JP2022528905A - 誘電体バリアプラズマで体の表面を処置するための処置アセンブリ - Google Patents
誘電体バリアプラズマで体の表面を処置するための処置アセンブリ Download PDFInfo
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- JP2022528905A JP2022528905A JP2021559314A JP2021559314A JP2022528905A JP 2022528905 A JP2022528905 A JP 2022528905A JP 2021559314 A JP2021559314 A JP 2021559314A JP 2021559314 A JP2021559314 A JP 2021559314A JP 2022528905 A JP2022528905 A JP 2022528905A
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- 230000004888 barrier function Effects 0.000 title claims abstract description 47
- 239000004020 conductor Substances 0.000 claims abstract description 21
- 230000004308 accommodation Effects 0.000 claims description 23
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- 238000003825 pressing Methods 0.000 abstract description 6
- 238000010586 diagram Methods 0.000 abstract 1
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- 230000015572 biosynthetic process Effects 0.000 description 3
- 206010052428 Wound Diseases 0.000 description 2
- 208000027418 Wounds and injury Diseases 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
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- 206010040844 Skin exfoliation Diseases 0.000 description 1
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- 230000000712 assembly Effects 0.000 description 1
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- 230000005540 biological transmission Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
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- 230000007704 transition Effects 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/2406—Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes
- H05H1/2418—Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes the electrodes being embedded in the dielectric
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/2406—Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/77—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures
- H01R12/771—Details
- H01R12/774—Retainers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/82—Coupling devices connected with low or zero insertion force
- H01R12/85—Coupling devices connected with low or zero insertion force contact pressure producing means, contacts activated after insertion of printed circuits or like structures
- H01R12/88—Coupling devices connected with low or zero insertion force contact pressure producing means, contacts activated after insertion of printed circuits or like structures acting manually by rotating or pivoting connector housing parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/62—Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement
- H01R13/629—Additional means for facilitating engagement or disengagement of coupling parts, e.g. aligning or guiding means, levers, gas pressure electrical locking indicators, manufacturing tolerances
- H01R13/62933—Comprising exclusively pivoting lever
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H2242/00—Auxiliary systems
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H2245/00—Applications of plasma devices
- H05H2245/30—Medical applications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H2245/00—Applications of plasma devices
- H05H2245/30—Medical applications
- H05H2245/34—Skin treatments, e.g. disinfection or wound treatment
