JP7739018B2 - 配線板、電子ユニット、電子機器、及び配線板の製造方法 - Google Patents
配線板、電子ユニット、電子機器、及び配線板の製造方法Info
- Publication number
- JP7739018B2 JP7739018B2 JP2021043264A JP2021043264A JP7739018B2 JP 7739018 B2 JP7739018 B2 JP 7739018B2 JP 2021043264 A JP2021043264 A JP 2021043264A JP 2021043264 A JP2021043264 A JP 2021043264A JP 7739018 B2 JP7739018 B2 JP 7739018B2
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- conductive layer
- acrylic
- conductive
- main surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021043264A JP7739018B2 (ja) | 2021-03-17 | 2021-03-17 | 配線板、電子ユニット、電子機器、及び配線板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021043264A JP7739018B2 (ja) | 2021-03-17 | 2021-03-17 | 配線板、電子ユニット、電子機器、及び配線板の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2022142966A JP2022142966A (ja) | 2022-10-03 |
| JP2022142966A5 JP2022142966A5 (enExample) | 2024-03-21 |
| JP7739018B2 true JP7739018B2 (ja) | 2025-09-16 |
Family
ID=83453836
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021043264A Active JP7739018B2 (ja) | 2021-03-17 | 2021-03-17 | 配線板、電子ユニット、電子機器、及び配線板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP7739018B2 (enExample) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010100931A1 (ja) | 2009-03-06 | 2010-09-10 | 信越ポリマー株式会社 | カバーレイフィルム、その製造方法およびフレキシブルプリント配線板 |
| JP2015065389A (ja) | 2013-09-26 | 2015-04-09 | 新日鉄住金化学株式会社 | 電磁波ノイズ抑制体及び回路基板 |
-
2021
- 2021-03-17 JP JP2021043264A patent/JP7739018B2/ja active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010100931A1 (ja) | 2009-03-06 | 2010-09-10 | 信越ポリマー株式会社 | カバーレイフィルム、その製造方法およびフレキシブルプリント配線板 |
| JP2015065389A (ja) | 2013-09-26 | 2015-04-09 | 新日鉄住金化学株式会社 | 電磁波ノイズ抑制体及び回路基板 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2022142966A (ja) | 2022-10-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP7581545B2 (ja) | 配線基板および電子機器 | |
| US8014162B2 (en) | Flexible printed circuit board | |
| JP7739018B2 (ja) | 配線板、電子ユニット、電子機器、及び配線板の製造方法 | |
| US12048093B2 (en) | Flexible wiring board, manufacturing method, electronic module, electronic unit, and electronic apparatus | |
| US20250040029A1 (en) | Flexible wiring board, electronic module, electronic unit, and electronic apparatus | |
| CN105591259B (zh) | 布线部件及其制造方法、设计布线部件的方法和电子装置 | |
| JP2023049844A (ja) | フレキシブル配線板、電子モジュール、電子ユニットおよび電子機器 | |
| JP7566839B2 (ja) | 配線板、製造方法、電子モジュール、電子ユニットおよび電子機器 | |
| US20240237196A9 (en) | Flexible wiring board, manufacturing method, electronic module, electronic unit, and electronic apparatus | |
| JP7604279B2 (ja) | フレキシブルプリント配線板、電子ユニット、電子機器、及びフレキシブルプリント配線板の製造方法 | |
| JP2024104588A (ja) | 配線板、配線板の製造方法、電子モジュールおよび電子機器 | |
| JP2024104589A (ja) | 配線板、配線板の製造方法、電子モジュールおよび電子機器 | |
| JP2008211053A (ja) | フレキシブルプリント配線板 | |
| JP7631022B2 (ja) | フレキシブルプリント配線基板、フレキシブルプリント配線基板を用いた電子機器、およびフレキシブルプリント配線基板の製造方法 | |
| JP2025062540A (ja) | フレキシブル配線板、製造方法、電子モジュール、電子ユニットおよび電子機器 | |
| KR101131584B1 (ko) | 연성 플랫 케이블용 전도성 필름 | |
| JP2025018913A (ja) | フレキシブル配線板、フレキシブル配線板の製造方法、電子モジュール、電子ユニットおよび電子機器 | |
| JP2021125493A (ja) | フレキシブル配線基板および電子機器 | |
| JP2023020883A (ja) | フレキシブル配線板、製造方法、電子モジュール、電子ユニットおよび電子機器 | |
| CN105591260A (zh) | 布线部件及其制造方法、设计布线部件的方法和电子装置 | |
| US12432848B2 (en) | Wiring board and electronic equipment | |
| KR101131587B1 (ko) | 연성 플랫 케이블용 전도성 필름 | |
| KR101995492B1 (ko) | 내열성이 우수한 전자파 차단 가스켓용 열경화성 접착필름 | |
| CN119626658A (zh) | 一种抗电磁波干扰的数据线及其制备方法 | |
| HK1156464A (en) | Shield film, shield circuit board having the same and grounding method of shield film |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20240312 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20240312 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20241031 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20241203 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250130 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20250422 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250617 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20250805 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20250903 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 7739018 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |