JP2022545610A - エッジ接点接続を採用するアンテナ要素及びicチップを有する集積構造 - Google Patents
エッジ接点接続を採用するアンテナ要素及びicチップを有する集積構造 Download PDFInfo
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- JP2022545610A JP2022545610A JP2022504502A JP2022504502A JP2022545610A JP 2022545610 A JP2022545610 A JP 2022545610A JP 2022504502 A JP2022504502 A JP 2022504502A JP 2022504502 A JP2022504502 A JP 2022504502A JP 2022545610 A JP2022545610 A JP 2022545610A
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Abstract
Description
関連技術の考察
Claims (31)
- 第1の外面(135)に空洞(140)を有する基板(130)であって、前記空洞(140)の一部を画定する側壁(144)を有し、第1のエッジ接点(132)が前記側壁(144)に形成されている基板と、
前記空洞(140)内に配置された集積回路(IC)チップ(110)であって、前記側壁(144)に面する側面(117)と、前記第1のエッジ接点(132)に電気的に接続された前記側面(117)に形成された第2のエッジ接点(112)とを有する集積回路(IC)チップと、
前記第1の外面(135)に対向する前記基板(130)の第2の外面(139)に配置されたアンテナ要素(120)であって、前記基板(130)内に延在する導電性ビア(122)を介して前記ICチップ(110)内の無線周波数(RF)回路に電気的に接続されているアンテナ要素と、を備えるアンテナ装置。 - 前記ICチップ(110)内の前記RF回路への前記アンテナ要素(120)の電気接続が、前記第1のエッジ接点及び前記第2のエッジ接点を介して行われる、請求項1に記載のアンテナ装置。
- 前記第1の外面(135)上又は内部にあり、前記第1のエッジ接点(132)に接続される導電性トレース(165)を更に備え、前記RF回路への前記アンテナ要素(120)の電気接続が、前記導電性ビア(122)を通して前記導電性トレース(165)まで行われる、請求項2に記載のアンテナ装置。
- 前記空洞(140)は、前記ICチップ(110)の底面に面する底面を有し、
前記導電性ビア(122)は、前記空洞(140)の前記底面まで延在し、かつ前記RF回路に接続された前記ICチップ(110)の前記底面にある接続要素に接続されている、請求項1~3のいずれか一項に記載のアンテナ装置。 - 前記接続要素は、はんだバンプを含む、請求項4に記載のアンテナ装置。
- 前記接続要素は、導電性ピラーを含む、請求項5に記載のアンテナ装置。
- 前記基板(130)内に接地平面(170)を更に備える、請求項1~6のいずれか一項に記載のアンテナ装置。
- 前記空洞(140)は、前記ICチップ(110)の底面に面する底面を有し、前記接地平面(170)の一部は、前記空洞(140)の前記底面に形成されている、請求項7に記載のアンテナ装置。
- 前記アンテナ要素(120)は第1のアンテナ要素であり、前記アンテナ装置は、前記第2の外面(139)に配置された少なくとも1つの第2のアンテナ要素を更に備え、前記少なくとも1つの第2のアンテナ要素は、前記基板(130)内に延在し、かつ前記少なくとも1つの第2のアンテナ要素に接続される少なくとも1つの更なる導電性ビア(122)を介して前記ICチップ(110)内の前記RF回路に電気的に接続されている、請求項1~8のいずれか一項に記載のアンテナ装置。
- 前記第1のアンテナ要素及び前記第2のアンテナ要素は、アンテナアレイの一部であり、前記ICチップ(110)内の前記RF回路は、前記アンテナアレイによって形成されたビームを方向付けするためのビーム形成構成要素を備える、請求項9に記載のアンテナ装置。
- 前記第1のエッジ接点及び前記第2のエッジ接点は、互いにはんだ付けされている、請求項1~10のいずれか一項に記載のアンテナ装置。
- 前記側壁(144)及び前記側面(117)は、相補的形状を有するそれぞれ第1のインターロック形状及び第2のインターロック形状を有し、前記第1のインターロック形状及び前記第2のインターロック形状は互いにインターロックされている、請求項1~11のいずれか一項に記載のアンテナ装置。
- 前記第1のインターロック形状は、前記側壁(144)の凹部又は前記側壁(144)からの突出部であり、前記第2のインターロック形状は、それぞれ前記側面(117)からの相補的突出部又は前記側面(117)内の相補的凹部である、請求項12に記載のアンテナ装置。
- 前記第1のエッジ接点及び前記第2のエッジ接点は、前記第1のインターロック形状及び前記第2のインターロック形状のそれぞれの表面上に配置されている、請求項12に記載のアンテナ装置。
- 前記側壁(144)は第1の側壁であり、前記空洞(140)は前記第1の側壁に対向する第2の側壁を有し、第3のエッジ接点は前記第2の側壁に形成されており、
前記側面(117)は第1の側面であり、前記ICチップ(110)は、前記第1の側面に対向する第2の側面と、前記第3のエッジ接点に接続された前記第2の側面上の第4のエッジ接点とを有する、請求項12に記載のアンテナ装置。 - 前記空洞(140)は、第2の空洞部分の直接下に第1の空洞部分を有する二重空洞構造を有し、前記第1の空洞部分は、前記第2の空洞部分の第2の周長よりも小さい第1の周長を有し、
前記側壁(144)は、前記第1の空洞部分の一部を画定する第1の側壁であり、前記基板(130)は、前記第2の空洞部分の一部を画定する第2の側壁を有し、第3のエッジ接点が前記第2の側壁に形成されており、
前記ICチップ(110)は、前記第1の空洞部分内に配置された第1のICチップであり、
前記アンテナ装置は、第2のICチップを更に備え、該第2のICチップは、前記第2の空洞部分内に配置されており、前記第3のエッジ接点に電気的に接続された第4のエッジ接点を有する、請求項1~15のいずれか一項に記載のアンテナ装置。 - 前記第1のICチップ及び前記第2のICチップは、互いに電気的に接続されている、請求項16に記載のアンテナ装置。
- 前記第1のICチップは、前記アンテナ要素(120)に電気的に接続された増幅器を備え、前記第2のICチップは、前記増幅器に接続されたビーム形成ネットワーク回路を備える、請求項17に記載のアンテナ装置。
- 前記第1のICチップは、第1の半導体材料を含み、前記第2のICチップは、前記第1の半導体IC材料とは異なる第2の半導体材料を含む、請求項18に記載のアンテナ装置。
- 前記第1のICチップの上面は、エアギャップ又はアンダーフィル材料によって前記第2のICチップの底面から分離されている、請求項18に記載のアンテナ装置。
- アンテナ装置を製造する方法であって、
基板(130)の第1の外面(135)に空洞(140)を形成することと、
前記第1の外面(135)に対向する前記基板(130)の第2の外面(139)上にアンテナ要素(120)を形成することと、
前記空洞(140)の側壁(144)に第1のエッジ接点(132)を形成することと、
側面(117)に形成された第2のエッジ接点(112)を有し、無線周波数(RF)回路を備える集積回路(IC)チップ(110)を提供することと、
前記ICチップ(110)を前記空洞(140)に配置することと、
前記第1のエッジ接点と前記第2のエッジ接点とを電気的に接続することと、
前記第2の外面(139)から前記基板(130)内に延在する導電性ビア(122)を形成することと、
前記アンテナ要素(120)を前記導電性ビア(122)を介して前記RF回路に電気的に接続することと、を含む方法。 - 前記基板(130)内に導電性トレース(165)を形成し、前記基板(130)の前記第1の外面(135)上で又は前記基板の内部で、前記第1のエッジ接点(132)に接続することと、
前記導電性ビア(122)を前記導電性トレース(165)に接続することと、
前記アンテナ要素(120)を前記導電性ビア(122)を介して前記導電性トレース(165)に電気的に接続し、それによって前記アンテナ要素(120)を前記RF回路に接続することと
を更に含む、請求項21に記載の方法。 - 前記空洞(140)が底面を備えるように形成されており、前記ICチップ(110)は、当該ICチップ(110)が前記空洞の中に配置されたときに当該空洞(140)の前記底面に面する底面を有する、請求項22に記載の方法であって、前記方法は、
前記空洞(140)の前記底面に接続要素を形成することと、
前記ICチップ(110)の前記底面の電気接点を介して前記接続要素を前記RF回路に電気的に接続することと、
前記導電性ビア(122)を前記接続要素に接続し、それによって前記アンテナ要素(120)を前記RF回路に接続することと
を更に含む、請求項22に記載の方法。 - 前記空洞(140)が、第2の空洞部分の直接下にある第1の空洞部分を有する二重空洞構造を有するように形成されており、前記第1の空洞部分は、前記第2の空洞部分の第2の周長よりも小さい第1の周長を有し、前記ICチップは第1のICチップであり、前記ICチップの配置は、前記第1のICチップを前記第1の空洞部分内に配置することを含み、
前記空洞(140)は、前記第1の空洞部分の一部を画定する第1の側壁である前記側壁(144)と、前記第2の空洞部分の一部を画定する前記基板(130)の第2の側壁とで形成されている、請求項22に記載の方法であって、前記方法は、
前記第2の側壁に第3のエッジ接点を形成することと、
第4のエッジ接点を側面(117)に有する第2のICチップを前記第2の空洞部分に配置することと、
前記第4のエッジ接点を前記第3のエッジ接点に電気的に接続することと
を更に含む、請求項22に記載の方法。 - 前記側壁(144)に第1のインターロック形状を形成することと、
前記第1のインターロック形状と相補的な形状を有する第2のインターロック形状を前記側面に形成することと、
前記空洞(140)への前記ICチップ(110)の配置は、前記第1のインターロック形状と前記第2のインターロック形状とがインターロックされるように、前記ICチップを前記空洞(140)にスナップ嵌めすることを含むことと
を更に含む、請求項22に記載の方法。 - 前記第1のインターロック形状は、レーザ穴あけを使用して形成される、請求項25に記載の方法。
- 前記第1のインターロック形状は、光露光及びエッチングを使用して形成される、請求項25に記載の方法。
- 前記第1のインターロック形状をめっきして、前記第1のインターロック形状の表面に前記第1のエッジ接点(132)を形成することを含む、請求項22に記載の方法。
- 前記基板(130)は、上部基板(130b)と、下部基板(130a)と、前記上部基板と前記下部基板との間にある接地平面(170)とを含み、前記空洞(140)の形成、前記アンテナ要素(120)の形成、前記第1のエッジ接点(132)の形成、及び前記導電性ビア(122)の形成は、
前記下部基板(130a)の底面に前記アンテナ要素(120)を形成することと、
少なくとも1つの開口部を有する前記下部基板(130a)の上面に前記接地平面(170)を形成することと、
前記上部基板に少なくとも1つのノッチをカッティングし、前記少なくとも1つのノッチを金属化することと、
前記ノッチに隣接する領域で前記上部基板(130b)に切り欠きを作製し、前記切り欠きが作製された後、前記少なくとも1つのノッチが前記第1のエッジ接点(132)を形成することと、
前記上部基板(130b)を前記下部基板(130a)に接合することであって、接合後に、前記上部基板(130b)から切り取られた領域が前記空洞(140)を形成する、ことと、
前記接地平面(170)内の前記少なくとも1つの開口部を通して前記導電性ビア(122)を形成することと
を含む、請求項21~28のいずれか一項に記載の方法。 - 電子的に方向付け可能なアンテナアレイを製造する方法であって、
基板(130)内に、前記基板(130)の第1の外面(135)に沿って空間的に配置された複数の空洞を形成することと、
前記第1の外面(135)に対向する前記基板(130)の第2の外面(139)上に空間的に配置された複数のアンテナ要素(120)を形成することと、
複数の集積回路(IC)チップ(110)を提供し、各々がそれぞれ第2のエッジ接点(112)を備えた側面を有し、各ICチップがビーム形成構成要素を含むことと、
前記空洞の各々に対して、
前記空洞(140)の側壁(144)に第1のエッジ接点(132)を形成することと、
前記複数のICチップ(110)のそれぞれ1つを前記空洞(140)に配置することと、
それぞれの前記第1のエッジ接点と前記第2のエッジ接点(112)とを電気的に接続することと、
内部に配置された前記ICチップ(110)の前記ビーム形成構成要素を、前記アンテナ要素(120)のそれぞれ少なくとも1つに電気的に接続することと
を含む、方法。 - 前記ICチップ(110)の各々の側面に第1のインターロック形状を形成することと、
前記空洞の各々に対して、
前記側壁(144)上に、内部に配置されたそれぞれの前記ICチップ(110)の前記第1のインターロック形状と相補的な形状を有する第2のインターロック形状を形成することと、
前記空洞(140)へのそれぞれの前記ICチップ(110)の配置は、それぞれの前記第1のインターロック形状と前記第2のインターロック形状とがインターロックされるように、それぞれの前記ICチップ(110)を前記空洞(140)にスナップ嵌めすることを含むことと
を更に含む、請求項30に記載の方法。
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