JP2022168773A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2022168773A5 JP2022168773A5 JP2021074480A JP2021074480A JP2022168773A5 JP 2022168773 A5 JP2022168773 A5 JP 2022168773A5 JP 2021074480 A JP2021074480 A JP 2021074480A JP 2021074480 A JP2021074480 A JP 2021074480A JP 2022168773 A5 JP2022168773 A5 JP 2022168773A5
- Authority
- JP
- Japan
- Prior art keywords
- terminal piece
- copper foil
- pad
- board
- gaming machine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 239000011889 copper foil Substances 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 2
- 238000012423 maintenance Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021074480A JP7526445B2 (ja) | 2021-04-26 | 2021-04-26 | 遊技機 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021074480A JP7526445B2 (ja) | 2021-04-26 | 2021-04-26 | 遊技機 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2022168773A JP2022168773A (ja) | 2022-11-08 |
| JP2022168773A5 true JP2022168773A5 (enExample) | 2023-10-03 |
| JP7526445B2 JP7526445B2 (ja) | 2024-08-01 |
Family
ID=83933550
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021074480A Active JP7526445B2 (ja) | 2021-04-26 | 2021-04-26 | 遊技機 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP7526445B2 (enExample) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006222268A (ja) * | 2005-02-10 | 2006-08-24 | Pioneer Electronic Corp | 電子回路用基板 |
| JP2018157166A (ja) * | 2017-03-21 | 2018-10-04 | サミー株式会社 | 回路基板アセンブリ及び製造方法 |
| JP6721560B2 (ja) * | 2017-11-21 | 2020-07-15 | 株式会社三共 | 遊技機 |
| JP7167894B2 (ja) * | 2019-10-04 | 2022-11-09 | 株式会社三洋物産 | 遊技機 |
| JP7341432B2 (ja) * | 2020-11-05 | 2023-09-11 | 株式会社大一商会 | 遊技機 |
-
2021
- 2021-04-26 JP JP2021074480A patent/JP7526445B2/ja active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3925821B2 (ja) | 印刷回路基板修理方法及びその装置 | |
| US6295210B1 (en) | Chassis grounding ring for a printed wiring board mounting aperture | |
| JP3343719B2 (ja) | ケーブル用ライトアングルコネクタ | |
| JPWO2006100764A1 (ja) | プリント配線板 | |
| JP2006288874A5 (enExample) | ||
| JP2006519467A5 (enExample) | ||
| JP2006518932A (ja) | Pcbコネクタ | |
| JP2019205498A5 (enExample) | ||
| JP2022168773A5 (enExample) | ||
| JP2022168774A5 (enExample) | ||
| JP2022168775A5 (enExample) | ||
| JP2006222386A5 (enExample) | ||
| JP2022168776A5 (enExample) | ||
| JP2011119123A (ja) | コネクタ | |
| JP2022168770A5 (enExample) | ||
| JP2022168769A5 (enExample) | ||
| JP2022168771A5 (enExample) | ||
| JP2022168772A5 (enExample) | ||
| JP2008227272A (ja) | プリント配線板および電子装置 | |
| US7456364B2 (en) | Using a thru-hole via to improve circuit density in a PCB | |
| CN105357870B (zh) | 一种基于模块化结构的印制电路板及相应的母板安装方法 | |
| JP2012099751A (ja) | プリント回路板 | |
| JPH10294564A (ja) | 多層プリント配線基板 | |
| JP2019141140A5 (enExample) | ||
| CN100546436C (zh) | 共用偷锡焊盘的方法 |