JP2022123120A - インダクター及びその製造方法 - Google Patents
インダクター及びその製造方法 Download PDFInfo
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 17
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- H01F17/0013—Printed inductances with stacked layers
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- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
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- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
- Insulating Of Coils (AREA)
Abstract
Description
図1は本発明の一例によるインダクターの概略的な斜視図であり、図2は図1のI-I'線に沿って切断した概略的な断面図である。
本発明のインダクターの製造方法を説明する前に、図3aから図3dを参照して、通常の薄膜インダクターを製造する従来の製造方法を説明する。
1 本体
11 支持部材
12 コイル
13 封止材
21、22 第1及び第2外部電極
Claims (12)
- 本体と、前記本体内部に配置された支持部材、及び前記支持部材により支持されるコイルと、
前記本体の外部面における前記支持部材の側面に接して配置される外部電極と、を含むインダクターであって、
前記コイルは複数のコイルパターンを含み、前記複数のコイルパターンのそれぞれは、第1コイル層と、前記第1コイル層上に配置される第2コイル層と、を含み、
前記本体は、磁性粉末を含み、前記複数のコイルパターンにおいて互いに隣接したものの間の空間内に充填されており、
前記本体は、前記第1コイル層の間で前記支持部材に向かう方向に延びるように配置される、インダクター。 - 前記複数のコイルパターンの表面は絶縁層によりコーティングされる、請求項1に記載のインダクター。
- 前記絶縁層は、その下に配置されるコイルパターンの外表面の形状に応じて構成される、請求項2に記載のインダクター。
- 前記絶縁層はペリレンを含む、請求項2または3に記載のインダクター。
- 互いに隣接する前記絶縁層の間の空間内に前記本体が充填されている、請求項2から4のいずれか一項に記載のインダクター。
- 前記第1コイル層の上面の幅は、前記第2コイル層の下面の幅と同一である、請求項1から5のいずれか一項に記載のインダクター。
- 前記コイルのアスペクト比は2以上20以下である、請求項1から6のいずれか一項に記載のインダクター。
- 互いに隣接する前記第1コイル層間の平均距離は、互いに隣接する第2コイル層間の平均距離と同一である、請求項1から7のいずれか一項に記載のインダクター。
- 前記第1コイル層と前記第2コイル層は互いに異なる材料で構成される、請求項1から8のいずれか一項に記載のインダクター。
- 前記第1コイル層は、チタン(Ti)、ニッケル(Ni)、及びモリブデン(Mo)のうちの一つ以上を含み、
前記第2コイル層は銅(Cu)を含む、請求項9に記載のインダクター。 - 前記支持部材はビアホールを含み、前記ビアホールが電気伝導性を有する材料で充填されて貫通ビアが形成され、前記貫通ビアは、前記貫通ビア上に配置される前記第1コイル層の下面と不連続的に配置される、請求項1から10のいずれか一項に記載のインダクター。
- 前記貫通ビアの材料は、前記第1コイル層の材料と異なる、請求項11に記載のインダクター。
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US (1) | US11145452B2 (ja) |
JP (4) | JP6502464B2 (ja) |
KR (1) | KR101862503B1 (ja) |
CN (2) | CN108281261B (ja) |
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KR101751117B1 (ko) * | 2015-07-31 | 2017-06-26 | 삼성전기주식회사 | 코일 전자 부품 및 그 제조방법 |
KR101862503B1 (ko) * | 2017-01-06 | 2018-05-29 | 삼성전기주식회사 | 인덕터 및 그의 제조방법 |
TWI798287B (zh) * | 2017-12-08 | 2023-04-11 | 日商日本電產理德股份有限公司 | Mi元件的製造方法及mi元件 |
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CN111863403A (zh) | 2020-10-30 |
JP7096187B2 (ja) | 2022-07-05 |
KR101862503B1 (ko) | 2018-05-29 |
CN111863403B (zh) | 2024-07-09 |
CN108281261B (zh) | 2020-09-08 |
US11145452B2 (en) | 2021-10-12 |
JP2019145804A (ja) | 2019-08-29 |
JP2018113434A (ja) | 2018-07-19 |
CN108281261A (zh) | 2018-07-13 |
US20180197672A1 (en) | 2018-07-12 |
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