JP2019522449A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2019522449A5 JP2019522449A5 JP2019518183A JP2019518183A JP2019522449A5 JP 2019522449 A5 JP2019522449 A5 JP 2019522449A5 JP 2019518183 A JP2019518183 A JP 2019518183A JP 2019518183 A JP2019518183 A JP 2019518183A JP 2019522449 A5 JP2019522449 A5 JP 2019522449A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- transducer
- ultrasonic transducer
- cells
- ultrasonic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201662352394P | 2016-06-20 | 2016-06-20 | |
| US62/352,394 | 2016-06-20 | ||
| PCT/US2017/038105 WO2017222969A1 (en) | 2016-06-20 | 2017-06-19 | Electrical contact arrangement for microfabricated ultrasonic transducer |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2019522449A JP2019522449A (ja) | 2019-08-08 |
| JP2019522449A5 true JP2019522449A5 (https=) | 2020-07-27 |
| JP7026111B2 JP7026111B2 (ja) | 2022-02-25 |
Family
ID=60659817
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019518183A Active JP7026111B2 (ja) | 2016-06-20 | 2017-06-19 | 微細加工超音波トランスデューサのための電気接点配置 |
Country Status (9)
| Country | Link |
|---|---|
| US (3) | US10497856B2 (https=) |
| EP (1) | EP3471897B1 (https=) |
| JP (1) | JP7026111B2 (https=) |
| KR (1) | KR20190022644A (https=) |
| CN (2) | CN109414727B (https=) |
| AU (1) | AU2017281280B2 (https=) |
| CA (1) | CA3026157A1 (https=) |
| TW (1) | TWI721183B (https=) |
| WO (1) | WO2017222969A1 (https=) |
Families Citing this family (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI721183B (zh) * | 2016-06-20 | 2021-03-11 | 美商蝴蝶網路公司 | 用於微製造超音波傳感器的電接點配置 |
| US10676349B1 (en) | 2016-08-12 | 2020-06-09 | Sitime Corporation | MEMS resonator |
| US11515465B2 (en) * | 2018-02-26 | 2022-11-29 | Invensense, Inc. | EMI reduction in piezoelectric micromachined ultrasound transducer array |
| CN112075090B (zh) | 2018-05-03 | 2022-10-14 | 蝴蝶网络有限公司 | 用于cmos传感器上的超声换能器的压力端口 |
| WO2019222118A1 (en) * | 2018-05-14 | 2019-11-21 | Exo Imaging, Inc. | INTEGRATION TECHNIQUES FOR MICROMACHINED pMUT ARRAYS AND ELECTRONICS USING THERMOCOMPRESSION BONDING, EUTECTIC BONDING, AND SOLDER BONDING |
| CA3105492A1 (en) * | 2018-07-06 | 2020-01-09 | Butterfly Network, Inc. | Methods and apparatuses for packaging an ultrasound-on-a-chip |
| US11087582B2 (en) * | 2018-10-19 | 2021-08-10 | Igt | Electronic gaming machine providing enhanced physical player interaction |
| US11498096B2 (en) | 2018-11-06 | 2022-11-15 | Siemens Medical Solutions Usa, Inc. | Chip-on-array with interposer for a multidimensional transducer array |
| AU2019392906A1 (en) | 2018-12-07 | 2021-07-22 | Octant, Inc. | Systems for protein-protein interaction screening |
| TW202045099A (zh) | 2019-02-07 | 2020-12-16 | 美商蝴蝶網路公司 | 用於微加工超音波傳感器裝置的雙層金屬電極 |
| US11383269B2 (en) | 2019-06-10 | 2022-07-12 | Bfly Operations, Inc. | Curved micromachined ultrasonic transducer membranes |
