JP2022137081A - エポキシ樹脂組成物及びその硬化物 - Google Patents
エポキシ樹脂組成物及びその硬化物 Download PDFInfo
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- JP2022137081A JP2022137081A JP2022099467A JP2022099467A JP2022137081A JP 2022137081 A JP2022137081 A JP 2022137081A JP 2022099467 A JP2022099467 A JP 2022099467A JP 2022099467 A JP2022099467 A JP 2022099467A JP 2022137081 A JP2022137081 A JP 2022137081A
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- Prior art keywords
- epoxy resin
- resin composition
- resin
- phosphorus
- biphenyl
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000003822 epoxy resin Substances 0.000 title claims abstract description 148
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 148
- 239000000203 mixture Substances 0.000 title claims abstract description 58
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 66
- 239000005011 phenolic resin Substances 0.000 claims abstract description 56
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 8
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims description 55
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 48
- 229920005989 resin Polymers 0.000 claims description 47
- 239000011347 resin Substances 0.000 claims description 47
- 229920001568 phenolic resin Polymers 0.000 claims description 37
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 36
- 229910052698 phosphorus Inorganic materials 0.000 claims description 35
- 239000011574 phosphorus Substances 0.000 claims description 35
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 34
- 239000004305 biphenyl Substances 0.000 claims description 29
- 235000010290 biphenyl Nutrition 0.000 claims description 29
- 238000005227 gel permeation chromatography Methods 0.000 claims description 22
- 238000005259 measurement Methods 0.000 claims description 11
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 10
- 150000002430 hydrocarbons Chemical group 0.000 claims description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 5
- 229910052799 carbon Inorganic materials 0.000 claims description 5
- 125000003710 aryl alkyl group Chemical group 0.000 claims description 4
- 229930195733 hydrocarbon Natural products 0.000 claims description 4
- 239000004215 Carbon black (E152) Substances 0.000 claims description 3
- 239000004848 polyfunctional curative Substances 0.000 claims description 2
- 238000001723 curing Methods 0.000 description 64
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 42
- 230000015572 biosynthetic process Effects 0.000 description 30
- 238000003786 synthesis reaction Methods 0.000 description 30
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 29
- 229920003986 novolac Polymers 0.000 description 22
- -1 activated clay Chemical compound 0.000 description 17
- 239000003063 flame retardant Substances 0.000 description 17
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 16
- 150000001875 compounds Chemical class 0.000 description 15
- 238000000034 method Methods 0.000 description 14
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 13
