JP7418009B2 - polishing plate - Google Patents

Description

The present invention relates to a polishing plate.

For example, the polishing surface plate described in Patent Document 1 includes a polishing surface in which grooves having a U-shaped cross section are formed along concentric circles. By forming grooves on the polishing plane, processing pressure can be adjusted.

Japanese Patent Application Publication No. 8-25213

In the configuration described in Patent Document 1, it is necessary to form grooves on the polishing plane in order to adjust the processing pressure, and it takes time and effort to manufacture the polishing surface plate.

The present invention has been made in view of the above-mentioned circumstances, and an object of the present invention is to provide a polishing plate that can be manufactured more easily while making it possible to adjust the processing pressure.

In order to achieve the above object, a polishing plate according to a first aspect of the present invention includes a plurality of column parts arranged at intervals along a polishing surface on which a workpiece is polished and extending in a direction intersecting the polishing surface; a holding member formed of a separate member from the plurality of pillars and holding the plurality of pillars, the plurality of pillars having a virtual hexagonal shape arranged without gaps along the polishing surface; The plurality of columnar parts each extend in a direction intersecting the polishing surface, and each of the plurality of columnar parts extends in a direction intersecting the polishing surface, and the plurality of columnar parts each extend in a direction intersecting the polishing surface , and each of the plurality of columnar parts extends in a direction intersecting the polishing surface. first to third plate-shaped portions extending in directions different from each other and along the sides of the virtual hexagon with the corner portions as intersection points, and the spacing between the plurality of columnar portions is equal to Since the first to third plate-shaped portions are not formed in the center of the hexagonal sides, there is an empty space .

In order to achieve the above object, a polishing plate according to a second aspect of the present invention includes a plurality of pillars arranged along a polishing surface on which a work is polished and extending in a direction intersecting the polishing surface, and a plurality of pillars arranged along a polishing surface on which a work is polished. and a holding member formed as a separate member to hold the plurality of pillar parts, the pillar parts extending in a direction intersecting the polishing surface and each having a V-shape when viewed from the direction intersecting the polishing surface. and a Y-shaped gap between the three V-shaped plates to bond the three V-shaped plates together. It includes an adhesive layer and a plurality of fixed abrasive grains provided within the adhesive layer.

Further, the pillar portion may include a tip surface that rolls free abrasive grains between the polishing plate and the workpiece when the polishing plate is rotating.

Further, the pillar portion extends in a direction intersecting the polishing surface, has a V-shape when viewed from the direction intersecting the polishing surface , and has three columns arranged to open in different directions. A V-shaped plate material, an adhesive layer provided in a Y-shaped gap between the three V-shaped plate materials and bonding the three V-shaped plate materials , and a plurality of fixed abrasive grains provided in the adhesive layer, The first to third plate-shaped portions may be configured to include the three V-shaped plate materials, the adhesive layer, and the plurality of fixed abrasive grains .

Further, the plurality of pillars are arranged at each corner of a virtual hexagon that is arranged without gaps along the polishing surface, and each of the plurality of pillars extends in a direction intersecting the polishing surface. , comprising first to third plate-like portions extending in directions different from each other and along the sides of the virtual hexagon with the corners of the virtual hexagon as intersection points, and the first to third plates The shaped portion may be configured to include the three V-shaped plate materials, the adhesive layer, and the plurality of fixed abrasive grains.

Further, the number of the pillar portions per unit area along the polishing surface may increase toward the inside in the radial direction of the polishing plate.

According to the present invention, the polishing plate can be manufactured more easily while making it possible to adjust the processing pressure.

1 is a sectional view of a polishing plate according to a first embodiment of the present invention. FIG. 2 is a top view of the polishing plate according to the first embodiment of the present invention. 3 is an enlarged view of a part of FIG. 2. FIG. 4 is an enlarged view of a part of FIG. 3. FIG. 2 is an enlarged view of range A in FIG. 1. FIG. It is a top view which expanded a part of polishing plate based on the 2nd Embodiment of this invention. 7 is a sectional view taken along line BB in FIG. 6. FIG. (a) and (b) according to a modification of the present invention are partially enlarged top views of a polishing plate. It is a top view which expanded a part of polishing plate based on the modification of this invention.

