JP2022541992A - ペロブスカイト様構造を有する有機-無機金属-ハロゲン化物化合物の半導体膜の生産方法 - Google Patents
ペロブスカイト様構造を有する有機-無機金属-ハロゲン化物化合物の半導体膜の生産方法 Download PDFInfo
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- JP2022541992A JP2022541992A JP2021573164A JP2021573164A JP2022541992A JP 2022541992 A JP2022541992 A JP 2022541992A JP 2021573164 A JP2021573164 A JP 2021573164A JP 2021573164 A JP2021573164 A JP 2021573164A JP 2022541992 A JP2022541992 A JP 2022541992A
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- -1 metal-halide compounds Chemical class 0.000 title claims abstract description 39
- 229910001507 metal halide Inorganic materials 0.000 title claims abstract description 21
- 239000004065 semiconductor Substances 0.000 title claims abstract description 11
- 238000004519 manufacturing process Methods 0.000 title abstract description 7
- 239000003153 chemical reaction reagent Substances 0.000 claims abstract description 102
- 239000002243 precursor Substances 0.000 claims abstract description 63
- 238000000034 method Methods 0.000 claims abstract description 57
- 239000000203 mixture Substances 0.000 claims abstract description 44
- 229910052736 halogen Inorganic materials 0.000 claims abstract description 37
- 150000002367 halogens Chemical class 0.000 claims abstract description 37
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 26
- 150000001875 compounds Chemical class 0.000 claims abstract description 25
- 239000000758 substrate Substances 0.000 claims abstract description 25
- 229910052751 metal Inorganic materials 0.000 claims abstract description 18
- 239000002184 metal Substances 0.000 claims abstract description 18
- 229910052797 bismuth Inorganic materials 0.000 claims abstract description 16
- 229910052718 tin Inorganic materials 0.000 claims abstract description 16
- 150000001768 cations Chemical class 0.000 claims abstract description 15
- 229910052745 lead Inorganic materials 0.000 claims abstract description 13
- 150000003839 salts Chemical group 0.000 claims abstract description 12
- 150000001450 anions Chemical class 0.000 claims abstract description 8
- 150000002739 metals Chemical class 0.000 claims abstract description 6
- 150000005309 metal halides Chemical class 0.000 claims abstract description 5
- PNKUSGQVOMIXLU-UHFFFAOYSA-N Formamidine Chemical compound NC=N PNKUSGQVOMIXLU-UHFFFAOYSA-N 0.000 claims abstract description 3
- BAVYZALUXZFZLV-UHFFFAOYSA-O Methylammonium ion Chemical compound [NH3+]C BAVYZALUXZFZLV-UHFFFAOYSA-O 0.000 claims abstract description 3
- ZRALSGWEFCBTJO-UHFFFAOYSA-O guanidinium Chemical compound NC(N)=[NH2+] ZRALSGWEFCBTJO-UHFFFAOYSA-O 0.000 claims abstract 2
- 239000012071 phase Substances 0.000 claims description 34
- 238000011282 treatment Methods 0.000 claims description 30
- 239000000126 substance Substances 0.000 claims description 17
- 239000002904 solvent Substances 0.000 claims description 16
- 239000012528 membrane Substances 0.000 claims description 13
- 239000002131 composite material Substances 0.000 claims description 12
- 238000004528 spin coating Methods 0.000 claims description 8
- 229910045601 alloy Inorganic materials 0.000 claims description 6
- 239000000956 alloy Substances 0.000 claims description 6
- 239000000443 aerosol Substances 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 4
- 238000007641 inkjet printing Methods 0.000 claims description 4