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Plasma Technology (AREA)
- Surgical Instruments (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Arc-Extinguishing Devices That Are Switches (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
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- Switch Cases, Indication, And Locking (AREA)
Abstract
Description
Claims (12)
- 電極アセンブリ(1)と接触要素(2、2’)とを備える誘電体バリアプラズマで体の表面を処置するための処置アセンブリであって、
前記電極アセンブリ(1)の基部に少なくとも1つの電極(1a、1b)が配置され、前記電極(1a、1b)は、誘電体(3)によって、処置されるべき表面に対して完全に遮蔽され、かつ接続導体(6a、6b)により前記誘電体(3)の接触付加部(5)内に延びており、
前記接触要素(2、2’)は、前記接触付加部(5)のための収容開口(18、18’)と、前記収容開口(18、18’)を開閉するための、及び前記電極(1a、1b)への交流高電圧源の接続を案内するべく、前記誘電体(3)の予め作製された切欠き(14)を通して前記電極(1a、1b)にコンタクトピン(31)を押し付けるためのレバーアセンブリと、を有する処置アセンブリにおいて、
前記電極アセンブリ(1)が少なくとも2つの電極(1a、1b)を有し、前記少なくとも2つの電極が前記基部に配置され、前記誘電体(3)によって互いに絶縁され、かつそれぞれ1つの接続導体(6a、6b)により前記接触付加部(5)内に延びることと、
各接続導体(6a、6b)に、前記誘電体(3)の切欠き(14)と、それぞれのコンタクトピン(31)が存在することと、
前記接触要素(2)における前記コンタクトピン(31)の少なくとも1つが、誘電体シース(30)に覆われているとともに、関連する前記電極(1a、1b)との接点を形成するための非絶縁端面(46)を備えて形成されていることと、
前記少なくとも1つの誘電体シース(30)が前記誘電体(3)における関連する前記切欠き(14)に対して過大寸法を有しており、そのことにより前記コンタクトピン(31)の前記非絶縁端面(46)が関連する前記電極(1a、1b)と接触した場合に、前記少なくとも1つの誘電体シース(30)が、空隙を回避するように前記誘電体(3)の中に前記レバーアセンブリによって圧入されることと、
を特徴とする処置アセンブリ。 - 前記誘電体シース(30)が、少なくとも1つの段によって階段状に互いに隣接する2つの外断面を有し、前記外断面は、前記コンタクトピン(31)の前記非絶縁端面(46)に向かって小さくなることを特徴とする、請求項1に記載の処置アセンブリ。
- 前記誘電体(3)の前記切欠き(14)が、前記誘電体シース(30)の段に対応する内断面の段を有することを特徴とする、請求項2に記載の処置アセンブリ。
- 前記誘電体の少なくとも1つの内断面及び/又は前記誘電体シース(30)の外断面が、前記コンタクトピン(31)の前記非絶縁端面(46)に向かって円錐状に先細りに形成されていることを特徴とする、請求項1~請求項3のいずれか1項に記載の処置アセンブリ。
- 前記電極アセンブリ(1)が平面状に形成され、前記電極(1a、1b)が、平面状に形成された前記誘電体(3)の平面層によって、前記処置されるべき表面から遮蔽されていることを特徴とする、請求項1~請求項4のいずれか1項に記載の処置アセンブリ。
- 前記電極(1a、1b)及び前記誘電体(3)が可撓性であることを特徴とする、請求項1~請求項5のいずれか1項に記載の処置アセンブリ。
- 前記レバーアセンブリが、一方の側に操作端、他方の側に制御端がある2アーム操作レバーを有することと、前記制御端が、前記収容開口を開閉する壁片(19)と回転継手を介して関節式に接続され、前記壁片が回転軸(20)に回転可能に支承され、かつ中間リンク(25)を介して前記制御端と回転可能に接続されていることと、を特徴とする請求項1~請求項6のいずれか1項に記載の処置アセンブリ。
- 前記壁片(19)は、前記収容開口(18)の閉状態において前記コンタクトピン(31)に被さるカバーとして形成されていることを特徴とする、請求項1~請求項7のいずれか1項に記載の処置アセンブリ。
- 前記カバーは、前記壁片(19)を閉鎖する縁部(23)を有し、前記縁部は、前記収容開口(18)の閉状態において、前記収容開口(18)の平坦な底部(29)と平行に終えることを特徴とする、請求項8に記載の処置アセンブリ。
- 前記接触付加部(5)の前記誘電体(3)は、前記収容開口(18)の閉状態において、前記カバーの前記縁部(23)と前記平坦な底部(29)との間にプレストレス下で挟まれていることを特徴とする、請求項9に記載の処置アセンブリ。
- 前記レバーアセンブリの閉位置のための第1センサと、前記第1センサによって制御され、前記電極(1a、1b)への高電圧の供給を遮断するためのスイッチと、によって特徴付けられる、請求項1~請求項10のいずれか1項に記載の処置アセンブリ。
- 前記収容開口(18、18’)が閉じた後の前記収容開口(18、18’)への前記接触付加部(5)の完全な挿入を検出するセンサによって特徴付けられる、請求項1~請求項11のいずれか1項に記載の処置アセンブリ。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102019109940.4A DE102019109940B4 (de) | 2019-04-15 | 2019-04-15 | Behandlungsanordnung für die Behandlung einer Oberfläche eines Körpers mit einem dielektrisch behinderten Plasma |
DE102019109940.4 | 2019-04-15 | ||
PCT/EP2020/060447 WO2020212338A1 (de) | 2019-04-15 | 2020-04-14 | Behandlungsanordnung für die behandlung einer oberfläche eines körpers mit einem dielektrisch behinderten plasma |
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JP2022528905A true JP2022528905A (ja) | 2022-06-16 |
JP7514545B2 JP7514545B2 (ja) | 2024-07-11 |
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JP2021559314A Active JP7514545B2 (ja) | 2019-04-15 | 2020-04-14 | 誘電体バリアプラズマで体の表面を処置するための処置アセンブリ |
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US (1) | US20220304132A1 (ja) |
