JP2022538104A - 化学機械研磨のための水蒸気生成 - Google Patents
化学機械研磨のための水蒸気生成 Download PDFInfo
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Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F22—STEAM GENERATION
- F22B—METHODS OF STEAM GENERATION; STEAM BOILERS
- F22B1/00—Methods of steam generation characterised by form of heating method
- F22B1/28—Methods of steam generation characterised by form of heating method in boilers heated electrically
- F22B1/284—Methods of steam generation characterised by form of heating method in boilers heated electrically with water in reservoirs
- F22B1/285—Methods of steam generation characterised by form of heating method in boilers heated electrically with water in reservoirs the water being fed by a pump to the reservoirs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
- B08B1/14—Wipes; Absorbent members, e.g. swabs or sponges
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/106—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by boiling the liquid
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/015—Temperature control
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
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- B24B37/20—Lapping pads for working plane surfaces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F22—STEAM GENERATION
- F22B—METHODS OF STEAM GENERATION; STEAM BOILERS
- F22B1/00—Methods of steam generation characterised by form of heating method
- F22B1/28—Methods of steam generation characterised by form of heating method in boilers heated electrically
- F22B1/284—Methods of steam generation characterised by form of heating method in boilers heated electrically with water in reservoirs
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F22—STEAM GENERATION
- F22B—METHODS OF STEAM GENERATION; STEAM BOILERS
- F22B37/00—Component parts or details of steam boilers
- F22B37/02—Component parts or details of steam boilers applicable to more than one kind or type of steam boiler
- F22B37/42—Applications, arrangements, or dispositions of alarm or automatic safety devices
- F22B37/46—Applications, arrangements, or dispositions of alarm or automatic safety devices responsive to low or high water level, e.g. for checking, suppressing, extinguishing combustion in boilers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F22—STEAM GENERATION
- F22D—PREHEATING, OR ACCUMULATING PREHEATED, FEED-WATER FOR STEAM GENERATION; FEED-WATER SUPPLY FOR STEAM GENERATION; CONTROLLING WATER LEVEL FOR STEAM GENERATION; AUXILIARY DEVICES FOR PROMOTING WATER CIRCULATION WITHIN STEAM BOILERS
- F22D5/00—Controlling water feed or water level; Automatic water feeding or water-level regulators
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
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- B08B2203/007—Heating the liquid
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2201/00—Manufacture or treatment of microstructural devices or systems
- B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
- B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
- B81C2201/0102—Surface micromachining
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Combustion & Propulsion (AREA)
- Chemical & Material Sciences (AREA)
- Sustainable Energy (AREA)
- Sustainable Development (AREA)
- Life Sciences & Earth Sciences (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- ing And Chemical Polishing (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Abstract
【選択図】図4A
Description
Claims (14)
