JP2022506293A5 - - Google Patents

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Publication number
JP2022506293A5
JP2022506293A5 JP2021523590A JP2021523590A JP2022506293A5 JP 2022506293 A5 JP2022506293 A5 JP 2022506293A5 JP 2021523590 A JP2021523590 A JP 2021523590A JP 2021523590 A JP2021523590 A JP 2021523590A JP 2022506293 A5 JP2022506293 A5 JP 2022506293A5
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JP
Japan
Prior art keywords
ring
sub
radial
liner
assembly according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021523590A
Other languages
English (en)
Japanese (ja)
Other versions
JP7295946B2 (ja
JP2022506293A (ja
Filing date
Publication date
Priority claimed from CN201821806205.9U external-priority patent/CN209133451U/zh
Priority claimed from CN201811305127.9A external-priority patent/CN109273342B/zh
Application filed filed Critical
Priority claimed from PCT/CN2019/113723 external-priority patent/WO2020088413A1/zh
Publication of JP2022506293A publication Critical patent/JP2022506293A/ja
Publication of JP2022506293A5 publication Critical patent/JP2022506293A5/ja
Application granted granted Critical
Publication of JP7295946B2 publication Critical patent/JP7295946B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2021523590A 2018-11-02 2019-10-28 ライナアッセンブリ、反応チャンバおよび半導体処理装置 Active JP7295946B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
CN201821806205.9 2018-11-02
CN201811305127.9 2018-11-02
CN201821806205.9U CN209133451U (zh) 2018-11-02 2018-11-02 内衬组件、反应腔室及半导体加工设备
CN201811305127.9A CN109273342B (zh) 2018-11-02 2018-11-02 内衬组件、反应腔室及半导体加工设备
PCT/CN2019/113723 WO2020088413A1 (zh) 2018-11-02 2019-10-28 内衬组件、反应腔室及半导体加工设备

Publications (3)

Publication Number Publication Date
JP2022506293A JP2022506293A (ja) 2022-01-17
JP2022506293A5 true JP2022506293A5 (https=) 2022-04-07
JP7295946B2 JP7295946B2 (ja) 2023-06-21

Family

ID=70463434

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021523590A Active JP7295946B2 (ja) 2018-11-02 2019-10-28 ライナアッセンブリ、反応チャンバおよび半導体処理装置

Country Status (5)

Country Link
JP (1) JP7295946B2 (https=)
KR (1) KR102473872B1 (https=)
SG (1) SG11202104119PA (https=)
TW (1) TWI739194B (https=)
WO (1) WO2020088413A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114361000B (zh) * 2022-01-04 2024-04-16 北京北方华创微电子装备有限公司 半导体工艺腔室和半导体工艺设备
CN114420526B (zh) * 2022-01-18 2023-09-12 江苏天芯微半导体设备有限公司 一种衬套及晶圆预处理装置
CN115083964B (zh) * 2022-06-30 2025-05-23 北京北方华创微电子装备有限公司 工艺腔室、半导体工艺设备及工艺方法
CN115985745B (zh) * 2022-12-05 2025-06-24 北京北方华创微电子装备有限公司 半导体工艺腔室和半导体工艺设备

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5763851A (en) * 1995-11-27 1998-06-09 Applied Materials, Inc. Slotted RF coil shield for plasma deposition system
TW327236B (en) * 1996-03-12 1998-02-21 Varian Associates Inductively coupled plasma reactor with faraday-sputter shield
AU6977998A (en) * 1997-04-21 1998-11-13 Tokyo Electron Arizona, Inc. Method and apparatus for ionized sputtering of materials
US6406590B1 (en) * 1998-09-08 2002-06-18 Sharp Kaubushiki Kaisha Method and apparatus for surface treatment using plasma
US6170429B1 (en) * 1998-09-30 2001-01-09 Lam Research Corporation Chamber liner for semiconductor process chambers
US6398929B1 (en) * 1999-10-08 2002-06-04 Applied Materials, Inc. Plasma reactor and shields generating self-ionized plasma for sputtering
CN101399197B (zh) * 2007-09-30 2011-12-07 北京北方微电子基地设备工艺研究中心有限责任公司 一种腔室的衬
CN103882390B (zh) * 2012-12-20 2016-04-27 北京北方微电子基地设备工艺研究中心有限责任公司 反应腔室及磁控溅射设备
CN106548914B (zh) * 2015-09-17 2018-10-30 中微半导体设备(上海)有限公司 一种等离子体处理设备及其清洗系统和方法
CN206432234U (zh) * 2016-12-23 2017-08-22 江苏鲁汶仪器有限公司 等离子体刻蚀机反应腔的内衬及等离子体刻蚀机反应腔
CN209133451U (zh) * 2018-11-02 2019-07-19 北京北方华创微电子装备有限公司 内衬组件、反应腔室及半导体加工设备
CN109273342B (zh) * 2018-11-02 2024-07-23 北京北方华创微电子装备有限公司 内衬组件、反应腔室及半导体加工设备

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