JP2022188583A - 半導体装置用基板 - Google Patents

半導体装置用基板 Download PDF

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Publication number
JP2022188583A
JP2022188583A JP2021096735A JP2021096735A JP2022188583A JP 2022188583 A JP2022188583 A JP 2022188583A JP 2021096735 A JP2021096735 A JP 2021096735A JP 2021096735 A JP2021096735 A JP 2021096735A JP 2022188583 A JP2022188583 A JP 2022188583A
Authority
JP
Japan
Prior art keywords
copper plate
semiconductor device
recess
plate
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021096735A
Other languages
English (en)
Japanese (ja)
Other versions
JP2022188583A5 (fr
Inventor
智生 高井
Tomoo Takai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NGK Insulators Ltd
NGK Electronics Devices Inc
Original Assignee
NGK Insulators Ltd
NGK Electronics Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Insulators Ltd, NGK Electronics Devices Inc filed Critical NGK Insulators Ltd
Priority to JP2021096735A priority Critical patent/JP2022188583A/ja
Priority to PCT/JP2022/011601 priority patent/WO2022259676A1/fr
Priority to DE112022002069.5T priority patent/DE112022002069T5/de
Priority to CN202280040561.7A priority patent/CN117480599A/zh
Publication of JP2022188583A publication Critical patent/JP2022188583A/ja
Publication of JP2022188583A5 publication Critical patent/JP2022188583A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49838—Geometry or layout
    • H01L23/49844—Geometry or layout for devices being provided for in H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/62—Protection against overvoltage, e.g. fuses, shunts

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2021096735A 2021-06-09 2021-06-09 半導体装置用基板 Pending JP2022188583A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2021096735A JP2022188583A (ja) 2021-06-09 2021-06-09 半導体装置用基板
PCT/JP2022/011601 WO2022259676A1 (fr) 2021-06-09 2022-03-15 Substrat pour dispositif à semi-conducteur
DE112022002069.5T DE112022002069T5 (de) 2021-06-09 2022-03-15 Substrat für Halbleitervorrichtung
CN202280040561.7A CN117480599A (zh) 2021-06-09 2022-03-15 半导体装置用基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021096735A JP2022188583A (ja) 2021-06-09 2021-06-09 半導体装置用基板

Publications (2)

Publication Number Publication Date
JP2022188583A true JP2022188583A (ja) 2022-12-21
JP2022188583A5 JP2022188583A5 (fr) 2023-12-11

Family

ID=84425824

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021096735A Pending JP2022188583A (ja) 2021-06-09 2021-06-09 半導体装置用基板

Country Status (4)

Country Link
JP (1) JP2022188583A (fr)
CN (1) CN117480599A (fr)
DE (1) DE112022002069T5 (fr)
WO (1) WO2022259676A1 (fr)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10332695A1 (de) * 2003-07-18 2005-02-03 Robert Bosch Gmbh Anordnung zur Befestigung eines Bauelements
JP5056325B2 (ja) * 2007-10-04 2012-10-24 富士電機株式会社 半導体装置の製造方法および半田ペースト塗布用のメタルマスク
JP7047895B2 (ja) 2018-03-01 2022-04-05 富士電機株式会社 半導体装置

Also Published As

Publication number Publication date
WO2022259676A1 (fr) 2022-12-15
CN117480599A (zh) 2024-01-30
DE112022002069T5 (de) 2024-01-25

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