JP2022510648A - 表面保護フィルムおよび有機発光電子装置の製造方法 - Google Patents
表面保護フィルムおよび有機発光電子装置の製造方法 Download PDFInfo
- Publication number
- JP2022510648A JP2022510648A JP2021530207A JP2021530207A JP2022510648A JP 2022510648 A JP2022510648 A JP 2022510648A JP 2021530207 A JP2021530207 A JP 2021530207A JP 2021530207 A JP2021530207 A JP 2021530207A JP 2022510648 A JP2022510648 A JP 2022510648A
- Authority
- JP
- Japan
- Prior art keywords
- protective film
- layer
- weight
- surface protective
- meth
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/385—Acrylic polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
- C08F220/1804—C4-(meth)acrylate, e.g. butyl (meth)acrylate, isobutyl (meth)acrylate or tert-butyl (meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/30—Low-molecular-weight compounds
- C08G18/32—Polyhydroxy compounds; Polyamines; Hydroxyamines
- C08G18/3203—Polyhydroxy compounds
- C08G18/3206—Polyhydroxy compounds aliphatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/4009—Two or more macromolecular compounds not provided for in one single group of groups C08G18/42 - C08G18/64
- C08G18/4063—Mixtures of compounds of group C08G18/62 with other macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/48—Polyethers
- C08G18/4804—Two or more polyethers of different physical or chemical nature
- C08G18/4812—Mixtures of polyetherdiols with polyetherpolyols having at least three hydroxy groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/48—Polyethers
- C08G18/4825—Polyethers containing two hydroxy groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/48—Polyethers
- C08G18/4829—Polyethers containing at least three hydroxy groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/62—Polymers of compounds having carbon-to-carbon double bonds
- C08G18/6216—Polymers of alpha-beta ethylenically unsaturated carboxylic acids or of derivatives thereof
- C08G18/622—Polymers of esters of alpha-beta ethylenically unsaturated carboxylic acids
- C08G18/6225—Polymers of esters of acrylic or methacrylic acid
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/65—Low-molecular-weight compounds having active hydrogen with high-molecular-weight compounds having active hydrogen
- C08G18/66—Compounds of groups C08G18/42, C08G18/48, or C08G18/52
- C08G18/6666—Compounds of group C08G18/48 or C08G18/52
- C08G18/667—Compounds of group C08G18/48 or C08G18/52 with compounds of group C08G18/32 or polyamines of C08G18/38
- C08G18/6674—Compounds of group C08G18/48 or C08G18/52 with compounds of group C08G18/32 or polyamines of C08G18/38 with compounds of group C08G18/3203
- C08G18/6677—Compounds of group C08G18/48 or C08G18/52 with compounds of group C08G18/32 or polyamines of C08G18/38 with compounds of group C08G18/3203 having at least three hydroxy groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/72—Polyisocyanates or polyisothiocyanates