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 12
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 12
- 238000006243 chemical reaction Methods 0.000 description 12
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 description 11
- 150000002989 phenols Chemical class 0.000 description 10
- 230000000704 physical effect Effects 0.000 description 10
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 9
- 239000002904 solvent Substances 0.000 description 9
- 238000012360 testing method Methods 0.000 description 9
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 8
- 238000001914 filtration Methods 0.000 description 8
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 239000004593 Epoxy Substances 0.000 description 7
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 7
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 7
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 7
- 125000004432 carbon atom Chemical group C* 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 7
- 229910052739 hydrogen Inorganic materials 0.000 description 7
- 239000001257 hydrogen Substances 0.000 description 7
- 238000003756 stirring Methods 0.000 description 7
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 6
- 229930185605 Bisphenol Natural products 0.000 description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 6
- 238000010521 absorption reaction Methods 0.000 description 6
- VCCBEIPGXKNHFW-UHFFFAOYSA-N biphenyl-4,4'-diol Chemical compound C1=CC(O)=CC=C1C1=CC=C(O)C=C1 VCCBEIPGXKNHFW-UHFFFAOYSA-N 0.000 description 6
- 239000011889 copper foil Substances 0.000 description 6
- 239000000835 fiber Substances 0.000 description 6
- 239000000945 filler Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 5
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 5
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 5
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 5
- 229910000831 Steel Inorganic materials 0.000 description 5
- 239000002253 acid Substances 0.000 description 5
- 150000001412 amines Chemical class 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 125000003700 epoxy group Chemical group 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 230000009477 glass transition Effects 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 239000003960 organic solvent Substances 0.000 description 5
- 239000010959 steel Substances 0.000 description 5
- INZDTEICWPZYJM-UHFFFAOYSA-N 1-(chloromethyl)-4-[4-(chloromethyl)phenyl]benzene Chemical group C1=CC(CCl)=CC=C1C1=CC=C(CCl)C=C1 INZDTEICWPZYJM-UHFFFAOYSA-N 0.000 description 4
- HIXDQWDOVZUNNA-UHFFFAOYSA-N 2-(3,4-dimethoxyphenyl)-5-hydroxy-7-methoxychromen-4-one Chemical compound C=1C(OC)=CC(O)=C(C(C=2)=O)C=1OC=2C1=CC=C(OC)C(OC)=C1 HIXDQWDOVZUNNA-UHFFFAOYSA-N 0.000 description 4
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 4
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 4
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- 125000003118 aryl group Chemical group 0.000 description 4
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 4
