JP2022168775A5 - - Google Patents
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- JP2022168775A5 JP2022168775A5 JP2021074482A JP2021074482A JP2022168775A5 JP 2022168775 A5 JP2022168775 A5 JP 2022168775A5 JP 2021074482 A JP2021074482 A JP 2021074482A JP 2021074482 A JP2021074482 A JP 2021074482A JP 2022168775 A5 JP2022168775 A5 JP 2022168775A5
- Authority
- JP
- Japan
- Prior art keywords
- width
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- terminal piece
- board
- enlarged pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 239000011889 copper foil Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 2
- 238000012423 maintenance Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021074482A JP7526447B2 (ja) | 2021-04-26 | 2021-04-26 | 遊技機 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021074482A JP7526447B2 (ja) | 2021-04-26 | 2021-04-26 | 遊技機 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2022168775A JP2022168775A (ja) | 2022-11-08 |
| JP2022168775A5 true JP2022168775A5 (enExample) | 2023-10-03 |
| JP7526447B2 JP7526447B2 (ja) | 2024-08-01 |
Family
ID=83933549
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021074482A Active JP7526447B2 (ja) | 2021-04-26 | 2021-04-26 | 遊技機 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP7526447B2 (enExample) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006222268A (ja) | 2005-02-10 | 2006-08-24 | Pioneer Electronic Corp | 電子回路用基板 |
| JP2018157166A (ja) | 2017-03-21 | 2018-10-04 | サミー株式会社 | 回路基板アセンブリ及び製造方法 |
| JP6721560B2 (ja) | 2017-11-21 | 2020-07-15 | 株式会社三共 | 遊技機 |
| JP7167894B2 (ja) | 2019-10-04 | 2022-11-09 | 株式会社三洋物産 | 遊技機 |
| JP7341432B2 (ja) | 2020-11-05 | 2023-09-11 | 株式会社大一商会 | 遊技機 |
-
2021
- 2021-04-26 JP JP2021074482A patent/JP7526447B2/ja active Active
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