual lines L1 and the second virtual lines L2 each extend along the radial direction R on the processing surface 10a and are arranged alternately in the circumferential direction C at equal angular intervals.
The plurality of first processed portions 11a and the plurality of second processed portions 11b are formed so as not to overlap in the circumferential direction C. As shown in FIG. That is, between the first processed portion 11a and the second processed portion 11b in the radial direction R, a non-overlapping region Sk is formed as a gap. By forming the non-overlapping region Sk, the ratio of the area of the plurality of processed portions 11 to the processed surface 10a is reduced. As a result, the processing pressure of each processing portion 11 on the workpiece W is increased, and each processing portion 11 is shaved during processing to expose sharp abrasive grains 15 (see FIG. 3), and the sharpness of the grindstone 10 is enhanced. .

図１に示すように、複数の加工部１１は、周方向Ｃに等角度間隔で並ぶ複数の第３加工部１１ｃ及び複数の第４加工部１１ｄを備える。複数の第３加工部１１ｃと複数の第４加工部１１ｄは径方向Ｒにおいて隣に配列される。複数の第３加工部１１ｃは、複数の第４加工部１１ｄに対して周方向Ｃにずれた位置に設けられる。各第３加工部１１ｃは、周方向Ｃにおいて各第４加工部１１ｄの中央に配置される。 As shown in FIG. 1, the plurality of processed portions 11 includes a plurality of third processed portions 11c and a plurality of fourth processed portions 11d arranged in the circumferential direction C at equal angular intervals. The plurality of third processed portions 11c and the plurality of fourth processed portions 11d are arranged next to each other in the radial direction R. The plurality of third processed portions 11c are provided at positions shifted in the circumferential direction C with respect to the plurality of fourth processed portions 11d. Each third processed portion 11c is arranged in the center of each fourth processed portion 11d in the circumferential direction C. As shown in FIG.

図３に示すように、保持部１９は、加工面１０ａの全域にわたって形成され、複数の加工部１１を保持する。保持部１９は各加工部１１の周囲に充填される。各加工部１１の先端部が加工面１０ａに露出した状態で各加工部１１が保持部１９に埋め込まれている。本例では、各加工部１１の先端部と後端部が砥石１０の両面に露出しており、砥石１０が表裏対称に形成されている。
保持部１９は、加工部１１よりも外力により変形しやすく、かつ加工時に加工部１１よりも摩耗しやすい材質により形成される。保持部１９は、例えば、樹脂又はセラミックからなる。保持部１９は、流体が通過不能に形成されてもよいし、流体が通過可能な多孔質で形成されていてもよい。 As shown in FIG. 3 , the holding portion 19 is formed over the entire processing surface 10 a and holds the plurality of processing portions 11 . The holding portion 19 is filled around each processed portion 11 . Each processed portion 11 is embedded in the holding portion 19 with the tip portion of each processed portion 11 exposed to the processed surface 10a. In this example, the front end and the rear end of each processed portion 11 are exposed on both sides of the grindstone 10, and the grindstone 10 is formed symmetrically.
The holding portion 19 is formed of a material that is more easily deformed by an external force than the processed portion 11 and is more likely to be worn than the processed portion 11 during processing. The holding portion 19 is made of resin or ceramic, for example. The holding portion 19 may be formed impermeable to the fluid, or may be formed of a porous material through which the fluid can pass.

加工部１１は、図３の下部に拡大して示すように、複数の砥粒１５と、結合材１６と、を備える。複数の砥粒１５は結合材１６内に分布している。砥粒１５は、例えば、ダイヤモンドである。なお、砥粒１５は、ダイヤモンドに限らず、立方晶窒化ホウ素（ＣＢＮ）砥粒であってもよいし、ＣＢＮ砥粒とダイヤモンドを混合させてもよい。さらには、複数の砥粒１５は、炭化ケイ素（ＳｉＣ）、又は溶融アルミナ（Ａｌ２Ｏ３）、若しくはこれらを混合したものであってもよい。結合材１６は、内部に複数の砥粒１５を保持する。結合材１６は、ニッケル、鉄、アルミニウム、銅等の金属、アルミニウム合金、青銅等の合金、フエノール樹脂、エポキシ樹脂等の樹脂又はセラミック等により形成されている。 The processing portion 11 includes a plurality of abrasive grains 15 and a bonding material 16, as shown enlarged in the lower portion of FIG. A plurality of abrasive grains 15 are distributed within the bonding material 16 . The abrasive grains 15 are diamonds, for example. The abrasive grains 15 are not limited to diamond, and may be cubic boron nitride (CBN) abrasive grains, or may be a mixture of CBN abrasive grains and diamond. Furthermore, the plurality of abrasive grains 15 may be silicon carbide (SiC), fused alumina (Al 2 O 3 ), or a mixture thereof. The binding material 16 holds a plurality of abrasive grains 15 inside. The binding material 16 is made of metal such as nickel, iron, aluminum or copper, alloy such as aluminum alloy or bronze, resin such as phenol resin or epoxy resin, or ceramic.

