JP2022548986A5 - - Google Patents

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Publication number
JP2022548986A5
JP2022548986A5 JP2022518281A JP2022518281A JP2022548986A5 JP 2022548986 A5 JP2022548986 A5 JP 2022548986A5 JP 2022518281 A JP2022518281 A JP 2022518281A JP 2022518281 A JP2022518281 A JP 2022518281A JP 2022548986 A5 JP2022548986 A5 JP 2022548986A5
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JP
Japan
Prior art keywords
polishing composition
acid
chemical mechanical
group
combinations
Prior art date
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Application number
JP2022518281A
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English (en)
Japanese (ja)
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JP2022548986A (ja
JP7803852B2 (ja
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Priority claimed from PCT/US2020/051901 external-priority patent/WO2021061591A1/en
Publication of JP2022548986A publication Critical patent/JP2022548986A/ja
Publication of JP2022548986A5 publication Critical patent/JP2022548986A5/ja
Application granted granted Critical
Publication of JP7803852B2 publication Critical patent/JP7803852B2/ja
Active legal-status Critical Current
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JP2022518281A 2019-09-24 2020-09-22 平坦化におけるダイ内不均一性 Active JP7803852B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201962904861P 2019-09-24 2019-09-24
US62/904,861 2019-09-24
PCT/US2020/051901 WO2021061591A1 (en) 2019-09-24 2020-09-22 With-in die non-uniformities (wid-nu) in planarization

Publications (3)

Publication Number Publication Date
JP2022548986A JP2022548986A (ja) 2022-11-22
JP2022548986A5 true JP2022548986A5 (enExample) 2023-07-03
JP7803852B2 JP7803852B2 (ja) 2026-01-21

Family

ID=75166383

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022518281A Active JP7803852B2 (ja) 2019-09-24 2020-09-22 平坦化におけるダイ内不均一性

Country Status (8)

Country Link
US (1) US20220372332A1 (enExample)
EP (1) EP4034606A4 (enExample)
JP (1) JP7803852B2 (enExample)
KR (1) KR20220066937A (enExample)
CN (1) CN114450366B (enExample)
IL (1) IL291525B2 (enExample)
TW (1) TWI795674B (enExample)
WO (1) WO2021061591A1 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20250171658A1 (en) * 2022-03-14 2025-05-29 Versum Materials Us, Llc Stable Chemical Mechanical Planarization Polishing Compositions And Methods For High Rate Silicon Oxide Removal

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG144688A1 (en) 2001-07-23 2008-08-28 Fujimi Inc Polishing composition and polishing method employing it
US6692546B2 (en) * 2001-08-14 2004-02-17 Advanced Technology Materials, Inc. Chemical mechanical polishing compositions for metal and associated materials and method of using same
US7300601B2 (en) * 2002-12-10 2007-11-27 Advanced Technology Materials, Inc. Passivative chemical mechanical polishing composition for copper film planarization
WO2007047454A2 (en) * 2005-10-14 2007-04-26 Applied Materials, Inc. Process and composition for electrochemical mechanical polishing
WO2007102138A2 (en) * 2007-01-02 2007-09-13 Freescale Semiconductor, Inc. Barrier slurry compositions and barrier cmp methods
US20090032765A1 (en) * 2007-08-03 2009-02-05 Jinru Bian Selective barrier polishing slurry
TW200946621A (en) * 2007-10-29 2009-11-16 Ekc Technology Inc Chemical mechanical polishing and wafer cleaning composition comprising amidoxime compounds and associated method for use
EP2649144A4 (en) 2010-12-10 2014-05-14 Basf Se AQUEOUS POLISHING COMPOSITION AND METHOD FOR THE CHEMICAL-MECHANICAL POLISHING OF SUBSTRATES WITH DIELECTRIC SILICON OXIDE AND POLYSILICIUM FILMS
US8916061B2 (en) * 2012-03-14 2014-12-23 Cabot Microelectronics Corporation CMP compositions selective for oxide and nitride with high removal rate and low defectivity
JP5927059B2 (ja) 2012-06-19 2016-05-25 株式会社フジミインコーポレーテッド 研磨用組成物及びそれを用いた基板の製造方法
US20150104940A1 (en) * 2013-10-11 2015-04-16 Air Products And Chemicals Inc. Barrier chemical mechanical planarization composition and method thereof
US9752057B2 (en) * 2014-02-05 2017-09-05 Cabot Microelectronics Corporation CMP method for suppression of titanium nitride and titanium/titanium nitride removal
US10217645B2 (en) * 2014-07-25 2019-02-26 Versum Materials Us, Llc Chemical mechanical polishing (CMP) of cobalt-containing substrate
US10570313B2 (en) 2015-02-12 2020-02-25 Versum Materials Us, Llc Dishing reducing in tungsten chemical mechanical polishing
US10032644B2 (en) * 2015-06-05 2018-07-24 Versum Materials Us, Llc Barrier chemical mechanical planarization slurries using ceria-coated silica abrasives
US10144850B2 (en) * 2015-09-25 2018-12-04 Versum Materials Us, Llc Stop-on silicon containing layer additive
TWI642810B (zh) * 2016-06-07 2018-12-01 美商卡博特微電子公司 用於處理鎳基板表面之化學機械加工漿料及方法
US10253216B2 (en) 2016-07-01 2019-04-09 Versum Materials Us, Llc Additives for barrier chemical mechanical planarization
US20190127607A1 (en) * 2017-10-27 2019-05-02 Versum Materials Us, Llc Composite Particles, Method of Refining and Use Thereof

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