- 239000007790 solid phase Substances 0.000 claims description 4
- 238000000354 decomposition reaction Methods 0.000 claims description 3
- 239000011261 inert gas Substances 0.000 claims description 3
- 239000007791 liquid phase Substances 0.000 claims description 3
- 239000007921 spray Substances 0.000 claims description 3
- 238000007740 vapor deposition Methods 0.000 claims description 3
- 238000005229 chemical vapour deposition Methods 0.000 claims description 2
- 239000000084 colloidal system Substances 0.000 claims description 2
- 238000003618 dip coating Methods 0.000 claims description 2
- 239000000839 emulsion Substances 0.000 claims description 2
- 238000007650 screen-printing Methods 0.000 claims description 2
- 239000000725 suspension Substances 0.000 claims description 2
- 238000000889 atomisation Methods 0.000 claims 1
- 239000010408 film Substances 0.000 abstract description 104
- 239000000463 material Substances 0.000 abstract description 34
- 239000010409 thin film Substances 0.000 abstract description 6
- 230000005693 optoelectronics Effects 0.000 abstract description 4
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 abstract description 2
- 239000011368 organic material Substances 0.000 abstract description 2
- 239000000306 component Substances 0.000 description 73
- 239000010410 layer Substances 0.000 description 57
- 238000006243 chemical reaction Methods 0.000 description 42
- 150000004820 halides Chemical class 0.000 description 25
- 239000000243 solution Substances 0.000 description 23
- 230000008569 process Effects 0.000 description 13
- 239000002245 particle Substances 0.000 description 11
- 238000000137 annealing Methods 0.000 description 10
- 238000012805 post-processing Methods 0.000 description 10
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 7
- 239000011358 absorbing material Substances 0.000 description 7
- 229910052740 iodine Inorganic materials 0.000 description 7
- 239000011630 iodine Substances 0.000 description 7
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 239000000155 melt Substances 0.000 description 5
- 230000007935 neutral effect Effects 0.000 description 5
- 238000005507 spraying Methods 0.000 description 5
- UPHCENSIMPJEIS-UHFFFAOYSA-N 2-phenylethylazanium;iodide Chemical compound [I-].[NH3+]CCC1=CC=CC=C1 UPHCENSIMPJEIS-UHFFFAOYSA-N 0.000 description 4
- 239000006227 byproduct Substances 0.000 description 4
- 238000000151 deposition Methods 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 230000009257 reactivity Effects 0.000 description 4
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 3
- 238000001311 chemical methods and process Methods 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 239000002346 layers by function Substances 0.000 description 3
- 150000002892 organic cations Chemical class 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- 238000003786 synthesis reaction Methods 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- QWANGZFTSGZRPZ-UHFFFAOYSA-N aminomethylideneazanium;bromide Chemical compound Br.NC=N QWANGZFTSGZRPZ-UHFFFAOYSA-N 0.000 description 2
- QHJPGANWSLEMTI-UHFFFAOYSA-N aminomethylideneazanium;iodide Chemical compound I.NC=N QHJPGANWSLEMTI-UHFFFAOYSA-N 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- XQPRBTXUXXVTKB-UHFFFAOYSA-M caesium iodide Chemical compound [I-].[Cs+] XQPRBTXUXXVTKB-UHFFFAOYSA-M 0.000 description 2