- 水蒸気生成装置であって、
水入口及び水蒸気出口を有するキャニスタ、
前記キャニスタを下側チャンバと上側チャンバとに分割する前記キャニスタ内のバリアであって、前記下側チャンバは、前記水入口から水を受け取るように配置され、前記水蒸気出口のバルブは、前記上側チャンバから水蒸気を受け取り、前記バリアは、水蒸気が前記下側チャンバから前記上側チャンバへ移るための複数の開口を有し、凝縮水が前記上側チャンバから前記下側チャンバへ移ることを可能にし、少なくとも一部の開口は、前記キャニスタの内径面のすぐ近くに位置付けられている、バリア、
前記下側チャンバの一部分に熱を加えるように構成された加熱要素、及び
前記加熱要素の上方且つ前記水蒸気出口の下方に水位を保つために、前記水入口を通る水の流量を変更するように構成されたコントローラを備える、装置。 - 前記キャニスタ及び/又は前記バリアが石英である、請求項1に記載の装置。
- 前記キャニスタ及び前記バリアが、PTFEでコーティングされている、請求項1に記載の装置。
- 前記キャニスタと平行に前記水入口と前記水蒸気出口とを接続するバイパス管を更に備える、請求項1に記載の装置。
- 前記バイパス管内の水位をモニタするように配置された水位センサ、及び前記水位センサから信号を受信するように構成されたコントローラを備え、前記コントローラは、前記キャニスタ内の水位を前記加熱要素の上方且つ前記水蒸気出口の下方に保つために、前記水位センサからの前記信号に基づいて、前記水入口を通る水の前記流量を変更するように構成されている、請求項4に記載の装置。
- 前記複数の開口は、前記キャニスタの前記内径面のすぐ近くにのみ位置付けられている、請求項1に記載の装置。
- 前記加熱要素は、加熱コイルを含む、請求項1に記載の装置。
- 前記加熱コイルは、前記キャニスタの前記下側チャンバの周りに巻き付けられている、請求項7に記載の装置。
- 前記水入口は、前記加熱要素の上端の下方にある、請求項1に記載の装置。
- 前記水入口は、前記キャニスタの前記下側チャンバの下端にある、請求項9に記載の装置。
- 水蒸気生成装置であって、
下側チャンバ及び上側チャンバを有するキャニスタであって、水入口及び水蒸気出口を有し、前記下側チャンバは、前記水入口から水を受け取るように配置され、前記水蒸気出口のバルブは、前記上側チャンバから水蒸気を受け取る、キャニスタ、
前記下側チャンバの一部分に熱を加えるように構成された加熱要素、及び
前記加熱要素の上方且つ前記水蒸気出口の下方に水位を保つために、前記水入口を通る水の流量を変更するように構成されたコントローラを備える、装置。 - 前記キャニスタと平行に前記水入口と前記水蒸気出口とを接続するバイパス管を更に備える、請求項11に記載の装置。
- 前記バイパス管内の水位をモニタするための水位センサを備え、前記コントローラは、前記水位センサからの信号に基づいて、前記水入口を通る水の前記流量を変更するように構成されている、請求項12に記載の装置。
- 研磨パッドを支持するためのプラテンと、
基板を前記研磨パッドと接触させて保持するためのキャリアヘッドと、
前記プラテンと前記キャリアヘッドとの間に相対運動を生成させるためのモータと、
水蒸気生成器とを備える、化学機械研磨システムであって、前記水蒸気生成器は、
水入口及び水蒸気出口を有するキャニスタ、
前記キャニスタを下側チャンバと上側チャンバとに分割する前記キャニスタ内のバリアであって、前記下側チャンバは、前記水入口から水を受け取るように配置され、前記水蒸気出口のバルブは、前記上側チャンバから水蒸気を受け取り、前記バリアは、水蒸気が前記下側チャンバから前記上側チャンバへ移るための複数の開口を有し、凝縮水が前記上側チャンバから前記下側チャンバへ移ることを可能にする、バリア、
前記下側チャンバの一部分に熱を加えるように構成された加熱要素、及び
前記加熱要素の上方且つ前記水蒸気出口の下方に水位を保つために、前記水入口を通る水の流量を変更するように構成されたコントローラを含み、
前記化学機械研磨システムは更に、
前記プラテンの上で延在するアーム、及び、前記水蒸気生成器の前記水蒸気出口に接続され、前記水蒸気生成器から前記研磨パッド上へ水蒸気を供給するように方向付けられた少なくとも1つのノズルを備える、化学機械研磨システム。
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JP2023044678A (ja) * | 2021-09-17 | 2023-03-30 | エスケーシー ソルミックス カンパニー,リミテッド | 研磨パッドのリフレッシュ方法、これを用いた半導体素子の製造方法および半導体素子の製造装置 |
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US11633833B2 (en) | 2019-05-29 | 2023-04-25 | Applied Materials, Inc. | Use of steam for pre-heating of CMP components |
TW202110575A (zh) | 2019-05-29 | 2021-03-16 | 美商應用材料股份有限公司 | 用於化學機械研磨系統的蒸氣處置站 |
US11628478B2 (en) | 2019-05-29 | 2023-04-18 | Applied Materials, Inc. | Steam cleaning of CMP components |
JP2023518650A (ja) | 2020-06-29 | 2023-05-08 | アプライド マテリアルズ インコーポレイテッド | 化学機械研磨のための蒸気発生の制御 |
US20220184771A1 (en) * | 2020-12-14 | 2022-06-16 | Applied Materials, Inc. | Polishing system apparatus and methods for defect reduction at a substrate edge |
WO2022182881A1 (en) * | 2021-02-26 | 2022-09-01 | Axus Technology, Llc | Containment and exhaust system for substrate polishing components |
WO2022187074A1 (en) * | 2021-03-04 | 2022-09-09 | Applied Materials, Inc. | Insulated fluid lines in chemical mechanical polishing |
CN117381552B (zh) * | 2023-12-04 | 2024-03-01 | 湖南戴斯光电有限公司 | 一种光学镜片超光滑抛光的抛光方法及抛光装置 |
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JP2023044678A (ja) * | 2021-09-17 | 2023-03-30 | エスケーシー ソルミックス カンパニー,リミテッド | 研磨パッドのリフレッシュ方法、これを用いた半導体素子の製造方法および半導体素子の製造装置 |
JP7437473B2 (ja) | 2021-09-17 | 2024-02-22 | エスケー エンパルス カンパニー リミテッド | 研磨パッドのリフレッシュ方法、これを用いた半導体素子の製造方法および半導体素子の製造装置 |
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KR20220028016A (ko) | 2022-03-08 |
TWI753460B (zh) | 2022-01-21 |
US20200406310A1 (en) | 2020-12-31 |
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