(First embodiment)
A polishing plate according to a first embodiment of the present invention will be described with reference to the drawings.
As shown in FIG. 1, the polishing device 5 includes a polishing plate 1, a drive section 6 that rotates the polishing plate 1 around a rotation axis O, a workpiece holding section 7 that holds a workpiece W, and a plurality of polishing plates attached to the polishing plate 1. a slurry supply section 45 that supplies slurry 41, which is a liquid abrasive containing free abrasive grains 40. The polishing plate 1 includes a polishing section 10 having a polishing surface 10a for polishing a workpiece W, and a holder 20 holding the polishing section 10.
The workpiece W is, for example, a silicon wafer, ceramics, a semiconductor substrate, an LED (Light Emitting Diode) substrate, a heat dissipation substrate, silicon carbide, alumina, sapphire, or metal.

As shown in FIG. 1, the holder 20 is formed into a disk shape and supports the polishing part 10 from the back surface of the polishing part 10. The holder 20 is fixed to the back surface of the polishing section 10 using fixing means such as adhesive or screws. The holder 20 is integrated with the polishing section 10 and is rotated about the rotation axis O by the drive section 6.

As shown in FIGS. 1 and 2, the polishing section 10 has a flat annular shape extending in a direction perpendicular to the rotation axis O. As shown in FIGS. A rotation axis O along the thickness direction of the polishing section 10 passes through the center of the polishing section 10 . The polishing section 10 is formed symmetrically on the front and back.
As shown in FIG. 3, the polishing section 10 includes a plurality of columnar sections 11 and a holding member 19 that holds the plurality of columnar sections 11. The plurality of pillar portions 11 are each formed into a plate shape with the same shape and size.
Each column portion 11 is formed in a Y-shape when viewed from a direction along the rotation axis O perpendicular to the polishing surface 10a. Each column portion 11 is made of a single metal or a mixed metal selected from copper, tin, lead, cast iron, and the like. As shown in FIG. 5, during polishing, free abrasive grains 40, which will be described later, are caught on the tip end surface 11d of the columnar portion 11. Since the columnar portion 11 has a plate shape along the rotation axis O, the area of the tip surface 11d of the columnar portion 11 is suppressed from increasing. As a result, the processing pressure by which the polishing surface 10a presses the workpiece W through the plurality of free abrasive grains 40 is increased, and the polishing rate can be increased.

As shown in FIG. 3, the plurality of pillars 11 are arranged at each corner of a virtual hexagon Hx arranged without gaps. The plurality of pillar portions 11 are formed in a shape in which the center portions of the sides of the virtual hexagon Hx are omitted.
The virtual hexagons Hx are arranged along the circumferential direction C and the radial direction R of the polishing section 10. The area of the virtual hexagon Hx becomes smaller toward the inner row in the radial direction R. For example, virtual hexagons Hx1 are arranged in a first row L1 along the circumferential direction C, and virtual hexagons Hx2 are arranged in a second row L2 along the circumferential direction C. The second row L2 is located adjacent to the inside of the first row L1 in the radial direction R. The virtual hexagons Hx2 arranged in the second row L2 have a smaller area than the virtual hexagons Hx1 arranged in the first row L1. Further, the virtual hexagons Hx2 arranged in the second row L2 are shifted in the circumferential direction C from the virtual hexagons Hx1 arranged in the first row L1 by a distance that is half the honeycomb diameter of the virtual hexagon Hx1 or the virtual hexagon Hx2. has been done.
Further, the number of columnar portions 11 per unit area of the polishing surface 10a increases toward the inside in the radial direction R. In other words, the intervals between the plurality of column parts 11 in the circumferential direction C become narrower toward the inside in the radial direction R.