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Chemical compound FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 description 4
- 229930003836 cresol Natural products 0.000 description 4
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 4
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 4
- 239000003085 diluting agent Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- 150000002170 ethers Chemical class 0.000 description 4
- 239000011229 interlayer Substances 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- 150000003018 phosphorus compounds Chemical class 0.000 description 4
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 4
- 150000003839 salts Chemical class 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 3
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 3
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 3
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 3
- WVDDGKGOMKODPV-UHFFFAOYSA-N Benzyl alcohol Chemical compound OCC1=CC=CC=C1 WVDDGKGOMKODPV-UHFFFAOYSA-N 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- SFHGONLFTNHXDX-UHFFFAOYSA-N [4-[4-(hydroxymethyl)phenyl]phenyl]methanol Chemical compound C1=CC(CO)=CC=C1C1=CC=C(CO)C=C1 SFHGONLFTNHXDX-UHFFFAOYSA-N 0.000 description 3
- 150000008065 acid anhydrides Chemical class 0.000 description 3
- 150000001298 alcohols Chemical class 0.000 description 3
- 150000001299 aldehydes Chemical class 0.000 description 3
- 125000000217 alkyl group Chemical group 0.000 description 3
- 239000002585 base Substances 0.000 description 3
- JWAZRIHNYRIHIV-UHFFFAOYSA-N beta-hydroxynaphthyl Natural products C1=CC=CC2=CC(O)=CC=C21 JWAZRIHNYRIHIV-UHFFFAOYSA-N 0.000 description 3
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical class C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 3
- 150000005205 dihydroxybenzenes Chemical class 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 125000000524 functional group Chemical group 0.000 description 3
- 239000003365 glass fiber Substances 0.000 description 3
- 150000002460 imidazoles Chemical class 0.000 description 3
- 150000002576 ketones Chemical class 0.000 description 3
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 3
- 239000000347 magnesium hydroxide Substances 0.000 description 3
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 3
- NXPPAOGUKPJVDI-UHFFFAOYSA-N naphthalene-1,2-diol Chemical compound C1=CC=CC2=C(O)C(O)=CC=C21 NXPPAOGUKPJVDI-UHFFFAOYSA-N 0.000 description 3
- 150000002903 organophosphorus compounds Chemical class 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 230000009257 reactivity Effects 0.000 description 3
- 125000001424 substituent group Chemical group 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 3
- YFNKIDBQEZZDLK-UHFFFAOYSA-N triglyme Chemical compound COCCOCCOCCOC YFNKIDBQEZZDLK-UHFFFAOYSA-N 0.000 description 3
- 239000002966 varnish Substances 0.000 description 3
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 2
- FRASJONUBLZVQX-UHFFFAOYSA-N 1,4-naphthoquinone Chemical compound C1=CC=C2C(=O)C=CC(=O)C2=C1 FRASJONUBLZVQX-UHFFFAOYSA-N 0.000 description 2