（効果）
以上、説明した一実施形態によれば、以下の効果を奏する。
（１）砥石１０は、被加工物Ｗを研磨又は研削する加工面１０ａに並べられ、加工面１０ａに交わる方向、例えば、加工面１０ａに直交する方向に延びる複数の加工部１１を備える。複数の加工部１１は、それぞれ加工面１０ａの径方向Ｒに沿って延びる板状をなし、加工面１０ａの周方向Ｃ及び径方向Ｒに並べられている。
この構成によれば、各加工部１１の被加工物Ｗへの加工圧力を高めることができる。このため、加工時に各加工部１１が削られて、各加工部１１に含まれる鋭利な砥粒１５が被加工物Ｗに対して露出して、砥石１０の切れ味を向上させることができる。 (effect)
According to the embodiment described above, the following effects are obtained.
(1) The grindstone 10 includes a plurality of processing portions 11 arranged on a processing surface 10a for polishing or grinding the workpiece W and extending in a direction intersecting the processing surface 10a, for example, a direction orthogonal to the processing surface 10a. The plurality of processed portions 11 each have a plate shape extending along the radial direction R of the processed surface 10a, and are arranged in the circumferential direction C and the radial direction R of the processed surface 10a.
According to this configuration, the processing pressure applied to the workpiece W by each processing unit 11 can be increased. Therefore, each processed portion 11 is cut during processing, and the sharp abrasive grains 15 contained in each processed portion 11 are exposed to the workpiece W, and the sharpness of the grindstone 10 can be improved.

（２）複数の加工部１１は、径方向Ｒに沿って延びる第１仮想線Ｌ１上に配置される複数の第１加工部１１ａと、第１仮想線Ｌ１の周方向Ｃの隣に位置し径方向Ｒに沿って延びる第２仮想線Ｌ２上に配置される複数の第２加工部１１ｂと、を備える。第１加工部１１ａ及び第２加工部１１ｂは、周方向Ｃに重ならないように形成されている。
この構成によれば、加工面１０ａに占める加工部１１の面積を小さくすることができる。このため、各加工部１１の被加工物Ｗへの加工圧力を高めることができ、砥石１０の切れ味を向上させることができる。 (2) The plurality of processed portions 11 include the plurality of first processed portions 11a arranged on the first imaginary line L1 extending along the radial direction R, and the plurality of first processed portions 11a located next to the first imaginary line L1 in the circumferential direction C. and a plurality of second processed portions 11b arranged on a second imaginary line L2 extending along the radial direction R. The first processed portion 11a and the second processed portion 11b are formed so as not to overlap in the circumferential direction C. As shown in FIG.
According to this configuration, the area of the processed portion 11 occupying the processed surface 10a can be reduced. Therefore, the processing pressure applied to the workpiece W by each processing portion 11 can be increased, and the sharpness of the grindstone 10 can be improved.

（３）砥石１０は、複数の加工部１１の周囲に充填されて複数の加工部１１を保持する保持部１９を備える。砥石１０は表裏対称の板状に形成されている。
この構成によれば、砥石１０の取り扱いが簡単となり、砥石１０の裏表を間違えることがない。 (3) The grindstone 10 includes a holding portion 19 filled around the plurality of processing portions 11 to hold the plurality of processing portions 11 . The whetstone 10 is formed in a symmetrical plate shape.
According to this configuration, the whetstone 10 can be easily handled, and the whetstone 10 is not mistakenly turned upside down.

なお、本発明は以上の実施形態及び図面によって限定されるものではない。本発明の要旨を変更しない範囲で、適宜、変更（構成要素の削除も含む）を加えることが可能である。以下に、変形の一例を説明する。 In addition, this invention is not limited by the above embodiment and drawing. Modifications (including deletion of components) can be made as appropriate without changing the gist of the present invention. An example of modification will be described below.

（変形例）
上記実施形態において、砥石１０は、径方向Ｒに並ぶ複数の加工部１１を含む加工シート１１ｓ（図２参照）を有していてもよい。加工シート１１ｓは、径方向Ｒに並ぶ複数の加工部１１を連結する複数の連結部１１ｒを備える。連結部１１ｒは、保持部１９と同様の材質からなり、加工部１１と同一平面上に位置する板状をなす。複数の加工シート１１ｓは、周方向Ｃに等角度間隔で配置されてもよい。保持部１９は、複数の加工シート１１ｓの間に配置され、複数の加工シート１１ｓを保持してもよい。
以上、説明した変形例によれば、以下の効果を奏する。
砥石１０は、径方向Ｒに並ぶ複数の加工部１１、及び径方向Ｒに並ぶ複数の加工部１１を連結する連結部１１ｒを有し、径方向Ｒに沿う板状に形成され、保持部１９により保持される加工シート１１ｓを備える。
この構成によれば、各加工部１１を位置精度高く並べることができる。 (Modification)
In the above embodiment, the grindstone 10 may have a processing sheet 11s (see FIG. 2) including a plurality of processing portions 11 arranged in the radial direction R. The processing sheet 11s includes a plurality of connecting portions 11r that connect the plurality of processing portions 11 arranged in the radial direction R. As shown in FIG. The connecting portion 11 r is made of the same material as the holding portion 19 and has a plate shape positioned on the same plane as the processing portion 11 . The plurality of processing sheets 11s may be arranged in the circumferential direction C at equal angular intervals. The holding part 19 may be arranged between the plurality of processing sheets 11s and hold the plurality of processing sheets 11s.
According to the modification described above, the following effects are obtained.
The grindstone 10 has a plurality of processing portions 11 arranged in the radial direction R and a connecting portion 11r that connects the plurality of processing portions 11 arranged in the radial direction R, and is formed in a plate shape along the radial direction R. and a work sheet 11s held by.
According to this configuration, the processing units 11 can be arranged with high positional accuracy.

上記実施形態においては、第１仮想線Ｌ１上に２つの第１加工部１１ａが並べられていたが、第１仮想線Ｌ１上に並べられる第１加工部１１ａの数は、これに限らず、１つ又は３つ以上であってもよい。第２仮想線Ｌ２上に並べられる第２加工部１１ｂの数も、これと同様に、１つ又は３つ以上であってもよい。 In the above embodiment, two first processed portions 11a are arranged on the first virtual line L1, but the number of the first processed portions 11a arranged on the first virtual line L1 is not limited to this, It may be one or three or more. Similarly, the number of second processed portions 11b arranged on the second virtual line L2 may be one or three or more.

上記実施形態においては、複数の加工部１１はそれぞれ同一の形状及びサイズで形成されていたが、それぞれ異なる形状又はサイズで形成されてもよい。例えば、上記実施形態においては、第１加工部１１ａ及び第２加工部１１ｂは、各仮想線Ｌ１，Ｌ２上に破線状に配置されていたが、これに限らず、各仮想線Ｌ１，Ｌ２上に一点鎖線状又は二点鎖線状に配置されてもよい。
上記実施形態における非重複領域Ｓｋが省略され、第１加工部１１ａ及び第２加工部１１ｂが径方向Ｒに重なって形成されてもよい。また、複数の第１加工部１１ａと複数の第２加工部１１ｂの何れか一方が省略されてもよい。
また、上記実施形態における保持部１９が省略されてもよい。この場合、各加工部１１の後端部がベース基板に接着剤で固定されてもよい。
さらに、砥石１０は表裏非対称で形成されてもよい。
また、各加工部１１は、加工面１０ａに対して傾斜していてもよい。
また、加工部１１は複数の砥粒１５を含有していなくてもよい。この場合、加工部１１は超硬合金等の金属からなる。 In the above embodiment, the plurality of processed portions 11 are formed with the same shape and size, but may be formed with different shapes or sizes. For example, in the above-described embodiment, the first processed portion 11a and the second processed portion 11b are arranged in broken lines on the virtual lines L1 and L2. may be arranged in a one-dot chain line or a two-dot chain line.
The non-overlapping region Sk in the above embodiment may be omitted, and the first processed portion 11a and the second processed portion 11b may be formed overlapping in the radial direction R. Also, one of the plurality of first processing portions 11a and the plurality of second processing portions 11b may be omitted.
Also, the holding portion 19 in the above embodiment may be omitted. In this case, the rear end portion of each processed portion 11 may be fixed to the base substrate with an adhesive.
Furthermore, the grindstone 10 may be formed with front and back asymmetry.
Further, each processed portion 11 may be inclined with respect to the processed surface 10a.
Moreover, the processed portion 11 may not contain the plurality of abrasive grains 15 . In this case, the processed portion 11 is made of metal such as cemented carbide.

１ 砥石ユニット
１０ 砥石
１０ａ 加工面
１１ 加工部
１１ａ 第１加工部
１１ｂ 第２加工部
１１ｃ 第３加工部
１１ｄ 第４加工部
１１ｒ 連結部
１１ｓ 加工シート
１５ 砥粒
１６ 結合材
１９ 保持部
２０ 砥石ホルダー
２５ シャフト
２７ モータ
Ｃ 周方向
Ｌ１ 第１仮想線
Ｌ２ 第２仮想線
Ｏ 回転軸
Ｒ 径方向
Ｗ 被加工物
Ｓｋ 非重複領域 1 grindstone unit 10 grindstone 10a processing surface 11 processing portion 11a first processing portion 11b second processing portion 11c third processing portion 11d fourth processing portion 11r connecting portion 11s processing sheet 15 abrasive grain 16 binder 19 holding portion 20 grindstone holder 25 Shaft 27 Motor C Circumferential direction L1 First virtual line L2 Second virtual line O Rotational axis R Radial direction W Work piece Sk Non-overlapping region

Claims (4)

被加工物を研磨又は研削する加工面に並べられ、前記加工面に交わる方向に延びる複数の加工部を備え、
前記複数の加工部は、それぞれ前記加工面の径方向に沿って延び、前記加工面の周方向及び前記径方向に並べられている、
砥石。 A plurality of processing parts arranged on a processing surface for polishing or grinding a workpiece and extending in a direction intersecting the processing surface,
The plurality of processed parts each extend along the radial direction of the processed surface and are arranged in the circumferential direction and the radial direction of the processed surface,
Grindstone. 前記複数の加工部は、
前記径方向に沿って延びる第１仮想線上に配置される複数の第１加工部と、
前記第１仮想線の前記周方向の隣に位置し前記径方向に沿って延びる第２仮想線上に配置される複数の第２加工部と、を備え、
前記第１加工部及び前記第２加工部は、前記周方向に重ならないように形成されている、
請求項１に記載の砥石。 The plurality of processing units are
a plurality of first processed portions arranged on a first imaginary line extending along the radial direction;
a plurality of second processing portions arranged on a second virtual line positioned next to the first virtual line in the circumferential direction and extending along the radial direction;
The first processed portion and the second processed portion are formed so as not to overlap in the circumferential direction,
The grindstone according to claim 1. 前記複数の加工部の周囲に充填されて前記複数の加工部を保持する保持部を備え、
前記砥石は表裏対称の板状に形成されている、
請求項１又は２に記載の砥石。 A holding part filled around the plurality of processed parts and holding the plurality of processed parts,
The whetstone is formed in a plate shape with front and back symmetry,
The grindstone according to claim 1 or 2. 前記径方向に並ぶ前記複数の加工部、及び前記径方向に並ぶ前記複数の加工部を連結する連結部を有し、前記径方向に沿う板状に形成され、前記保持部により保持される加工シートを備える、
請求項３に記載の砥石。 A processing that is formed in a plate-like shape along the radial direction and is held by the holding portion, including the plurality of processing portions arranged in the radial direction and a connecting portion that connects the plurality of processing portions arranged in the radial direction. equipped with a seat
The grindstone according to claim 3.
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0355169A (en) * 1989-07-24 1991-03-08 Kawada Eng:Kk Manufacture of grinding wheel with diamond-impregnated grinding tip
JPH0655459A (en) * 1992-08-06 1994-03-01 Speedfam Co Ltd Level plate for surface grinder and its manufacture
JP2018034290A (en) * 2016-09-02 2018-03-08 山岡石材工業株式会社 Disc-shaped grind stone and grinder
JP2020049574A (en) * 2018-09-26 2020-04-02 株式会社ナノテム Grindstone

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0355169A (en) * 1989-07-24 1991-03-08 Kawada Eng:Kk Manufacture of grinding wheel with diamond-impregnated grinding tip
JPH0655459A (en) * 1992-08-06 1994-03-01 Speedfam Co Ltd Level plate for surface grinder and its manufacture
JP2018034290A (en) * 2016-09-02 2018-03-08 山岡石材工業株式会社 Disc-shaped grind stone and grinder
JP2020049574A (en) * 2018-09-26 2020-04-02 株式会社ナノテム Grindstone

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