| US11292715B2 (en) * | 2019-06-27 | 2022-04-05 | Taiwan Semiconductor Manufacturing Company, Ltd. | Conductive bond structure to increase membrane sensitivity in MEMS device |
| US11684951B2 (en) * | 2019-08-08 | 2023-06-27 | Bfly Operations, Inc. | Micromachined ultrasonic transducer devices having truncated circle shaped cavities |
| US11145547B2 (en) * | 2019-10-01 | 2021-10-12 | Qorvo Us, Inc. | Semiconductor chip suitable for 2.5D and 3D packaging integration and methods of forming the same |
| US20210138506A1 (en) * | 2019-11-12 | 2021-05-13 | Siemens Medical Solutions Usa, Inc. | Interposer for an Ultrasound Transducer Array |
| US11440051B2 (en) | 2020-02-26 | 2022-09-13 | General Electric Company | Capacitive micromachined ultrasonic transducer (CMUT) devices and methods of manufacturing |
| IT202000004777A1 (it) * | 2020-03-06 | 2021-09-06 | St Microelectronics Srl | Trasduttore ultrasonico microlavorato piezoelettrico |
| EP3909692A1 (en) * | 2020-05-14 | 2021-11-17 | Koninklijke Philips N.V. | An ultrasound transducer and a tiled array of ultrasound transducers |
| EP3909691A1 (en) * | 2020-05-14 | 2021-11-17 | Koninklijke Philips N.V. | An ultrasound transducer and a tiled array of ultrasound transducers |
| FR3110834B1 (fr) * | 2020-05-28 | 2022-04-22 | Moduleus | Dispositif d'imagerie ultrasonore à adressage ligne-colonne |
| CN111884647B (zh) * | 2020-08-13 | 2023-09-29 | 中国工程物理研究院电子工程研究所 | 一种压电微机械声波换能器阵列耦合隔离方法 |
| WO2022212671A1 (en) | 2021-04-01 | 2022-10-06 | Bfly Operations, Inc. | Apparatuses and methods for configuring ultrasound devices |
| GB2614239A (en) * | 2021-12-17 | 2023-07-05 | Darkvision Tech Inc | Ultrasound interconnect stack and method of manufacturing same |
| US12465948B2 (en) * | 2023-02-09 | 2025-11-11 | Stmicroelectronics International N.V. | PMUT array with presence of separate sensing small PZT on membranes edge |
| TWI835661B (zh) * | 2023-05-29 | 2024-03-11 | 友達光電股份有限公司 | 換能器及其製造方法 |
Family Cites Families (36)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6262946B1 (en) | 1999-09-29 | 2001-07-17 | The Board Of Trustees Of The Leland Stanford Junior University | Capacitive micromachined ultrasonic transducer arrays with reduced cross-coupling |
| US6430109B1 (en) | 1999-09-30 | 2002-08-06 | The Board Of Trustees Of The Leland Stanford Junior University | Array of capacitive micromachined ultrasonic transducer elements with through wafer via connections |
| US6551248B2 (en) * | 2001-07-31 | 2003-04-22 | Koninklijke Philips Electronics N.V. | System for attaching an acoustic element to an integrated circuit |
| US6958255B2 (en) | 2002-08-08 | 2005-10-25 | The Board Of Trustees Of The Leland Stanford Junior University | Micromachined ultrasonic transducers and method of fabrication |
| US7321181B2 (en) | 2004-04-07 | 2008-01-22 | The Board Of Trustees Of The Leland Stanford Junior University | Capacitive membrane ultrasonic transducers with reduced bulk wave generation and method |
| TW200704283A (en) * | 2005-05-27 | 2007-01-16 | Lamina Ceramics Inc | Solid state LED bridge rectifier light engine |
| US7615834B2 (en) | 2006-02-28 | 2009-11-10 | The Board Of Trustees Of The Leland Stanford Junior University | Capacitive micromachined ultrasonic transducer(CMUT) with varying thickness membrane |
| US7910385B2 (en) | 2006-05-12 | 2011-03-22 | Micron Technology, Inc. | Method of fabricating microelectronic devices |
| US20080315331A1 (en) * | 2007-06-25 | 2008-12-25 | Robert Gideon Wodnicki | Ultrasound system with through via interconnect structure |
| JP5511260B2 (ja) * | 2009-08-19 | 2014-06-04 | キヤノン株式会社 | 容量型電気機械変換装置、及びその感度調整方法 |
| KR101593994B1 (ko) * | 2009-09-04 | 2016-02-16 | 삼성전자주식회사 | 고출력 초음파 트랜스듀서 |
| US8345508B2 (en) | 2009-09-20 | 2013-01-01 | General Electric Company | Large area modular sensor array assembly and method for making the same |
| JP5404335B2 (ja) * | 2009-11-17 | 2014-01-29 | キヤノン株式会社 | 電気機械変換装置及びその作製方法 |
| US8922021B2 (en) * | 2011-12-30 | 2014-12-30 | Deca Technologies Inc. | Die up fully molded fan-out wafer level packaging |
| JP5603739B2 (ja) | 2010-11-02 | 2014-10-08 | キヤノン株式会社 | 静電容量型電気機械変換装置 |
| US8659148B2 (en) * | 2010-11-30 | 2014-02-25 | General Electric Company | Tileable sensor array |
| US20130331705A1 (en) | 2011-03-22 | 2013-12-12 | Koninklijke Philips Electronics N.V. | Ultrasonic cmut with suppressed acoustic coupling to the substrate |
| WO2013001448A1 (en) * | 2011-06-27 | 2013-01-03 | Koninklijke Philips Electronics N.V. | Ultrasound transducer assembly and method of manufacturing the same |
| KR101894393B1 (ko) | 2011-12-28 | 2018-09-04 | 삼성전자주식회사 | 초음파 변환기 구조물, 초음파 변환기 및 초음파 변환기의 제조 방법 |
| KR101851568B1 (ko) * | 2012-08-29 | 2018-04-24 | 삼성전자주식회사 | 초음파 변환기 및 그 제조방법 |
| KR20140033992A (ko) * | 2012-09-11 | 2014-03-19 | 삼성전자주식회사 | 초음파 변환기 |
| US9368438B2 (en) | 2012-12-28 | 2016-06-14 | Taiwan Semiconductor Manufacturing Company, Ltd. | Package on package (PoP) bonding structures |
| WO2014123922A1 (en) | 2013-02-05 | 2014-08-14 | Butterfly Network, Inc. | Cmos ultrasonic transducers and related apparatus and methods |
| JP6232124B2 (ja) | 2013-03-15 | 2017-11-15 | バタフライ ネットワーク，インコーポレイテッド | 相補型金属酸化膜半導体（ｃｍｏｓ）超音波振動子およびその形成方法 |
| KR102176584B1 (ko) * | 2013-11-20 | 2020-11-09 | 삼성전자주식회사 | 정전용량 미세가공 초음파 변환기 및 그 제조방법 |
| KR20150065067A (ko) | 2013-12-04 | 2015-06-12 | 삼성전자주식회사 | 정전용량 미세가공 초음파 변환기 및 그 제조방법 |
| US9630832B2 (en) | 2013-12-19 | 2017-04-25 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor device and method of manufacturing |
| KR102237662B1 (ko) * | 2014-04-18 | 2021-04-09 | 버터플라이 네트워크, 인크. | 상보적 금속 산화물 반도체(ｃｍｏｓ) 웨이퍼들 내의 초음파 트랜스듀서들 및 관련 장치 및 방법들 |
| US9067779B1 (en) | 2014-07-14 | 2015-06-30 | Butterfly Network, Inc. | Microfabricated ultrasonic transducers and related apparatus and methods |
