JP2022119382A5 - - Google Patents

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Publication number
JP2022119382A5
JP2022119382A5 JP2021016454A JP2021016454A JP2022119382A5 JP 2022119382 A5 JP2022119382 A5 JP 2022119382A5 JP 2021016454 A JP2021016454 A JP 2021016454A JP 2021016454 A JP2021016454 A JP 2021016454A JP 2022119382 A5 JP2022119382 A5 JP 2022119382A5
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JP
Japan
Prior art keywords
substrate
photoelectric conversion
conversion device
heat dissipation
dissipation structure
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021016454A
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English (en)
Japanese (ja)
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JP2022119382A (ja
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Publication date
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Priority to JP2021016454A priority Critical patent/JP2022119382A/ja
Priority claimed from JP2021016454A external-priority patent/JP2022119382A/ja
Priority to US17/590,672 priority patent/US20220246661A1/en
Publication of JP2022119382A publication Critical patent/JP2022119382A/ja
Publication of JP2022119382A5 publication Critical patent/JP2022119382A5/ja
Pending legal-status Critical Current

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JP2021016454A 2021-02-04 2021-02-04 光電変換装置、光電変換システム、移動体 Pending JP2022119382A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2021016454A JP2022119382A (ja) 2021-02-04 2021-02-04 光電変換装置、光電変換システム、移動体
US17/590,672 US20220246661A1 (en) 2021-02-04 2022-02-01 Photoelectric conversion apparatus, photoelectric conversion system, and mobile body

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021016454A JP2022119382A (ja) 2021-02-04 2021-02-04 光電変換装置、光電変換システム、移動体

Publications (2)

Publication Number Publication Date
JP2022119382A JP2022119382A (ja) 2022-08-17
JP2022119382A5 true JP2022119382A5 (https=) 2024-02-01

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ID=82611658

Family Applications (1)

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JP2021016454A Pending JP2022119382A (ja) 2021-02-04 2021-02-04 光電変換装置、光電変換システム、移動体

Country Status (2)

Country Link
US (1) US20220246661A1 (https=)
JP (1) JP2022119382A (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022119375A (ja) * 2021-02-04 2022-08-17 キヤノン株式会社 光電変換装置
WO2024101204A1 (ja) * 2022-11-10 2024-05-16 ソニーセミコンダクタソリューションズ株式会社 光検出装置及び積層基板

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2865099B1 (ja) * 1997-10-15 1999-03-08 日本電気株式会社 半導体装置
JP4159861B2 (ja) * 2002-11-26 2008-10-01 新日本無線株式会社 プリント回路基板の放熱構造の製造方法
US7705342B2 (en) * 2005-09-16 2010-04-27 University Of Cincinnati Porous semiconductor-based evaporator having porous and non-porous regions, the porous regions having through-holes
JP2008258578A (ja) * 2007-03-12 2008-10-23 Denso Corp 半導体装置
JP2009118145A (ja) * 2007-11-06 2009-05-28 Canon Inc 半導体ユニット及びカメラ
US8083372B2 (en) * 2008-04-25 2011-12-27 Epson Imaging Devices Corporation Illumination system, electro-optic device, and electronic apparatus
JP2010021451A (ja) * 2008-07-14 2010-01-28 Panasonic Corp 固体撮像装置およびその製造方法
US8039797B2 (en) * 2008-11-13 2011-10-18 Han Vision Co., Ltd. Semiconductor for sensing infrared radiation and method thereof
US8274101B2 (en) * 2009-10-20 2012-09-25 Omnivision Technologies, Inc. CMOS image sensor with heat management structures
JP5911201B2 (ja) * 2011-04-20 2016-04-27 キヤノン株式会社 カメラ装置の自動追尾制御装置及びそれを有する自動追尾カメラシステム
TWI529939B (zh) * 2012-02-08 2016-04-11 新力股份有限公司 High frequency semiconductor device and its manufacturing method
JP6214132B2 (ja) * 2012-02-29 2017-10-18 キヤノン株式会社 光電変換装置、撮像システムおよび光電変換装置の製造方法
JP6090060B2 (ja) * 2013-08-23 2017-03-08 株式会社豊田中央研究所 シングルフォトンアバランシェダイオード
US9780276B2 (en) * 2014-01-23 2017-10-03 Suzhou Institute of Nano-tech and Nano-bionics, Chinese Academy of Sciences Wafer-level semiconductor device and manufacturing method thereof
US10083499B1 (en) * 2016-10-11 2018-09-25 Google Llc Methods and apparatus to reduce compression artifacts in images
KR102430496B1 (ko) * 2017-09-29 2022-08-08 삼성전자주식회사 이미지 센싱 장치 및 그 제조 방법
JP7527755B2 (ja) * 2018-02-09 2024-08-05 キヤノン株式会社 光電変換装置および撮像システム
US11820289B2 (en) * 2018-07-31 2023-11-21 Sony Semiconductor Solutions Corporation Solid-state imaging device and electronic device
KR102899656B1 (ko) * 2018-07-31 2025-12-11 소니 세미컨덕터 솔루션즈 가부시키가이샤 적층형 수광 센서 및 전자기기
JP7402606B2 (ja) * 2018-10-31 2023-12-21 ソニーセミコンダクタソリューションズ株式会社 固体撮像装置及び電子機器

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