- 125000004343 1-phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])(*)C([H])([H])[H] 0.000 description 2
- YBYIRNPNPLQARY-UHFFFAOYSA-N 1H-indene Chemical compound C1=CC=C2CC=CC2=C1 YBYIRNPNPLQARY-UHFFFAOYSA-N 0.000 description 2
- BYLSIPUARIZAHZ-UHFFFAOYSA-N 2,4,6-tris(1-phenylethyl)phenol Chemical compound C=1C(C(C)C=2C=CC=CC=2)=C(O)C(C(C)C=2C=CC=CC=2)=CC=1C(C)C1=CC=CC=C1 BYLSIPUARIZAHZ-UHFFFAOYSA-N 0.000 description 2
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 2
- FPZWZCWUIYYYBU-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl acetate Chemical compound CCOCCOCCOC(C)=O FPZWZCWUIYYYBU-UHFFFAOYSA-N 0.000 description 2
- GJYCVCVHRSWLNY-UHFFFAOYSA-N 2-butylphenol Chemical compound CCCCC1=CC=CC=C1O GJYCVCVHRSWLNY-UHFFFAOYSA-N 0.000 description 2
- XLLIQLLCWZCATF-UHFFFAOYSA-N 2-methoxyethyl acetate Chemical compound COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 description 2
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 2
- WDGCBNTXZHJTHJ-UHFFFAOYSA-N 2h-1,3-oxazol-2-id-4-one Chemical group O=C1CO[C-]=N1 WDGCBNTXZHJTHJ-UHFFFAOYSA-N 0.000 description 2
- HGINCPLSRVDWNT-UHFFFAOYSA-N Acrolein Chemical compound C=CC=O HGINCPLSRVDWNT-UHFFFAOYSA-N 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229910015900 BF3 Inorganic materials 0.000 description 2
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N Butyraldehyde Chemical compound CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- 229910019142 PO4 Inorganic materials 0.000 description 2
- FQYUMYWMJTYZTK-UHFFFAOYSA-N Phenyl glycidyl ether Chemical compound C1OC1COC1=CC=CC=C1 FQYUMYWMJTYZTK-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- DTQVDTLACAAQTR-UHFFFAOYSA-N Trifluoroacetic acid Chemical compound OC(=O)C(F)(F)F DTQVDTLACAAQTR-UHFFFAOYSA-N 0.000 description 2
- XMUZQOKACOLCSS-UHFFFAOYSA-N [2-(hydroxymethyl)phenyl]methanol Chemical compound OCC1=CC=CC=C1CO XMUZQOKACOLCSS-UHFFFAOYSA-N 0.000 description 2
- 239000003377 acid catalyst Substances 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 2
- VSCWAEJMTAWNJL-UHFFFAOYSA-K aluminium trichloride Chemical compound Cl[Al](Cl)Cl VSCWAEJMTAWNJL-UHFFFAOYSA-K 0.000 description 2
- 150000001408 amides Chemical class 0.000 description 2
- 125000003277 amino group Chemical group 0.000 description 2
- ZRIUUUJAJJNDSS-UHFFFAOYSA-N ammonium phosphates Chemical compound [NH4+].[NH4+].[NH4+].[O-]P([O-])([O-])=O ZRIUUUJAJJNDSS-UHFFFAOYSA-N 0.000 description 2
- 150000001491 aromatic compounds Chemical class 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- HUMNYLRZRPPJDN-UHFFFAOYSA-N benzaldehyde Chemical compound O=CC1=CC=CC=C1 HUMNYLRZRPPJDN-UHFFFAOYSA-N 0.000 description 2
- IMHDGJOMLMDPJN-UHFFFAOYSA-N biphenyl-2,2'-diol Chemical compound OC1=CC=CC=C1C1=CC=CC=C1O IMHDGJOMLMDPJN-UHFFFAOYSA-N 0.000 description 2
- 229910001593 boehmite Inorganic materials 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 239000012776 electronic material Substances 0.000 description 2
- MTZQAGJQAFMTAQ-UHFFFAOYSA-N ethyl benzoate Chemical compound CCOC(=O)C1=CC=CC=C1 MTZQAGJQAFMTAQ-UHFFFAOYSA-N 0.000 description 2
