JP2022157318A - ピックアップコレット、ピックアップ装置及び実装装置 - Google Patents

ピックアップコレット、ピックアップ装置及び実装装置 Download PDF

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Publication number
JP2022157318A
JP2022157318A JP2021061461A JP2021061461A JP2022157318A JP 2022157318 A JP2022157318 A JP 2022157318A JP 2021061461 A JP2021061461 A JP 2021061461A JP 2021061461 A JP2021061461 A JP 2021061461A JP 2022157318 A JP2022157318 A JP 2022157318A
Authority
JP
Japan
Prior art keywords
electronic component
collet
pickup
pick
facing surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021061461A
Other languages
English (en)
Japanese (ja)
Inventor
洋祐 羽根
Yosuke Hane
正規 橋本
Masanori Hashimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Mechatronics Corp
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Priority to JP2021061461A priority Critical patent/JP2022157318A/ja
Priority to TW111111321A priority patent/TWI805288B/zh
Priority to CN202210298545.XA priority patent/CN115148656A/zh
Priority to KR1020220037829A priority patent/KR20220136197A/ko
Publication of JP2022157318A publication Critical patent/JP2022157318A/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/0409—Sucking devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Replacing, Conveying, And Pick-Finding For Filamentary Materials (AREA)
  • Sheets, Magazines, And Separation Thereof (AREA)
  • Manipulator (AREA)
JP2021061461A 2021-03-31 2021-03-31 ピックアップコレット、ピックアップ装置及び実装装置 Pending JP2022157318A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2021061461A JP2022157318A (ja) 2021-03-31 2021-03-31 ピックアップコレット、ピックアップ装置及び実装装置
TW111111321A TWI805288B (zh) 2021-03-31 2022-03-25 拾取筒夾、拾取裝置及安裝裝置
CN202210298545.XA CN115148656A (zh) 2021-03-31 2022-03-25 拾取筒夹、拾取装置及安装装置
KR1020220037829A KR20220136197A (ko) 2021-03-31 2022-03-28 픽업 콜릿, 픽업 장치 및 실장 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021061461A JP2022157318A (ja) 2021-03-31 2021-03-31 ピックアップコレット、ピックアップ装置及び実装装置

Publications (1)

Publication Number Publication Date
JP2022157318A true JP2022157318A (ja) 2022-10-14

Family

ID=83407225

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021061461A Pending JP2022157318A (ja) 2021-03-31 2021-03-31 ピックアップコレット、ピックアップ装置及び実装装置

Country Status (4)

Country Link
JP (1) JP2022157318A (zh)
KR (1) KR20220136197A (zh)
CN (1) CN115148656A (zh)
TW (1) TWI805288B (zh)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63124746A (ja) * 1986-11-14 1988-05-28 Toshiba Corp 亀甲形コイルの製造方法
JP5107408B2 (ja) * 2010-08-31 2012-12-26 東京エレクトロン株式会社 ピックアップ方法及びピックアップ装置
JP6839143B2 (ja) * 2017-09-28 2021-03-03 芝浦メカトロニクス株式会社 素子実装装置、素子実装方法及び素子実装基板製造方法

Also Published As

Publication number Publication date
TWI805288B (zh) 2023-06-11
CN115148656A (zh) 2022-10-04
KR20220136197A (ko) 2022-10-07
TW202240754A (zh) 2022-10-16

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Effective date: 20240216