- 239000002800 charge carrier Substances 0.000 description 2
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 2
- 229920001940 conductive polymer Polymers 0.000 description 2
- 230000026030 halogenation Effects 0.000 description 2
- 238000005658 halogenation reaction Methods 0.000 description 2
- 238000010348 incorporation Methods 0.000 description 2
- 238000011031 large-scale manufacturing process Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000002798 polar solvent Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 229910052701 rubidium Inorganic materials 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 2
- 229910001887 tin oxide Inorganic materials 0.000 description 2
- 238000001771 vacuum deposition Methods 0.000 description 2
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- 229940126062 Compound A Drugs 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- BDAGIHXWWSANSR-UHFFFAOYSA-M Formate Chemical compound [O-]C=O BDAGIHXWWSANSR-UHFFFAOYSA-M 0.000 description 1
- NLDMNSXOCDLTTB-UHFFFAOYSA-N Heterophylliin A Natural products O1C2COC(=O)C3=CC(O)=C(O)C(O)=C3C3=C(O)C(O)=C(O)C=C3C(=O)OC2C(OC(=O)C=2C=C(O)C(O)=C(O)C=2)C(O)C1OC(=O)C1=CC(O)=C(O)C(O)=C1 NLDMNSXOCDLTTB-UHFFFAOYSA-N 0.000 description 1
- 101100328536 Mus musculus Cntd1 gene Proteins 0.000 description 1
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 229910006404 SnO 2 Inorganic materials 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 150000001350 alkyl halides Chemical class 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- CALQKRVFTWDYDG-UHFFFAOYSA-N butan-1-amine;hydroiodide Chemical compound [I-].CCCC[NH3+] CALQKRVFTWDYDG-UHFFFAOYSA-N 0.000 description 1
- QCOGKXLOEWLIDC-UHFFFAOYSA-O butyl(methyl)azanium Chemical compound CCCC[NH2+]C QCOGKXLOEWLIDC-UHFFFAOYSA-O 0.000 description 1
- DQZRNCYNPUUEMR-UHFFFAOYSA-N butyl(methyl)azanium;iodide Chemical compound [I-].CCCC[NH2+]C DQZRNCYNPUUEMR-UHFFFAOYSA-N 0.000 description 1
- HQABUPZFAYXKJW-UHFFFAOYSA-O butylazanium Chemical compound CCCC[NH3+] HQABUPZFAYXKJW-UHFFFAOYSA-O 0.000 description 1
- 229910052792 caesium Inorganic materials 0.000 description 1
- TVFDJXOCXUVLDH-UHFFFAOYSA-N caesium atom Chemical compound [Cs] TVFDJXOCXUVLDH-UHFFFAOYSA-N 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 150000001767 cationic compounds Chemical class 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 238000002144 chemical decomposition reaction Methods 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000002322 conducting polymer Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- RKTYLMNFRDHKIL-UHFFFAOYSA-N copper;5,10,15,20-tetraphenylporphyrin-22,24-diide Chemical compound [Cu+2].C1=CC(C(=C2C=CC([N-]2)=C(C=2C=CC=CC=2)C=2C=CC(N=2)=C(C=2C=CC=CC=2)C2=CC=C3[N-]2)C=2C=CC=CC=2)=NC1=C3C1=CC=CC=C1 RKTYLMNFRDHKIL-UHFFFAOYSA-N 0.000 description 1
- MXIRHCBUSWBUKI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCC[CH2+] MXIRHCBUSWBUKI-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000003517 fume Substances 0.000 description 1
- 239000012433 hydrogen halide Substances 0.000 description 1
- 229910000039 hydrogen halide Inorganic materials 0.000 description 1
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical compound I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 230000004941 influx Effects 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 229910001411 inorganic cation Inorganic materials 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- PNDPGZBMCMUPRI-UHFFFAOYSA-N iodine Chemical compound II PNDPGZBMCMUPRI-UHFFFAOYSA-N 0.000 description 1