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N fluorene Chemical compound C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 2
- LEQAOMBKQFMDFZ-UHFFFAOYSA-N glyoxal Chemical compound O=CC=O LEQAOMBKQFMDFZ-UHFFFAOYSA-N 0.000 description 2
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- C08G61/02—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
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- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
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- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
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Abstract
Description
特許文献7では、4,4-ビフェノールとビス(ジメチロール)ビフェニルから得られる多価ヒドロキシ化合物を硬化剤として使用することが比較例として開示されている。しかしながら、開示されている多価ヒドロキシ化合物は耐熱性が十分ではなかった。
本発明のエポキシ樹脂組成物は、エポキシ樹脂及び硬化剤を必須成分とする。硬化剤の少なくとも一部は、上記一般式(1)で表されるビフェニルアラルキル型フェノール樹脂である。
一般式(1)において、R1、R2、及びR3はそれぞれ独立に水素原子又は炭素数1~8の炭化水素基を表す。炭素数1~8の炭化水素基としては、例えば、メチル基、エチル基、プロピル基、イソプロピル基、n-ブチル基、t-ブチル基、ヘキシル基等の炭素数1~8のアルキル基や、シクロヘキシル基等の炭素数5~8のシクロアルキル基や、フェニル基、トリル基、キシリル基等の炭素数6~8のアリール基や、ベンジル基、フェネチル基、1-フェニルエチル基等の炭素数7~8のアラルキル基が挙げられるが、これらに限定されず、各々同一でも異なっていても良い。好ましいR1、R2、及びR3としては、入手の容易性及び硬化物としたときの耐熱性等の物性の観点から、水素原子、1-フェニルエチル基、又はメチル基である。
158=(186+364×n’)/(2+2×n’)
が成立するので、n’は2.7と求められる。
上記nが0であるn=0成分の含有量は、溶剤溶解性の観点からGPC測定で15面積%未満であり、10面積%以下が好ましく、6面積%以下がより好ましい。特に、積層板用途等で有機溶媒に溶解して使用する場合は、2~5面積%が好ましい。
n=5成分以上の含有量は、耐熱性向上の観点から20面積%以上であり、25面積%以上が好ましく、27面積%以上がより好ましい。なお、GPCの測定条件は実施例に記載の方法による。
ロペンタジエン型エポキシ樹脂、リン含有エポキシ樹脂、オキサゾリドン環含有エポキシ樹脂を使用することが好ましい。
上記一般式(1)で表されるビフェニルアラルキル型フェノール樹脂を原料とし、そのフェノール性水酸基をエポキシ化してなるエポキシ樹脂を使用することもできる。
これらのエポキシ樹脂のエポキシ当量(g/eq.)は、100~800が好ましく、
200~780がより好ましく、300~760がさらに好ましく、400~740が特に好ましい。
また、併用できるリン非含有エポキシ樹脂としては特に制限はなく、上記のエポキシ樹脂が併用できるが、ノボラック型エポキシ樹脂等の3官能以上のエポキシ樹脂が好ましい。リン非含有エポキシ樹脂を併用する場合は、リン含有エポキシ樹脂とリン非含有エポキシ樹脂との混合エポキシ樹脂組成物としてのリン含有率が、リン含有エポキシ樹脂の好ましいリン含有率になるように、リン含有エポキシ樹脂のリン含有率やリン含有エポキシ樹脂とリン非含有エポキシ樹脂の混合量を調整する。
反応性希釈剤は、主に無溶媒系で粘度の低減やゲルタイムの調整をする場合に使用される。この使用量が多いと、硬化反応が十分に進行せずに未反応成分が硬化物からブリードアウトする恐れや、機械強度等の硬化物物性を低下させる恐れがあるため、必要以上に使用しないことが好ましい。そのため、エポキシ樹脂中に30質量%以下が好ましく、20質量%以下がより好ましく、10質量%以下がさらに好ましい。
(A-1):リン含有エポキシ樹脂(新日鉄住金化学株式会社製、製品名:FX-1225、エポキシ当量320、リン含有率2.5%)
(A-2):リン含有エポキシ樹脂(新日鉄住金化学株式会社製、製品名:YDFR-1320、エポキシ当量747、リン含有率5.0%)
(A-3):ジシクロペンタジエン型エポキシ樹脂(DIC株式会社製、製品名:HP-7200H、エポキシ当量280、軟化点82℃)
(A-4):ビフェノールアラルキル型エポキシ樹脂(特許文献6の合成例1に記載の方法で合成した樹脂、エポキシ当量197、融点125℃)
(B-1):合成例1で得られたビフェニルアラルキル型フェノール樹脂
(B-2):合成例2で得られたビフェニルアラルキル型フェノール樹脂
(B-3):合成例3で得られたビフェニルアラルキル型フェノール樹脂
(B-4):合成例4で得られたビフェニルアラルキル型フェノール樹脂
(B-5):合成例5で得られたビフェニルアラルキル型フェノール樹脂
(B-6):合成例6で得られたビフェニルアラルキル型フェノール樹脂
(B-7):合成例7で得られたビフェニルアラルキル型フェノール樹脂
(B-8):リン含有フェノール硬化剤(Shin-AT&C社製、製品名:LC-950PM60、フェノール性水酸基当量340、リン含有率9.2%)
(B-9):フェノールノボラック樹脂(アイカSDKフェノール株式会社製、製品名:BRG-557、フェノール性水酸基当量105)
(B-10):フェノール樹脂(明和化成株式会社製、製品名:MEH-7851-3H、フェノール水酸基当量223)
(B-11):フェノール樹脂(群栄化学工業株式会社製、製品名:TPM-100、フェノール水酸基当量98)
(B-12):ジシアンジアミド(日本カーバイド工業株式会社製、製品名:DIHARD、活性水素当量21)
(C-1):2-エチル-4-メチルイミダゾール(四国化成工業株式会社製、製品名:キュアゾール2E4MZ)
(C-2):トリフェニルホスフィン:(北興化学工業株式会社製、製品名;ホクコーTPP)
