JP2022168769A5 - - Google Patents

Download PDF

Info

Publication number
JP2022168769A5
JP2022168769A5 JP2021074476A JP2021074476A JP2022168769A5 JP 2022168769 A5 JP2022168769 A5 JP 2022168769A5 JP 2021074476 A JP2021074476 A JP 2021074476A JP 2021074476 A JP2021074476 A JP 2021074476A JP 2022168769 A5 JP2022168769 A5 JP 2022168769A5
Authority
JP
Japan
Prior art keywords
board
copper foil
pad
terminal piece
gaming machine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021074476A
Other languages
English (en)
Japanese (ja)
Other versions
JP2022168769A (ja
JP7582617B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2021074476A priority Critical patent/JP7582617B2/ja
Priority claimed from JP2021074476A external-priority patent/JP7582617B2/ja
Publication of JP2022168769A publication Critical patent/JP2022168769A/ja
Publication of JP2022168769A5 publication Critical patent/JP2022168769A5/ja
Application granted granted Critical
Publication of JP7582617B2 publication Critical patent/JP7582617B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2021074476A 2021-04-26 2021-04-26 遊技機 Active JP7582617B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2021074476A JP7582617B2 (ja) 2021-04-26 2021-04-26 遊技機

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021074476A JP7582617B2 (ja) 2021-04-26 2021-04-26 遊技機

Publications (3)

Publication Number Publication Date
JP2022168769A JP2022168769A (ja) 2022-11-08
JP2022168769A5 true JP2022168769A5 (enExample) 2023-10-03
JP7582617B2 JP7582617B2 (ja) 2024-11-13

Family

ID=83933731

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021074476A Active JP7582617B2 (ja) 2021-04-26 2021-04-26 遊技機

Country Status (1)

Country Link
JP (1) JP7582617B2 (enExample)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0497589A (ja) * 1990-08-16 1992-03-30 Nec Corp プリント配線基板
JPH0846338A (ja) * 1994-07-29 1996-02-16 Tec Corp 配線板
JPH09139567A (ja) * 1995-11-15 1997-05-27 Fujitsu Ltd プリント基板における表面実装部品搭載パッドと層間接続用スルーホールの接続構造
JP2006222268A (ja) * 2005-02-10 2006-08-24 Pioneer Electronic Corp 電子回路用基板
JP2018157166A (ja) * 2017-03-21 2018-10-04 サミー株式会社 回路基板アセンブリ及び製造方法
JP2018166977A (ja) * 2017-03-30 2018-11-01 京楽産業．株式会社 遊技機
JP6721560B2 (ja) * 2017-11-21 2020-07-15 株式会社三共 遊技機
JP2019145638A (ja) * 2018-02-20 2019-08-29 株式会社東芝 プリント基板の管理装置、管理方法、およびプリント基板
JP7341432B2 (ja) * 2020-11-05 2023-09-11 株式会社大一商会 遊技機

Similar Documents

Publication Publication Date Title
JP3925821B2 (ja) 印刷回路基板修理方法及びその装置
JP3343719B2 (ja) ケーブル用ライトアングルコネクタ
JPWO2006100764A1 (ja) プリント配線板
CN101394032A (zh) 具有双压聚合物和可弯曲接触阵列的连接器
JP2006518932A (ja) Ｐｃｂコネクタ
JP2022168769A5 (enExample)
JP2022168770A5 (enExample)
JP2022168771A5 (enExample)
JP2022168772A5 (enExample)
JP2022168775A5 (enExample)
JP2006222386A5 (enExample)
JP2022168774A5 (enExample)
JP2022168773A5 (enExample)
JP2022168776A5 (enExample)
JP2023163030A5 (enExample)
JP2023163031A5 (enExample)
CN102550133A (zh) 在电路板上布置组件的方法
US9510462B2 (en) Method for fabricating circuit board structure
US20070138617A1 (en) Using a thru-hole via to improve circuit density in a pcb
CN105357870B (zh) 一种基于模块化结构的印制电路板及相应的母板安装方法
EP1173051A4 (en) FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR PRODUCING THE SAME
JP5783706B2 (ja) プリント回路板
CN219876380U (zh) 一种控制器类产品结构
US6221459B1 (en) Controlling the heat expansion of electrical couplings
JPH0623019Y2 (ja) 大電流配線板ユニット