As shown in FIG. 4, the column portion 11 includes a first plate portion 11a, a second plate portion 11b, and a third plate portion 11c. The first plate-like portion 11a extends along the radial direction R, and the thickness direction of the first plate-like portion 11a is provided along the circumferential direction C. Each of the plate portions 11a, 11b, and 11c has a rectangular plate shape extending along the rotation axis O (see FIG. 2).
Each of the plate-like portions 11a, 11b, and 11c is connected at one point at its base end, and extends in different directions from the base end toward the distal end, that is, radially. The plate portions 11a, 11b, and 11c are arranged at equal angular intervals, that is, at 120° intervals.

As shown in FIG. 5, the plate thickness H1 of each plate-shaped portion 11a, 11b, 11c is, for example, 1 to 30 times, preferably 2 to 10 times, more than the average particle diameter D1 of the free abrasive grains 40. Preferably, it is set to 3 to 5 times. As an example, when the average particle diameter D1 is 30 μm, the plate thickness H1 of each plate-shaped portion 11a, 11b, 11c is set to 100 μm to 300 μm. For example, when the average grain size D1 is 30 μm, by setting the plate thickness H1 of each plate-shaped portion 11a, 11b, and 11c to 100 μm, three free abrasive grains are formed on the tip surface 11d of the columnar portion 11 during polishing. 40 can be arranged in the direction of the plate thickness H1. In this way, the number of free abrasive grains 40 that can be held simultaneously on the tip surface 11d of the columnar part 11 can be determined by the size relationship between the plate thickness H1 and the average grain size D1 of each plate-like part 11a, 11b, and 11c. . The average particle size D1 is measured, for example, by a laser diffraction scattering method.

As shown in FIG. 3, each of the plate-shaped portions 11a, 11b, and 11c extends along each side of the virtual hexagon Hx. Six pillars 11 having different orientations are arranged at six corners of the virtual hexagon Hx. The intersections of the plate-like portions 11a, 11b, and 11c coincide with the corners of the virtual hexagon Hx.

The holding material 19 is formed over the entire area of the polishing section 10 and holds the plurality of pillar sections 11. The holding member 19 is formed as a separate member so as to have a boundary surface with the plurality of pillar portions 11 . The holding material 19 is filled around each pillar portion 11 . As shown in FIG. 5, each column 11 is embedded in the holding material 19 with the tip end surface 11d of each column 11 exposed.
As shown in FIG. 1, the back surface of the holding member 19 opposite to the polished surface 10a is bonded to the holder 20. The holding member 19 is formed of a material that is more easily deformed by external force than the columnar portion 11 and is more easily worn than the columnar portion 11 during polishing. The holding material 19 is made of resin or ceramic, for example. The holding material 19 may be formed so that fluid cannot pass therethrough, or may be formed porous through which fluid can pass.
As shown in FIG. 5, the distal end surface of the holding member 19 on the opposite side to the holder 20 is located closer to the holder 20 than the distal end surface 11d of the columnar portion 11. Therefore, a space Sp is formed between the holding material 19 and the workpiece W. A slurry 41 (see FIG. 1) containing a plurality of free abrasive grains 40 or chips can pass through the space Sp.

The plurality of free abrasive grains 40 are, for example, diamond or cubic boron nitride (CBN) abrasive grains, or a mixture of diamond and CBN. Furthermore, the free abrasive grains 40 are not limited to this, and may be silicon carbide (SiC), fused alumina (Al ₂ O ₃ ), or a mixture thereof.

Next, a method of polishing the workpiece W using the polishing device 5 will be described.
As shown in FIG. 1, the work holding section 7 holds the work W and brings it into contact with the polishing surface 10a. Then, the drive unit 6 rotates the polishing plate 1 around the rotation axis O while the slurry supply unit 45 supplies the slurry 41 to the polishing surface 10a. As a result, as shown in FIG. 5, the tip surface 11d of each columnar portion 11 temporarily holds each free abrasive grain 40 and then rolls each free abrasive grain 40 between it and the workpiece W. As a result, the workpiece W is polished.
Note that when polishing the work W, the work holding section 7 may rotate the work W.