撹拌機、温度計、窒素吹き込み管、及び冷却管を備えた反応装置に、4,4’-ビフェノール246.2部(1.32モル)、ジエチレングリコールジメチルエーテル379.1部、4,4’-ビスクロロメチルビフェニル132.9部(0.53モル)を仕込み、窒素気流下、撹拌しながら170℃まで昇温して2時間反応させた。反応後、減圧下にてジエチレングリコールジメチルエーテルを全量留去し、トルエン311部、メチルイソブチルケトン104部を仕込み撹拌混合し、室温まで冷却した後、析出したn=0成分を濾別して除いた後、トルエン及びメチルイソブチルケトンを留去し、ビフェニルアラルキル型フェノール樹脂(B-1)187部を得た。得られた樹脂の物性を表1に示し、GPCを図1に示す。
合成例1と同様な操作で反応した後、減圧下にてジエチレングリコールジメチルエーテルを全量留去し、トルエン473部、メチルイソブチルケトン158部を仕込み撹拌混合し、室温まで冷却した後、析出したn=0成分を濾別して除いた後、トルエン及びメチルイソブチルケトンを留去し、ビフェニルアラルキル型樹脂(B-2)203部を得た。得られた樹脂の物性を表1に示し、GPCを図2に示す。
合成例1と同様な操作で反応した後、トルエン379部を仕込み撹拌混合し、室温まで冷却した後、析出したn=0成分を濾別して除いた後、ジエチレングリコールジメチルエーテル及びトルエンを留去し、ビフェニルアラルキル型フェノール樹脂(B-3)153部を得た。得られた樹脂の物性を表1に示し、GPCを図3に示す。
合成例1と同様な装置に、4,4’-ビフェノール269.9部(1.45モル)、ジエチレングリコールジメチルエーテル379.1部、4,4’-ビスクロロメチルビフェニル109.2部(0.44モル)を仕込み、窒素気流下、攪拌しながら170℃まで昇温して2時間反応させた。反応後、減圧下にてジエチレングリコールジメチルエーテルを全量留去し、トルエン260部、メチルイソブチルケトン87部を仕込み撹拌混合し、室温まで冷却した後、析出したn=0成分を濾別して除いた後、トルエン及びメチルイソブチルケトンを留去し、ビフェニルアラルキル型フェノール樹脂(B-4)190部を得た。得られた樹脂の物性を表1に示し、GPCを図4に示す。
合成例1と同様な装置に、4,4’-ビフェノール226.4部(1.22モル)、ジエチレングリコールジメチルエーテル379.1部、4,4’-ビスクロロメチルビフェニル152.7部(0.61モル)を仕込み、窒素気流下、攪拌しながら170℃まで昇温して2時間反応させた。反応後、減圧下にてジエチレングリコールジメチルエーテルを全量留去し、トルエン250部、メチルイソブチルケトン83部を仕込み撹拌混合し、室温まで冷却した後、析出したn=0成分を濾別して除いた後、トルエン及びメチルイソブチルケトンを留去し、ビフェニルアラルキル型フェノール樹脂(B-5)183部を得た。得られた樹脂の物性を表1に示し、GPCを図5に示す。
合成例1と同様な操作で反応した後、減圧下にてジエチレングリコールジメチルエーテルを全量留去し、トルエン424部、メチルイソブチルケトン85部を仕込み撹拌混合し、室温まで冷却した後、析出したn=0成分を濾別して除いた後、トルエン及びメチルイソブチルケトンを留去し、ビフェニルアラルキル型フェノール樹脂(B-6)158部を得た。得られた樹脂の物性を表1に示し、GPCを図6に示す。
合成例1と同様な操作で反応した後、減圧下にてジエチレングリコールジメチルエーテルを全量留去し、メチルエチルケトン339部を仕込み撹拌混合し、室温まで冷却した後、析出したn=0成分を濾別して除いた後、メチルエチルケトンを留去し、ビフェニルアラルキル型フェノール樹脂(B-7)208部を得た。得られた樹脂の物性を表1に示し、GPCを図7に示す。
エポキシ樹脂として(A-4)100部、硬化剤として(B-1)80部、及び硬化促進剤として(C-2)1部を混練して樹脂組成物を得た。得られたエポキシ樹脂組成物を用いて175℃で成形し、さらに175℃にて12時間ポストキュアを行い、硬化物を得た。硬化物のガラス転移温度(Tg・TMA)を表2に示す。
合成例3~7で得られた樹脂(B-3)~(B-7)、又はフェノールノボラック樹脂(B-9)、フェノール樹脂(B-11)を使用し、表2の配合とした他は、実施例1と同様にして、エポキシ樹脂組成物を得て、さらに硬化物を得た。実施例1と同様の試験を行った結果を表2に示す。なお、表中の「-」は未使用を表す。
リン含有エポキシ樹脂として(A-1)100部、硬化剤として(B-1)50部、硬化促進剤として(C-1)0.03部を配合し、MEK、プロピレングリコールモノメチルエーテル、N,N-ジメチルホルムアミドで調整した混合溶剤に溶解して、エポキシ樹脂組成物ワニスを得た。得られたエポキシ樹脂組成物ワニスをガラスクロス(日東紡績株式会社製、WEA 7628 XS13、0.18mm厚)に含浸した。含浸したガラスクロスを150℃の熱風循環オーブン中で9分間乾燥してプリプレグを得た。得られたプリプレグ8枚と、上下に銅箔(三井金属鉱業株式会社製、3EC-III、厚み35μm)を重ね、130℃×15分+190℃×80分の温度条件で2MPaの真空プレスを行い、1.6mm厚の積層板を得た。得られた積層板の銅箔部分をエッチング液に浸漬することで除去し、洗浄と乾燥を行った後に、127mm×12.7mmの大きさに切り出して難燃性測定用試験片とした。積層板の銅箔剥離強さ、層間接着力、ガラス転移温度(Tg・DSC)及び難燃性の結果を表3に示す。
エポキシ樹脂として(A-1)を、硬化剤として(B-1)~(B-2)、(B-4)
~(B-5)、(B-9)~(B-12)を、硬化促進剤として(C-1)を表3の配合量(部)で配合し、実施例5と同様の操作を行い、積層板及び試験片を得た。実施例5と同様の試験を行い、その結果を表3に示す。
エポキシ樹脂として(A-1)~(A-3)を、硬化剤として(B-1)、(B-8)
~(B-9)を、硬化促進剤として(C-1)を表4の配合量(部)で配合し、実施例5と同様の操作を行い、積層板及び試験片を得た。実施例5と同様の試験を行い、その結果を表4に示す。
Claims (7)
- エポキシ樹脂及び硬化剤を必須成分とするエポキシ樹脂組成物であって、硬化剤の50質量%以上は、下記一般式(1)で表されるビフェニルアラルキル型フェノール樹脂であり、該ビフェニルアラルキル型フェノール樹脂は、フェノール性水酸基当量が150~160g/eq.であり、ゲルパーミエーションクロマトグラフィー測定で、一般式(1)におけるnが0である成分が15面積%未満であり、nが5以上である成分が20面積%以上であることを特徴とするエポキシ樹脂組成物。
- 上記エポキシ樹脂の一部又は全部が、リン含有エポキシ樹脂である請求項1に記載のエポキシ樹脂組成物。
- 請求項1又は2に記載のエポキシ樹脂組成物を硬化してなる硬化物。
- 請求項1又は2に記載のエポキシ樹脂組成物を用いたことを特徴とするプリプレグ。
- 請求項1又は2に記載のエポキシ樹脂組成物を用いたことを特徴とする積層板。
- 請求項1又は2に記載のエポキシ樹脂組成物を用いたことを特徴とするプリント配線基板。
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