JP7739018B2 - 配線板、電子ユニット、電子機器、及び配線板の製造方法 - Google Patents

配線板、電子ユニット、電子機器、及び配線板の製造方法

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Publication number
JP7739018B2
JP7739018B2 JP2021043264A JP2021043264A JP7739018B2 JP 7739018 B2 JP7739018 B2 JP 7739018B2 JP 2021043264 A JP2021043264 A JP 2021043264A JP 2021043264 A JP2021043264 A JP 2021043264A JP 7739018 B2 JP7739018 B2 JP 7739018B2
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Japan
Prior art keywords
wiring board
conductive layer
acrylic
conductive
main surface
Prior art date
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JP2021043264A
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English (en)
Japanese (ja)
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JP2022142966A5 (enExample
JP2022142966A (ja
Inventor
優 小川
季行 吉田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
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Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2021043264A priority Critical patent/JP7739018B2/ja
Publication of JP2022142966A publication Critical patent/JP2022142966A/ja
Publication of JP2022142966A5 publication Critical patent/JP2022142966A5/ja
Application granted granted Critical
Publication of JP7739018B2 publication Critical patent/JP7739018B2/ja
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JP2021043264A 2021-03-17 2021-03-17 配線板、電子ユニット、電子機器、及び配線板の製造方法 Active JP7739018B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2021043264A JP7739018B2 (ja) 2021-03-17 2021-03-17 配線板、電子ユニット、電子機器、及び配線板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021043264A JP7739018B2 (ja) 2021-03-17 2021-03-17 配線板、電子ユニット、電子機器、及び配線板の製造方法

Publications (3)

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JP2022142966A JP2022142966A (ja) 2022-10-03
JP2022142966A5 JP2022142966A5 (enExample) 2024-03-21
JP7739018B2 true JP7739018B2 (ja) 2025-09-16

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JP2021043264A Active JP7739018B2 (ja) 2021-03-17 2021-03-17 配線板、電子ユニット、電子機器、及び配線板の製造方法

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Country Link
JP (1) JP7739018B2 (enExample)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010100931A1 (ja) 2009-03-06 2010-09-10 信越ポリマー株式会社 カバーレイフィルム、その製造方法およびフレキシブルプリント配線板
JP2015065389A (ja) 2013-09-26 2015-04-09 新日鉄住金化学株式会社 電磁波ノイズ抑制体及び回路基板

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010100931A1 (ja) 2009-03-06 2010-09-10 信越ポリマー株式会社 カバーレイフィルム、その製造方法およびフレキシブルプリント配線板
JP2015065389A (ja) 2013-09-26 2015-04-09 新日鉄住金化学株式会社 電磁波ノイズ抑制体及び回路基板

Also Published As

Publication number Publication date
JP2022142966A (ja) 2022-10-03

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