(effect)
According to the first embodiment described above, the following effects are achieved.
(1) The polishing plate 1 is arranged along the polishing surface 10a on which the workpiece W is polished, and includes a plurality of pillars 11 extending in a direction intersecting the polishing surface 10a, and a plurality of pillars 11 and a separate member. and a holding member 19 that holds the column portion 11. The columnar portion 11 includes a first plate-like portion 11a extending in a direction intersecting the polishing surface 10a.
According to this configuration, unlike the configuration described in Patent Document 1, the thickness of the first plate-like portion 11a of the columnar portion 11 can be adjusted without performing processing to form a groove on the polished surface 10a. Processing pressure can be adjusted. Since the polishing plate 1 does not require processing to form grooves on the polishing surface 10a, the polishing plate 1 can be manufactured more easily.
Further, the first plate-shaped portion 11a extends in a direction intersecting the polishing surface 10a. Therefore, the sharpness of the polishing plate 1 is maintained even if the first plate-like portion 11a is reduced in the direction intersecting the polishing surface 10a due to polishing. The life of the polishing plate 1 can be extended.
Further, the columnar section 11 is configured such that the distal end surface 11d of the columnar section 11 protrudes beyond the distal end surface of the retaining member 19, and the rear end surface on the opposite side of the distal end surface 11d of the columnar section 11 coincides with the rear end surface of the retaining material 19. It is formed.
For example, in the configuration described in Patent Document 1, if the polishing plane wears down to the bottom of the groove, it becomes difficult to polish effectively. On the other hand, according to the above configuration, polishing can be performed even if the column portion 11 and the holding material 19 are worn out.

(2) The first plate-shaped portion 11a includes a tip end surface 11d that rolls free abrasive grains 40 contained in the slurry 41 between the polishing plate 1 and the workpiece W when the polishing plate 1 rotates around the rotation axis O.
According to this configuration, the number of free abrasive grains 40 located between the tip surface 11d and the workpiece W can be adjusted by adjusting the area of the tip surface 11d of the first plate-shaped portion 11a. Thereby, the processing pressure can be adjusted.

(3) The columnar portion 11 includes a first plate-like portion 11a and a second plate-like portion 11b that extends in a direction different from that of the first plate-like portion 11a and is connected to the first plate-like portion 11a.
According to this configuration, the first plate-like part 11a and the second plate-like part 11b are connected while extending in different directions. Therefore, it is difficult for the column portion 11 to bend due to the force received from the workpiece W. Therefore, the polishing rate, which is the amount removed per unit time, can be increased.

(4) The column part 11 extends in a direction different from the first plate part 11a and the second plate part 11b, and the third plate part 11c is connected to the first plate part 11a and the second plate part 11b. Equipped with.
According to this configuration, the column portion 11 is difficult to bend due to the force received from the workpiece W. Therefore, the polishing rate can be increased.

(5) The plurality of columnar parts 11 are arranged at each corner of the virtual hexagon Hx arranged without gaps along the polishing surface 10a. The first plate portion 11a, the second plate portion 11b, and the third plate portion 11c extend in a direction along the sides of the virtual hexagon Hx.
According to this configuration, the six pillars 11 located at each corner of the virtual hexagon Hx are installed in different directions. Therefore, the column portion 11 can be made difficult to bend regardless of the direction of the force received from the workpiece W.

(6) The number of columnar portions 11 per unit area along the polishing surface 10a increases toward the inside of the polishing plate 1 in the radial direction.
When the polishing section 10 rotates around the rotation axis O, the outer portion of the polishing section 10 in the radial direction R rotates at a higher speed than the inner portion of the polishing section 10 in the radial direction R. According to the above configuration, the number of columnar portions 11 per unit area increases toward the inside of the polishing portion 10 in the radial direction. Thereby, the workpiece W can be processed at a uniform polishing rate regardless of the difference in circumferential speed in the radial direction R of the polishing section 10.