- RQQRAHKHDFPBMC-UHFFFAOYSA-L lead(ii) iodide Chemical compound I[Pb]I RQQRAHKHDFPBMC-UHFFFAOYSA-L 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 210000001161 mammalian embryo Anatomy 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- ISWNAMNOYHCTSB-UHFFFAOYSA-N methanamine;hydrobromide Chemical compound [Br-].[NH3+]C ISWNAMNOYHCTSB-UHFFFAOYSA-N 0.000 description 1
- LLWRXQXPJMPHLR-UHFFFAOYSA-N methylazanium;iodide Chemical compound [I-].[NH3+]C LLWRXQXPJMPHLR-UHFFFAOYSA-N 0.000 description 1
- 238000001000 micrograph Methods 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- DIOQZVSQGTUSAI-UHFFFAOYSA-N n-butylhexane Natural products CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 1
- UMXXGDJOCQSQBV-UHFFFAOYSA-N n-ethyl-n-(triethoxysilylmethyl)ethanamine Chemical compound CCO[Si](OCC)(OCC)CN(CC)CC UMXXGDJOCQSQBV-UHFFFAOYSA-N 0.000 description 1
- 239000012454 non-polar solvent Substances 0.000 description 1
- 230000006911 nucleation Effects 0.000 description 1
- 238000010899 nucleation Methods 0.000 description 1
- NOUWNNABOUGTDQ-UHFFFAOYSA-N octane Chemical compound CCCCCCC[CH2+] NOUWNNABOUGTDQ-UHFFFAOYSA-N 0.000 description 1
- 238000005191 phase separation Methods 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000002683 reaction inhibitor Substances 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 239000013557 residual solvent Substances 0.000 description 1
- 238000004626 scanning electron microscopy Methods 0.000 description 1
- 238000004621 scanning probe microscopy Methods 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000007764 slot die coating Methods 0.000 description 1
- 238000009987 spinning Methods 0.000 description 1
- 125000003003 spiro group Chemical group 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- CDTCEQPLAWQMLB-UHFFFAOYSA-J tetraiodoplumbane Chemical compound I[Pb](I)(I)I CDTCEQPLAWQMLB-UHFFFAOYSA-J 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 238000002207 thermal evaporation Methods 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/50—Organic perovskites; Hybrid organic-inorganic perovskites [HOIP], e.g. CH3NH3PbI3
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/18—Metallic material, boron or silicon on other inorganic substrates
- C23C14/185—Metallic material, boron or silicon on other inorganic substrates by cathodic sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/20—Metallic material, boron or silicon on organic substrates
- C23C14/205—Metallic material, boron or silicon on organic substrates by cathodic sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/58—After-treatment
- C23C14/5846—Reactive treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
- C23C26/02—Coating not provided for in groups C23C2/00 - C23C24/00 applying molten material to the substrate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
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Abstract
Description
特許請求された発明に特に関連する既知の文書は次のとおりである:
国際公開第2018124938号(A1)「Methods for producing light-absorbing materials with perovskite structure and liquid polyhalides of variable composition for their implementation」、ロシア国特許出願公開第2685296号明細書「method for producing a film of light-absorbing material with a perovskite-like structure」、