- C08G18/77—Polyisocyanates or polyisothiocyanates having heteroatoms in addition to the isocyanate or isothiocyanate nitrogen and oxygen or sulfur
- C08G18/78—Nitrogen
- C08G18/79—Nitrogen characterised by the polyisocyanates used, these having groups formed by oligomerisation of isocyanates or isothiocyanates
- C08G18/791—Nitrogen characterised by the polyisocyanates used, these having groups formed by oligomerisation of isocyanates or isothiocyanates containing isocyanurate groups
- C08G18/792—Nitrogen characterised by the polyisocyanates used, these having groups formed by oligomerisation of isocyanates or isothiocyanates containing isocyanurate groups formed by oligomerisation of aliphatic and/or cycloaliphatic isocyanates or isothiocyanates
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/08—Homopolymers or copolymers of acrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/08—Polyurethanes from polyethers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
- H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/40—OLEDs integrated with touch screens
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/318—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2475/00—Presence of polyurethane
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Inorganic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
Description
フェノールフタレイン指示薬:フェノールフタレイン原液0.5g、エタノール250gおよび蒸留水250gを混合した溶液
A:ブランク(blank)に必要な0.5N KOH(ml)
B:本テストに必要な0.5N KOH(ml)
F:1N HCL 10mlにマグネチックバーとフェノールフタレイン指示薬10滴を入れた後、0.5N KOHで滴定する時のKOHの量(ml)
<ウレタン重合体の製造>
窒素ガスで充填した三口フラスコに3官能プレミノール(ポリエーテルポリオール、polyether polyol、S 4013F、ASAHI GLASS CO.LTD.、Mn=12,000g/mol)80重量部、2官能ポリオール(ポリプロピレングリコール、PPG-1000d、KUMHO石油化学、Mn=1,000g/mol)5重量部、および3官能MPD/TMPT系ポリオール(MPD(3-メチル-1,5-ペンタンジオール、3-methyl-1,5-pentanediol)とTMPT(トリメチロールプロパンアジペート、trimethylol propane adipate)の混合物、Polyol F-3010、Kuraray社、Mn=3,000g/mol)15重量部と、エチルアセテート(ethyl acetate)とを投入し、触媒(DBTDL)下で15分間高速攪拌した。次に前記プレミノール、ポリオールおよびMPD/TMPT系ポリオール100重量部に対して多官能脂環式イソシアネート化合物(MHG-80B、ASAHI KASEI社)18重量部を徐々に滴加しながら加熱して90±5℃で3時間維持し、イソシアネート(NCO)ピークが消滅するまで反応させて、重量平均分子量が110,000g/molのウレタン重合体を製造した。
窒素ガスが還流し、温度調節が容易になるように冷却装置を設置した1L反応器にブチルメタクリレート(BMA)75重量部、ステアリルメタクリレート(STMA)15重量部および2-ヒドロキシエチルアクリレート(2-HEA)10重量部で構成される単量体混合物を投入した後、溶媒としてエチルアセテートを投入した。その次に、酸素を除去するために窒素ガスを約1時間パージ(purging)した後、反応器の温度を62℃に維持した。混合物を均一にした後、反応開始剤としてアゾビスイソブチロニトリル(AIBN)400ppmおよび連鎖移動剤としてn-ドデシルメルカプタン(n-dodecylmercaptan、n-DDM)400ppmを投入し、混合物を反応させた。反応後にトルエンで希釈して、重量平均分子量が20,000g/molのアクリル系重合体(D1)を製造した。
窒素ガスが還流し、温度調節が容易になるように冷却装置を設置した1L反応器にブチルメタクリレート(BMA)90重量部および2-ヒドロキシエチルアクリレート(2-HEA)10重量部で構成される単量体混合物を投入した後、溶媒としてエチルアセテートを投入した。その次に、酸素を除去するために窒素ガスを約1時間パージ(purging)した後、反応器の温度を62℃に維持した。混合物を均一にした後、反応開始剤としてアゾビスイソブチロニトリル(AIBN)400ppmおよび連鎖移動剤としてn-ドデシルメルカプタン(n-dodecylmercaptan、n-DDM)400ppmを投入し、混合物を反応させた。反応後にトルエンで希釈して、重量平均分子量が30,000g/molのアクリル系重合体(D2)を製造した。