EP (1) | EP3957137B1 (ja) |
JP (1) | JP7514545B2 (ja) |
KR (1) | KR20210150514A (ja) |
CN (1) | CN113826447A (ja) |
AU (1) | AU2020257974A1 (ja) |
CA (1) | CA3136777A1 (ja) |
DE (1) | DE102019109940B4 (ja) |
EA (1) | EA202192675A1 (ja) |
ES (1) | ES2941616T3 (ja) |
WO (1) | WO2020212338A1 (ja) |
ZA (1) | ZA202107811B (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
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DE102021128463A1 (de) | 2021-11-02 | 2023-05-04 | Cinogy Gmbh | Plasma-Behandlungsgerät zur Plasmabehandlung einer Hautoberfläche |
DE102021128469A1 (de) | 2021-11-02 | 2023-05-04 | Cinogy Gmbh | Plasma-Behandlungsgerät zur Plasmabehandlung einer Hautoberfläche |
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WO2019015717A1 (de) * | 2017-07-19 | 2019-01-24 | Cinogy Gmbh | Plasma-behandlungsgerät |
WO2019020569A1 (de) * | 2017-07-25 | 2019-01-31 | Cinogy Gmbh | Elektrodenanordnung für eine dielektrisch behinderte plasmabehandlung |
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JP4272373B2 (ja) * | 2001-12-11 | 2009-06-03 | 太平洋セメント株式会社 | 静電チャック |
US6958670B2 (en) * | 2003-08-01 | 2005-10-25 | Raytheon Company | Offset connector with compressible conductor |
JP5142386B2 (ja) | 2008-08-06 | 2013-02-13 | 日本航空電子工業株式会社 | コネクタ |
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2019
- 2019-04-15 DE DE102019109940.4A patent/DE102019109940B4/de active Active
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2020
- 2020-04-14 JP JP2021559314A patent/JP7514545B2/ja active Active
- 2020-04-14 AU AU2020257974A patent/AU2020257974A1/en not_active Abandoned
- 2020-04-14 EA EA202192675A patent/EA202192675A1/ru unknown
- 2020-04-14 EP EP20720761.4A patent/EP3957137B1/de active Active
- 2020-04-14 ES ES20720761T patent/ES2941616T3/es active Active
- 2020-04-14 WO PCT/EP2020/060447 patent/WO2020212338A1/de unknown
- 2020-04-14 CA CA3136777A patent/CA3136777A1/en active Pending
- 2020-04-14 US US17/604,231 patent/US20220304132A1/en active Pending
- 2020-04-14 CN CN202080028604.0A patent/CN113826447A/zh active Pending
- 2020-04-14 KR KR1020217036489A patent/KR20210150514A/ko not_active Application Discontinuation
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Patent Citations (4)
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JPH05299142A (ja) * | 1992-04-20 | 1993-11-12 | Fujitsu Ltd | シート状印刷ケーブル用コネクタ |
JP2014222608A (ja) * | 2013-05-13 | 2014-11-27 | 株式会社アイ・メデックス | フラットケーブルにおけるコネクタとの接続構造及びコネクタ |
WO2019015717A1 (de) * | 2017-07-19 | 2019-01-24 | Cinogy Gmbh | Plasma-behandlungsgerät |
WO2019020569A1 (de) * | 2017-07-25 | 2019-01-31 | Cinogy Gmbh | Elektrodenanordnung für eine dielektrisch behinderte plasmabehandlung |
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EP3957137B1 (de) | 2023-01-25 |
WO2020212338A1 (de) | 2020-10-22 |
JP7514545B2 (ja) | 2024-07-11 |
DE102019109940B4 (de) | 2020-12-10 |
DE102019109940A1 (de) | 2020-10-15 |
EP3957137A1 (de) | 2022-02-23 |
AU2020257974A1 (en) | 2021-11-11 |
ES2941616T3 (es) | 2023-05-24 |
KR20210150514A (ko) | 2021-12-10 |
EA202192675A1 (ru) | 2022-01-19 |
US20220304132A1 (en) | 2022-09-22 |
CA3136777A1 (en) | 2020-10-22 |
CN113826447A (zh) | 2021-12-21 |
ZA202107811B (en) | 2022-08-31 |
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