JP2022142966A5 - - Google Patents

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Publication number
JP2022142966A5
JP2022142966A5 JP2021043264A JP2021043264A JP2022142966A5 JP 2022142966 A5 JP2022142966 A5 JP 2022142966A5 JP 2021043264 A JP2021043264 A JP 2021043264A JP 2021043264 A JP2021043264 A JP 2021043264A JP 2022142966 A5 JP2022142966 A5 JP 2022142966A5
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JP
Japan
Prior art keywords
wiring board
conductive layer
board according
surface resistivity
main surface
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Application number
JP2021043264A
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English (en)
Japanese (ja)
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JP7739018B2 (ja
JP2022142966A (ja
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Priority to JP2021043264A priority Critical patent/JP7739018B2/ja
Priority claimed from JP2021043264A external-priority patent/JP7739018B2/ja
Publication of JP2022142966A publication Critical patent/JP2022142966A/ja
Publication of JP2022142966A5 publication Critical patent/JP2022142966A5/ja
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Publication of JP7739018B2 publication Critical patent/JP7739018B2/ja
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JP2021043264A 2021-03-17 2021-03-17 配線板、電子ユニット、電子機器、及び配線板の製造方法 Active JP7739018B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2021043264A JP7739018B2 (ja) 2021-03-17 2021-03-17 配線板、電子ユニット、電子機器、及び配線板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021043264A JP7739018B2 (ja) 2021-03-17 2021-03-17 配線板、電子ユニット、電子機器、及び配線板の製造方法

Publications (3)

Publication Number Publication Date
JP2022142966A JP2022142966A (ja) 2022-10-03
JP2022142966A5 true JP2022142966A5 (enExample) 2024-03-21
JP7739018B2 JP7739018B2 (ja) 2025-09-16

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ID=83453836

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021043264A Active JP7739018B2 (ja) 2021-03-17 2021-03-17 配線板、電子ユニット、電子機器、及び配線板の製造方法

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JP (1) JP7739018B2 (enExample)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5150534B2 (ja) 2009-03-06 2013-02-20 信越ポリマー株式会社 カバーレイフィルム、その製造方法およびフレキシブルプリント配線板
JP6334877B2 (ja) 2013-09-26 2018-05-30 新日鉄住金化学株式会社 電磁波ノイズ抑制体及び回路基板

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