窒素ガスが還流し、温度調節が容易になるように冷却装置を設置した1L反応器にブチルメタクリレート(BMA)80重量部、ヘキシル(メタ)アクリレート(HMA)および2-ヒドロキシエチルアクリレート(2-HEA)10重量部で構成される単量体混合物を投入した後、溶媒としてエチルアセテートを投入した。その次に、酸素を除去するために窒素ガスを約1時間パージ(purging)した後、反応器の温度を62℃に維持した。混合物を均一にした後、反応開始剤としてアゾビスイソブチロニトリル(AIBN)400ppmおよび連鎖移動剤としてn-ドデシルメルカプタン(n-dodecylmercaptan、n-DDM)400ppmを投入し、混合物を反応させた。反応後にトルエンで希釈して、重量平均分子量が30,000g/molのアクリル系重合体(D3)を製造した。
前記製造されたウレタン重合体100重量部、前記ウレタン重合体100重量部に対してHDI Trimer系硬化剤(TKA-100、ASAHI KASEI社)20重量部、前記アクリル系重合体(D1)7.5重量部、触媒(DBTDL)0.005重量部および硬化遅延剤(アセチルアセトン)3重量部を混合して、固形分濃度が48wt%になるようにトルエン(Toluene)溶媒を入れ、ディスパー(disper)で攪拌して粘着剤組成物1を製造した。
アクリル系重合体(D1)の製造方法と同様の方法により、分子量33,000g/molのアクリル系重合体(D2)を製造した。
アクリル系重合体(D1)の製造方法と同様の方法により、重量平均分子量47,000g/molのアクリル系重合体(D3)を製造した。
アクリル系重合体(D1)の製造方法と同様の方法により、重量平均分子量51,000g/molのアクリル系重合体(D4)を製造した。
アクリル系重合体(D1)の製造方法と同様の方法により、重量平均分子量62,000g/molのアクリル系重合体(D5)を製造した。
アクリル系重合体(D1)を用いないことを除いては、粘着剤組成物1の製造方法と同様の方法により比較組成物1を製造した。
アクリル系重合体(D1)の代わりに可塑剤としてイソプロピルミリステート(IPMS)をウレタン重合体100重量部に対して20重量部で用いたことを除いては、粘着剤組成物1の製造方法と同様の方法により比較組成物2を製造した。
アクリル系重合体(D1)の代わりにイソプロピルミリステート(IPMS)をウレタン重合体100重量部に対して40重量部で用い、硬化剤をウレタン重合体100重量部に対して15重量部で用いたことを除いては、粘着剤組成物1の製造方法と同様の方法により比較組成物3を製造した。
アクリル系重合体(D1)の代わりにアクリル系重合体(D2)を用いたことを除いては、粘着剤組成物1の製造方法と同様の方法により比較組成物4を製造した。
アクリル系重合体(D1)の代わりにアクリル系重合体(D3)を用いたことを除いては、粘着剤組成物1の製造方法と同様の方法により比較組成物5を製造した。
基材層としては、基材フィルムの両面に各々50nmの帯電防止層がコーティングされた75μm厚さのポリエチレンテレフタレート(PET)フィルム(H330、KOLON社)を準備した。保護層としては、50μm厚さのポリエチレンテレフタレート(PET)フィルム(XD510P、TAK社)の両面に帯電防止層が形成され、一つの帯電防止層上に離型層がコーティングされたフィルム(12ASW、SKC社)を準備した。次に、前記基材層の一面に前記粘着剤組成物を75μm厚さでコンマコーティングし熱風乾燥した後、前記基材層と前記離型層が対向するように粘着剤組成物上に保護層をラミネートして40℃で5日間熟成した後に表面保護フィルムを製造した。
実施例1~5および比較例1~5の表面保護フィルムを幅25mm、長さ150mmになるように裁断した。その次に、2kgのローラを用いて表面保護フィルムの粘着剤層をガラスに付着し、25℃で24時間保管する。その次に、装置(Samjeetech社、SJTA-034D Model)を用いて、前記表面保護フィルムを前記ガラスから30m/minの剥離速度および180°の剥離角度で剥離しつつ高速剥離力を測定した。2個の同一な試片に対して高速剥離力を測定した後にその平均値を採用した。
11B ・・・第2帯電防止層
11C ・・・第3帯電防止層
11D ・・・第4帯電防止層
110 ・・・基材層
111 ・・・基材フィルム
123 ・・・離型層
124 ・・・粘着剤層
130 ・・・保護層
131 ・・・保護フィルム
140 ・・・被着材
510 ・・・有機発光素子
511 ・・・バックプレート
512 ・・・プラスチック基板
513 ・・・薄膜トランジスタ
514 ・・・有機発光ダイオード
515 ・・・封止層
Claims (15)
- 基材層;および前記基材層の一面に備えられた粘着剤層を含む表面保護フィルムであって、
前記粘着剤層はウレタン重合体;アクリル系重合体;および硬化剤を含む粘着剤組成物の硬化物を含み、
前記粘着剤層の前記基材層が備えられた面の反対面をガラスから30m/minの剥離速度および180°の剥離角度で剥離する時の剥離力は2gf/in以上30gf/in以下である、表面保護フィルム。 - 前記アクリル系重合体は、前記ウレタン重合体100重量部に対して1重量部~15重量部で含まれる、請求項1に記載の表面保護フィルム。
- 前記硬化剤は、前記ウレタン重合体100重量部に対して1重量部~25重量部で含まれる、請求項1または2に記載の表面保護フィルム。
- 前記アクリル系重合体は、炭素数10以上のアルキル(メタ)アクリレート単量体を単量体単位として含む、請求項1から3のいずれか一項に記載の表面保護フィルム。
- 前記炭素数10以上のアルキル(メタ)アクリレート単量体は、前記アクリル系重合体に含まれる単量体単位の全量に対して1重量%~20重量%で含まれる、請求項4に記載の表面保護フィルム。
- 前記アクリル系重合体は、水酸基を含む(メタ)アクリレート単量体を単量体単位として含む、請求項1から5のいずれか一項に記載の表面保護フィルム。
- 前記水酸基を含む(メタ)アクリレート単量体は、前記アクリル系重合体に含まれる単量体単位の全量に対して1重量%~20重量%で含まれる、請求項6に記載の表面保護フィルム。
- 前記アクリル系重合体の水酸基価は5mgKOH/g~40mgKOH/gである、請求項1から7のいずれか一項に記載の表面保護フィルム。
- 前記アクリル系重合体の重量平均分子量は10,000g/mol~70,000g/molである、請求項1から8のいずれか一項に記載の表面保護フィルム。