及びロシア国特許出願公開第2675610号明細書「a method for producing a film of a light-absorbing material with a perovskite-like structure」。
2)セシウム及びホルムアミジニウム(FA+)カチオンを含む混合カチオンペロブスカイトの形成中の相分離。これは、低温での化学変換プロセスにより、非ペロブスカイト低温相、例えば、δ-CsPbI3、δ-FAPbI3が不可逆的に形成されるためである。
本発明の文脈において、ペロブスカイト様構造は、ペロブスカイト構造及びペロブスカイト構造に由来する任意の構造の両方を意味する。したがって、本明細書で使用される「ペロブスカイト様化合物」及び「ペロブスカイト様相」という用語は、それぞれ、ペロブスカイト様構造を有する化合物及び相を指す。
nB`+(n+1)AX+((3n+1)/2)X2=An+1BnX3n+1+Y、ここでB`-は成分Bの前駆体であり、Y-は成分Bの前駆体として酸化物または塩を使用する場合に放出される副産物である。
B`+AX+δX2→δABX3+(1-δ)B``@AX+Y↑
式中、B’は成分B(通常は、金属の形態)の最初の前駆体であり、B’’は、成分B(ペロブスカイトでもペロブスカイト様化合物でもない)の最終前駆体であり、通常は、元の前駆体B’と同じであり、Yは、副産物である(その後、後プロセス処理で取り除くことができる)。
Pb+MAI+δI2→δMAPbI3+(1-δ)Pb@MAI
{Pb0.8Sn0.2}+MAI+δI2→δMAPb0.8Sn0.2I3+(1-δ){Pb0.8Sn0.2}@MAI
Pb+2BAI+δI2→δBA2PbI4+(1-δ)Pb@2BAI
-論文(http://konf.x-pdf.ru/18fizika/632895-1-fotovoltaicheskie-strukturi-osnove-organicheskih-poluprovodnikov-kvantovih-tochek-cdse.php);
-GOST R ISO 27911-2015「State system for ensuring the uniformity of measurements(GSI).Chemical analysis of the surface.Scanning probe microscopy.Determination and calibration of the lateral resolution of a near-field optical microscope」(http://docs.cntd.ru/document/1200119068);
-https://www.msu.ru/science/main_themes/v-mgu-razrabotali-novuyu-strategiyu-polucheniya- perovskitnykh-solnechnykh-yacheek.htmlに開示されている)、溶液は表面に均一に薄層で分布しており、溶媒の蒸発が開始すると同時に、結果として、成分Bの前駆体の膜の上の薄層における試薬AX及びX2の濃度が増加し、AX及びX2と成分Bの前駆体との迅速な化学反応が開始する。[X2]/[AX]比が0より大きく1より小さい場合、結果は、ペロブスカイト相またはペロブスカイト様相の粒子の核、ならびにAX及びBを含む膜となる。膜は、プロセスが10~40℃の温度で実行される場合、5~100秒のオーダーの時間で達成される。X2を含まない場合、これらの条件下でペロブスカイトの形成は発生しないが、[X2]/[AX]が1より大きい場合、反応は前駆体によって成分Bを完全に変換して、ハロゲン化物ペロブスカイトにする。
B`+AX+δX2→δABX3+(1-δ)B``@AX+Y↑(ステップ-II)
{δABX3+(1-δ)B``@AX}+X2→ABX3(ステップ-III)
ここで、中括弧{}で示されている試薬は、第2のステップで形成された膜の一部である。
Claims (6)
- ペロブスカイト様構造を有する有機-無機金属-ハロゲン化物化合物の半導体膜を調製するための方法であって、前記方法が、以下のステップ、
a)成分Bの前駆体の層を基板上に塗布するステップと、
b)複合試薬の層を前記成分Bの前記前駆体の層の表面に塗布するステップと、
c)前記塗布された試薬と前記成分Bの前記前駆体との化学反応の完了に必要かつ十分な時間、前記試薬X2によって前記基板上の前記塗布された層を処理することにより、有機-無機金属-ハロゲン化物ペロブスカイト様化合物の形成がもたらされるステップと、を含み、
前記ステップb)で塗布された前記複合試薬が、[X2]/[AX]モル比が0<[X2]/[AX]<1の範囲であるAX試薬とX2試薬との混合物を含み、前記ステップb)後に得られた前記膜が、ペロブスカイト様構造を有する前記相のシードを含み、
前記成分Bは、Pb、Sn、Bi、及びそれらの混合物から選択された様々な金属(Pb、Sn、Biなど)のカチオンMn+を含み、
前記試薬AXは、カチオンA+及びアニオンX-を含む塩であり、前記カチオンA+が、メチルアンモニウムCH3NH3 +、ホルムアミジニウム(NH2)2CH+、グアニジニウムC(NH2)3 +、Cs+、Rb+及び非置換(NH4 +)または一置換もしくは二置換もしくは三置換もしくは四置換アンモニウムカチオンなどの置換アンモニウムカチオン、ならびにそれらの組み合わせから選択される一価の有機または無機カチオンであり、
前記アニオンX-が、Cl-、Br-、I-、または疑似ハロゲン化物アニオン、及びそれらの組み合わせから選択される一価アニオンであり、
前記試薬X2が、分子ハロゲンである、ことを特徴とする、方法。 - ペロブスカイト様相のシードを含む前記膜を試薬X2で処理する前のステップで、30~300℃の温度で1~3600秒間熱処理を行う、請求項1に記載の方法。
- ステップ(c)の完了後、ペロブスカイト様構造を有する前記得られた有機-無機金属-ハロゲン化物化合物の膜が、追加の後処理、例えば、30~400℃の温度、1~7200秒間の熱処理、または不活性ガス、乾燥空気、湿った空気、溶媒蒸気(solvent vapors)への暴露、または可視光、紫外線、もしくは赤外線への暴露、または溶液もしくは溶媒による処理、またはこれらの後処理の種類の組み合わせなどに供される、請求項1に記載の方法。
- AXとX2とのモル比が等しいまたは異なる溶液から、AXとX2との混合物の前記複合試薬を繰り返し塗布することにより、ステップb)の前記膜を形成する、請求項1に記載の方法。
- 前記ステップ(b)で塗布された前記複合試薬が、インクジェット印刷、スクリーン印刷、スピンコーティング、浸漬コーティング、エアゾールスプレー、特に、超音波スプレー、ノズルを介した噴霧、エレクトロスプレー、エアゾールインクジェット印刷を使用して、成分Bの前記前駆体層の前記表面に均一に分布され、前記複合試薬は、成分A+及びX-または試薬AX及び試薬X2の溶液または溶融物、ならびにこれらの物質を液相または固相で含み、1つ以上の溶媒を添加したコロイドまたは懸濁液またはエマルジョンである、請求項1に記載の方法。
- 前記ステップ(a)において、前記成分Bの前記前駆体膜が、Pb、Sn、Biもしくはそれらの合金から選択される金属、または積み重ねられた金属(Pb、Sn、Bi)の複数の層を含む層状構造の形態で、及び酸化物または鉛塩の膜の形態でも得られ、成分Bの前記前駆体が、成分Bの真空蒸着または電気化学蒸着、化学蒸着、または成分Bを含む事前に塗布された固相化合物の分解によって塗布される、請求項1に記載の方法。
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