| US20160009544A1 (en) * | 2015-03-02 | 2016-01-14 | Butterfly Network, Inc. | Microfabricated ultrasonic transducers and related apparatus and methods |
| US11213855B2 (en) * | 2015-08-11 | 2022-01-04 | Koninklijke Philips N.V. | Capacitive micromachined ultrasonic transducers with increased patient safety |
| TWI721183B (zh) | 2016-06-20 | 2021-03-11 | 美商蝴蝶網路公司 | 用於微製造超音波傳感器的電接點配置 |
| US20180180724A1 (en) * | 2016-12-26 | 2018-06-28 | Nxp Usa, Inc. | Ultrasonic transducer integrated with supporting electronics |
| US10242967B2 (en) * | 2017-05-16 | 2019-03-26 | Raytheon Company | Die encapsulation in oxide bonded wafer stack |
| EP3642611B1 (en) * | 2017-06-21 | 2024-02-14 | Butterfly Network, Inc. | Microfabricated ultrasonic transducer having individual cells with electrically isolated electrode sections |
| AU2019392906A1 (en) * | 2018-12-07 | 2021-07-22 | Octant, Inc. | Systems for protein-protein interaction screening |
-
2017
- 2017-06-19 TW TW106120350A patent/TWI721183B/zh not_active IP Right Cessation
- 2017-06-19 CA CA3026157A patent/CA3026157A1/en not_active Abandoned
- 2017-06-19 EP EP17815997.6A patent/EP3471897B1/en active Active
- 2017-06-19 AU AU2017281280A patent/AU2017281280B2/en not_active Ceased
- 2017-06-19 KR KR1020197001497A patent/KR20190022644A/ko not_active Ceased
- 2017-06-19 WO PCT/US2017/038105 patent/WO2017222969A1/en not_active Ceased
- 2017-06-19 US US15/626,330 patent/US10497856B2/en active Active
- 2017-06-19 JP JP2019518183A patent/JP7026111B2/ja active Active
- 2017-06-19 CN CN201780037888.8A patent/CN109414727B/zh active Active
- 2017-06-19 CN CN202111049509.1A patent/CN113857023B/zh active Active
-
2019
- 2019-10-28 US US16/666,238 patent/US11672179B2/en active Active
-
2023
- 2023-06-06 US US18/329,703 patent/US20240122073A1/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2019522449A5 (https=) | ||
| CN109414727B (zh) | 用于微加工超声换能器的电接触布置 | |
| US9475092B2 (en) | Electro-acoustic transducer and method of manufacturing the same | |
| KR101761818B1 (ko) | 전기음향 변환기 및 그 제조 방법 | |
| CN105073280B (zh) | 具有贯穿衬底通孔（tsv）衬底插塞的电容式微机械超声换能器（cmut） | |
| CN104701452A (zh) | 电容式微加工超声换能器及其制造方法 | |
| US9957155B2 (en) | Capacitive micromachined ultrasonic transducer and method of fabricating the same | |
| US20120082325A1 (en) | Condenser microphone array chip | |
| CN104620603B (zh) | 超声换能器及制造其的方法 | |
| JP2017516428A5 (https=) | ||
| CN103379392B (zh) | 电容式超声传感器芯片及其制作方法 | |
| JP2016511607A (ja) | 基板貫通ビア（ｔｓｖ）を備えた容量性微細加工超音波トランスデューサ（ｃｕｍｔ）デバイス | |
| CN104415902A (zh) | 超声换能器及其分割方法和分割器件的方法 | |
| CN210710732U (zh) | Mems设备 | |
| CN106132568A (zh) | Cmut设备及制造方法 | |
| US9096418B2 (en) | Ultrasonic transducer and method of manufacturing the same | |
| US9955948B2 (en) | Capacitive micromachined ultrasonic transducer probe using wire-bonding | |
| TW201719130A (zh) | 微型回饋腔感測器及其製造方法 | |
| CN103875068B (zh) | 穿晶片通路设备以及其制造方法 | |
| US9643212B2 (en) | Capacitive micromachined ultrasonic transducer module using wire-bonding |