- 前記ウレタン重合体の重量平均分子量は60,000g/mol~160,000g/molである、請求項1から9のいずれか一項に記載の表面保護フィルム。
- 前記基材層は基材フィルム;および前記基材フィルムの両面に各々備えられた第1帯電防止層および第2帯電防止層を含み、
前記粘着剤層は前記第2帯電防止層の前記基材フィルムが備えられた面の反対面に備えられる、請求項1から10のいずれか一項に記載の表面保護フィルム。 - 前記粘着剤層の前記基材層が備えられた面の反対面に備えられた保護層をさらに含み、
前記保護層は保護フィルム;および前記保護フィルムの両面に各々備えられた第3帯電防止層および第4帯電防止層を含み、
前記粘着剤層は前記第3帯電防止層の前記保護フィルムが備えられた面の反対面に備えられる、請求項1から11のいずれか一項に記載の表面保護フィルム。 - 請求項1から12のいずれか一項に記載の表面保護フィルムの粘着剤層を有機発光素子の封止層上に付着するステップを含む有機発光電子装置の製造方法。
- 前記有機発光素子は、バックプレート、プラスチック基板、薄膜トランジスタ、有機発光ダイオードおよび封止層を順に含む、請求項13に記載の有機発光電子装置の製造方法。
- 前記表面保護フィルムを前記封止層から剥離するステップ;および前記封止層上にタッチスクリーンパネルおよびカバーウィンドウを積層するステップをさらに含む、請求項13または14に記載の有機発光電子装置の製造方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2019-0010017 | 2019-01-25 | ||
KR20190010017 | 2019-01-25 | ||
PCT/KR2020/001103 WO2020153753A1 (ko) | 2019-01-25 | 2020-01-22 | 표면 보호 필름 및 유기 발광 전자 장치 제조 방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2022510648A true JP2022510648A (ja) | 2022-01-27 |
JP7229584B2 JP7229584B2 (ja) | 2023-02-28 |
Family
ID=71735598
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021530207A Active JP7229584B2 (ja) | 2019-01-25 | 2020-01-22 | 表面保護フィルムおよび有機発光電子装置の製造方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20210388240A1 (ja) |
JP (1) | JP7229584B2 (ja) |
KR (1) | KR102327839B1 (ja) |
CN (1) | CN113166595B (ja) |
TW (1) | TWI730607B (ja) |
WO (1) | WO2020153753A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP4130188A4 (en) | 2020-08-18 | 2023-09-20 | Lg Chem, Ltd. | ADHESIVE COMPOSITION AND SURFACE PROTECTIVE FILM |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014021498A (ja) * | 2012-07-13 | 2014-02-03 | Samsung Display Co Ltd | 表示パネルの製造方法 |
JP2015518177A (ja) * | 2012-04-05 | 2015-06-25 | 三星ディスプレイ株式會社Samsung Display Co.,Ltd. | フィルム型ディスプレイ基板の製造方法およびフィルム型ディスプレイ基板製造用工程フィルム |
JP2015212362A (ja) * | 2014-04-16 | 2015-11-26 | 日東電工株式会社 | 粘着シート、及び、光学部材 |
US20170121568A1 (en) * | 2014-06-11 | 2017-05-04 | Tesa Se | Adhesive tape for protecting surfaces |
JP2017155099A (ja) * | 2016-02-29 | 2017-09-07 | 日本カーバイド工業株式会社 | 保護フィルム用粘着剤組成物及び保護フィルム |
KR20170135512A (ko) * | 2016-05-31 | 2017-12-08 | 주식회사 엘지화학 | 광학 필름 |
JP2019026707A (ja) * | 2017-07-28 | 2019-02-21 | Dic株式会社 | 粘着剤組成物、及びこれを用いた積層フィルム |
JP2020537190A (ja) * | 2017-10-23 | 2020-12-17 | エルジー・ケム・リミテッド | 光学フィルム、光学フィルムの製造方法および有機発光電子装置の製造方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4443852B2 (ja) * | 2002-04-19 | 2010-03-31 | 三洋化成工業株式会社 | 粘着剤組成物 |
JP5737763B2 (ja) * | 2010-03-31 | 2015-06-17 | リンテック株式会社 | 粘着シート |
JP2013079303A (ja) * | 2011-10-03 | 2013-05-02 | Nitto Denko Corp | 粘着剤組成物および粘着テープ |
JP6230233B2 (ja) * | 2012-04-23 | 2017-11-15 | 日東電工株式会社 | 表面保護フィルム |
DE102014204465A1 (de) * | 2014-03-11 | 2015-09-17 | Henkel Ag & Co. Kgaa | UV-reaktiver Schmelzklebstoff für die Laminierung transparenter Folien |
JP2016121310A (ja) * | 2014-12-25 | 2016-07-07 | 日東電工株式会社 | 粘着シート、および、光学部材 |