(Second embodiment)
A polishing plate according to a second embodiment of the present invention will be described with reference to the drawings. The second embodiment differs from the first embodiment in that a plurality of fixed abrasive grains for polishing are embedded in the pillar portion. Hereinafter, differences from the first embodiment will be mainly described.

As shown in FIG. 6, the column portion 51 is formed in a Y-shaped gap between three V-shaped plate portions 52, 53, 54 and three plate portions 52, 53, 54. It includes an adhesive layer 56 and a plurality of fixed abrasive grains 57 located within the adhesive layer 56. The plate portions 52, 53, and 54 are made of a single metal or a mixed metal selected from copper, tin, lead, cast iron, and the like.
The plate-like portion 52 includes a first wall portion 52a and a second wall portion 52b that are connected to each other at different angles. The plate-like portion 53 includes a first wall portion 53a and a second wall portion 53b that are connected to each other at different angles. The plate-like portion 54 includes a first wall portion 54a and a second wall portion 54b that are connected to each other at different angles.
The first wall portions 52a and 54a face each other and are bonded to each other via a first portion 56a of the adhesive layer 56. The second wall portions 53b and 54b face each other and are bonded to each other via the second portion 56b of the adhesive layer 56. The first wall portion 53a and the second wall portion 52b face each other and are bonded to each other via the third portion 56c of the adhesive layer 56.

The plate-shaped portions 52, 53, and 54 are installed such that their corner portions are located close to the center point Cp of the columnar portion 51, and open in different directions. The plate-shaped portion 52 has a V-shape that opens toward the first direction F1. The plate-shaped portion 53 has a V-shape that opens toward the second direction F2. The plate-shaped portion 54 has a V-shape that opens toward the third direction F3. The first direction F1, the second direction F2, and the third direction F3 are set at different angles from each other at 120° intervals around the center point Cp.

The adhesive layer 56 is formed in a Y-shape when viewed from the direction perpendicular to the polished surface 10a, is formed in the gap between the plate-shaped parts 52, 53, and 54, and bonds the plate-shaped parts 52, 53, and 54 to each other. . A plurality of fixed abrasive grains 57 are distributed within the adhesive layer 56 . The adhesive layer 56 is, for example, epoxy resin or silver solder.
As shown in FIG. 7, the plurality of fixed abrasive grains 57 are embedded in the adhesive layer 56 and arranged in a line along the adhesive layer 56. The plurality of fixed abrasive grains 57 are composed of individual abrasive grains or mixed abrasive grains selected from, for example, diamond abrasive grains, CBN abrasive grains, SiC, or Al ₂ O ₃ .

In this embodiment, when the polishing plate rotates, the fixed abrasive grains 57 exposed at the tips of the columnar parts 51 come into contact with the workpiece W, thereby polishing the workpiece W. During polishing, the plate-like portions 52, 53, and 54 and the adhesive layer 56 are scraped, and the worn fixed abrasive grains 57 fall off, and new fixed abrasive grains 57 are exposed at the tips of the columnar portions 51. This maintains the sharpness of the polishing plate.
In the polishing plate of this embodiment, slurry may not be supplied during polishing, or slurry may be supplied during polishing. When slurry is supplied during polishing, as shown in FIG. is polished. In this case, the work W is polished by both the free abrasive grains 97 of the slurry and the fixed abrasive grains 57 of the pillar portions 51.

(effect)
According to the second embodiment described above, the following effects are achieved.
(1) The columnar portion 51 includes an adhesive layer 56 provided between the plurality of plate-like portions 52, 53, and 54, and a plurality of fixed abrasive grains 57 provided within the adhesive layer 56 and used for polishing the workpiece W. and.
According to this configuration, the columnar portion 51 has a three-layer structure in its thickness direction. In the example of FIG. 7, this three-layer structure consists of an adhesive layer 56 and second wall portions 53b and 54b. Therefore, regardless of the direction of the force received from the workpiece W, the column portion 11 can be made difficult to bend.
When slurry is supplied during polishing, polishing by the free abrasive grains 97 rolling between the tip surfaces of the plate-shaped parts 52, 53, 54 and the workpiece W and polishing by the fixed abrasive grains 57 are performed simultaneously. Polishing with the free abrasive grains 97 can make the workpiece W a smoother surface than polishing with the fixed abrasive grains 57, but the polishing rate is lower. On the other hand, although polishing using the fixed abrasive grains 57 can achieve a higher polishing rate than polishing using the free abrasive grains 97, it is difficult to make the workpiece W a smooth surface. In this regard, according to the above configuration, the portion deeply polished by the fixed abrasive grains 57 is smoothed by the free abrasive grains 97. Therefore, the workpiece W can be smoothed while increasing the polishing rate.

(2) The three plate-like portions 52, 53, and 54 of the columnar portion 51 each form a V-shape when viewed from the direction intersecting the polishing surface 10a. The three plate-like parts 52, 53, and 54 are arranged so that V-shapes open in different directions. The adhesive layer 56 is provided in the Y-shaped gap between the three plate-like parts 52, 53, and 54, and bonds the three plate-like parts 52, 53, and 54 together.
According to this configuration, the column portion 11 can be made difficult to bend regardless of the direction of the force received from the workpiece W.

Note that the present invention is not limited to the above embodiments and drawings. It is possible to make changes (including deletion of constituent elements) as appropriate without changing the gist of the present invention. An example of the modification will be described below.

(Modified example)
In each of the above embodiments, the plurality of columnar parts 11, 51 are arranged at each corner of the virtual hexagon Hx arranged without any gaps, but the arrangement mode is not limited to this. They may be placed at each corner of a polygon, such as a triangle, quadrangle, or octagon.

In each of the embodiments described above, the number of columnar portions 11 and 51 per unit area is set to increase toward the inner side of the polishing portion 10 in the radial direction R. However, the number of pillar portions 11, 51 per unit area may be set to decrease toward the inner side in the radial direction R, or may be set to the same number along the radial direction R.

In each of the embodiments described above, the plurality of column parts 11 and 51 are each formed with the same shape and size, but may be formed with different shapes or sizes.
In each of the embodiments described above, the pillar portions 11 and 51 extend along the rotation axis, but may extend at an angle with respect to the rotation axis.
Further, the polishing surface 10a is not limited to the position in each of the above embodiments, but may be formed on the outer circumferential surface of the polishing plate 1. In this case, the pillar portions 11 and 51 may be arranged on the outer circumferential surface of the polishing plate 1 and may be formed to extend in a direction intersecting the outer circumferential surface.

In each of the above embodiments, the columnar portions 11 and 51 are formed in a Y-shape when viewed from the direction intersecting the polishing surface 10a, but the shape of the columnar portion includes a plate-like portion extending in the direction intersecting the polishing surface 10a. However, it is not limited to this.
For example, as shown in FIG. 8(a), the columnar portion 61 may be formed in an X-shape when viewed from the direction intersecting the polishing surface 10a. The column portion 61 includes a first plate portion 61a and a second plate portion 61b that intersects the first plate portion 61a. The center position of the first plate-shaped portion 61a and the center position of the second plate-shaped portion 61b intersect.
Further, for example, as shown in FIG. 8(b), the columnar portion 71 may be formed in a V-shape when viewed from the direction intersecting the polishing surface 10a. The column portion 71 includes a first plate portion 71a and a second plate portion 71b forming an angle with respect to the first plate portion 71a. An end of the first plate-like part 71a and an end of the second plate-like part 71b are connected.
Furthermore, the columnar portion may be formed in an N-shape, an L-shape, a T-shape, a Z-shape, or a cross shape when viewed from the direction intersecting the polishing surface 10a.
Moreover, as shown in FIG. 9, the column part may be comprised from the flat plate-shaped part 82 extended along the radial direction R. Each plate-shaped portion 82 is provided such that the thickness direction of the plate-shaped portion 82 is along the circumferential direction C.

DESCRIPTION OF SYMBOLS 1... Polishing plate, 5... Polishing device, 6... Drive part, 7... Work holding part, 10... Polishing part, 10a... Polishing surface, 11, 51, 61, 71... Pillar part, 11a, 61a, 71a... First Plate-shaped part, 11b, 61b, 71b... Second plate-shaped part, 11c... Third plate-shaped part, 11d... Tip surface, 19... Holding material, 20... Holder, 40, 97... Free abrasive grain, 41... Slurry, 45... Slurry supply part, 52, 53, 54, 82... Plate-shaped part, 52a, 53a, 54a... First wall part, 52b, 53b, 54b... Second wall part, 56... Adhesive layer, 57... Fixed abrasive grain , C...circumferential direction, D1...average grain size, F1...first direction, F2...second direction, F3...third direction, H1...plate thickness, L1...first row, L2...second row, O...rotation Axis, R...radial direction, W...work, Cp...center point, Hx, Hx1, Hx2...virtual hexagon, Sp...space

Claims (6)

a plurality of pillars arranged at intervals along a polishing surface on which a workpiece is polished and extending in a direction intersecting the polishing surface;
a holding member formed of a separate member from the plurality of pillars and holding the plurality of pillars;
The plurality of columnar parts are arranged at each corner of a virtual hexagon arranged without gaps along the polishing surface, and polish the workpiece with a tip end surface located on the polishing surface,
Each of the plurality of pillars extends in a direction intersecting the polishing surface, and each of the plurality of pillars extends in a direction different from the other with the corner of the virtual hexagon as an intersection, and in a direction along the sides of the virtual hexagon. comprising 1 to 3 plate-like parts ,
The distance between the plurality of columnar parts is left by the first to third plate-shaped parts not being formed in the center of the sides of the virtual hexagon,
polishing plate. a plurality of pillars arranged along a polishing surface on which a workpiece is polished and extending in a direction intersecting the polishing surface;
a holding member formed of a separate member from the plurality of pillars and holding the plurality of pillars;
The pillar portion is
three V-shaped plates extending in a direction intersecting the polishing surface, each having a V-shape when viewed from the direction intersecting the polishing surface, and arranged so as to open in different directions;
an adhesive layer provided in a Y-shaped gap between the three V-shaped plate materials and bonding the three V-shaped plate materials ;
a plurality of fixed abrasive grains provided within the adhesive layer;
polishing plate. The pillar portion includes a tip surface that rolls free abrasive grains between the polishing plate and the workpiece when the polishing plate is rotating.
The polishing plate according to claim 1 or 2 . The pillar portion is
three V-shaped plates extending in a direction intersecting the polishing surface, each having a V-shape when viewed from the direction intersecting the polishing surface, and arranged so as to open in different directions;
an adhesive layer provided in a Y-shaped gap between the three V-shaped plate materials and bonding the three V-shaped plate materials ;
A plurality of fixed abrasive grains provided in the adhesive layer,
The first to third plate-shaped portions are composed of the three V-shaped plate materials, the adhesive layer, and the plurality of fixed abrasive grains,
The polishing plate according to claim 1 . The plurality of pillars are arranged at each corner of a virtual hexagon arranged without gaps along the polishing surface,
Each of the plurality of pillars extends in a direction intersecting the polishing surface, and each of the plurality of pillars extends in a direction different from the other with the corner of the virtual hexagon as an intersection, and in a direction along the sides of the virtual hexagon . comprising 1 to 3 plate-like parts,
The first to third plate-shaped portions are composed of the three V-shaped plate materials, the adhesive layer, and the plurality of fixed abrasive grains,
The polishing plate according to claim 2 . The number of the pillar portions per unit area along the polishing surface increases toward the inside in the radial direction of the polishing plate,
The polishing plate according to any one of claims 1 to 5 .