JP6368810B2 (ja) * | 2016-03-04 | 2018-08-01 | 日東電工株式会社 | 表面保護フィルム |
KR101756828B1 (ko) | 2016-08-03 | 2017-07-11 | 도레이첨단소재 주식회사 | 터치패널 공정용 우레탄계 점착제 조성물, 이를 이용한 점착필름 및 투명전극 보호필름 |
JP7252697B2 (ja) * | 2017-03-22 | 2023-04-05 | 日東電工株式会社 | 表面保護フィルム |
-
2020
- 2020-01-22 JP JP2021530207A patent/JP7229584B2/ja active Active
- 2020-01-22 US US17/295,714 patent/US20210388240A1/en active Pending
- 2020-01-22 WO PCT/KR2020/001103 patent/WO2020153753A1/ko active Application Filing
- 2020-01-22 TW TW109102531A patent/TWI730607B/zh active
- 2020-01-22 CN CN202080006357.4A patent/CN113166595B/zh active Active
- 2020-01-23 KR KR1020200009376A patent/KR102327839B1/ko active IP Right Grant
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015518177A (ja) * | 2012-04-05 | 2015-06-25 | 三星ディスプレイ株式會社Samsung Display Co.,Ltd. | フィルム型ディスプレイ基板の製造方法およびフィルム型ディスプレイ基板製造用工程フィルム |
JP2014021498A (ja) * | 2012-07-13 | 2014-02-03 | Samsung Display Co Ltd | 表示パネルの製造方法 |
JP2015212362A (ja) * | 2014-04-16 | 2015-11-26 | 日東電工株式会社 | 粘着シート、及び、光学部材 |
US20170121568A1 (en) * | 2014-06-11 | 2017-05-04 | Tesa Se | Adhesive tape for protecting surfaces |
JP2017155099A (ja) * | 2016-02-29 | 2017-09-07 | 日本カーバイド工業株式会社 | 保護フィルム用粘着剤組成物及び保護フィルム |
KR20170135512A (ko) * | 2016-05-31 | 2017-12-08 | 주식회사 엘지화학 | 광학 필름 |
JP2019026707A (ja) * | 2017-07-28 | 2019-02-21 | Dic株式会社 | 粘着剤組成物、及びこれを用いた積層フィルム |
JP2020537190A (ja) * | 2017-10-23 | 2020-12-17 | エルジー・ケム・リミテッド | 光学フィルム、光学フィルムの製造方法および有機発光電子装置の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
CN113166595A (zh) | 2021-07-23 |
KR102327839B1 (ko) | 2021-11-17 |
CN113166595B (zh) | 2023-02-21 |
JP7229584B2 (ja) | 2023-02-28 |
TW202035612A (zh) | 2020-10-01 |
WO2020153753A1 (ko) | 2020-07-30 |
TWI730607B (zh) | 2021-06-11 |
KR20200092896A (ko) | 2020-08-04 |
US20210388240A1 (en) | 2021-12-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR102410121B1 (ko) | 점착제 조성물, 표면 보호 필름 및 유기 발광 전자 장치 제조 방법 | |
JP7191224B2 (ja) | 表面保護フィルムおよび有機発光電子装置の製造方法 | |
JP7229584B2 (ja) | 表面保護フィルムおよび有機発光電子装置の製造方法 | |
JP7214296B2 (ja) | 粘着剤組成物、表面保護フィルムおよび有機発光電子装置の製造方法 | |
KR102445538B1 (ko) | 점착제 조성물, 표면 보호 필름 및 유기 발광 전자 장치 제조 방법 | |
CN113490726A (zh) | 表面保护膜、用于制造表面保护膜的方法以及用于制造有机发光电子器件的方法 | |
JP7191223B2 (ja) | 表面保護フィルムおよび有機発光電子装置の製造方法 | |
JP7241877B2 (ja) | 表面保護フィルムおよび有機発光電子装置の製造方法 | |
KR102388483B1 (ko) | 점착제 조성물, 표면 보호 필름 및 유기 발광 전자 장치 제조 방법 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20210527 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20220531 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20220620 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20220916 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20230116 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20230208 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 7229584 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |