JP2022090891A - 光源装置、冷却方法、及び物品の製造方法 - Google Patents
光源装置、冷却方法、及び物品の製造方法 Download PDFInfo
- Publication number
- JP2022090891A JP2022090891A JP2020203466A JP2020203466A JP2022090891A JP 2022090891 A JP2022090891 A JP 2022090891A JP 2020203466 A JP2020203466 A JP 2020203466A JP 2020203466 A JP2020203466 A JP 2020203466A JP 2022090891 A JP2022090891 A JP 2022090891A
- Authority
- JP
- Japan
- Prior art keywords
- light source
- flow path
- refrigerant
- valve
- refrigerator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
- F21V29/52—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes electrically powered, e.g. refrigeration systems
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70008—Production of exposure light, i.e. light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
- F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/56—Cooling arrangements using liquid coolants
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70008—Production of exposure light, i.e. light sources
- G03F7/7005—Production of exposure light, i.e. light sources by multiple sources, e.g. light-emitting diodes [LED] or light source arrays
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/70075—Homogenization of illumination intensity in the mask plane by using an integrator, e.g. fly's eye lens, facet mirror or glass rod, by using a diffusing optical element or by beam deflection
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/7015—Details of optical elements
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/70883—Environment aspects, e.g. pressure of beam-path gas, temperature of optical system
- G03F7/70891—Temperature
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2105/00—Planar light sources
- F21Y2105/10—Planar light sources comprising a two-dimensional [2D] array of point-like light-generating elements
- F21Y2105/14—Planar light sources comprising a two-dimensional [2D] array of point-like light-generating elements characterised by the overall shape of the two-dimensional [2D] array
- F21Y2105/16—Planar light sources comprising a two-dimensional [2D] array of point-like light-generating elements characterised by the overall shape of the two-dimensional [2D] array square or rectangular, e.g. for light panels
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Atmospheric Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Led Device Packages (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020203466A JP2022090891A (ja) | 2020-12-08 | 2020-12-08 | 光源装置、冷却方法、及び物品の製造方法 |
| TW110142869A TWI851941B (zh) | 2020-12-08 | 2021-11-18 | 光源裝置,冷卻方法,及產品的製造方法 |
| KR1020210168030A KR20220081288A (ko) | 2020-12-08 | 2021-11-30 | 광원 디바이스, 냉각 방법 및 물품의 제조 방법 |
| CN202111463603.1A CN114624962A (zh) | 2020-12-08 | 2021-12-03 | 光源设备、冷却方法和产品制造方法 |
| US17/542,195 US11815253B2 (en) | 2020-12-08 | 2021-12-03 | Light source device, cooling method, and manufacturing method for product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020203466A JP2022090891A (ja) | 2020-12-08 | 2020-12-08 | 光源装置、冷却方法、及び物品の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2022090891A true JP2022090891A (ja) | 2022-06-20 |
| JP2022090891A5 JP2022090891A5 (https=) | 2023-11-17 |
Family
ID=81847891
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020203466A Pending JP2022090891A (ja) | 2020-12-08 | 2020-12-08 | 光源装置、冷却方法、及び物品の製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US11815253B2 (https=) |
| JP (1) | JP2022090891A (https=) |
| KR (1) | KR20220081288A (https=) |
| CN (1) | CN114624962A (https=) |
| TW (1) | TWI851941B (https=) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024038538A1 (ja) * | 2022-08-18 | 2024-02-22 | 株式会社ニコン | 光源ユニット、照明ユニット、露光装置、及び露光方法 |
| JP7520278B1 (ja) * | 2023-03-02 | 2024-07-22 | 三菱電機株式会社 | 光源システム |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2022090891A (ja) * | 2020-12-08 | 2022-06-20 | キヤノン株式会社 | 光源装置、冷却方法、及び物品の製造方法 |
| KR102812386B1 (ko) * | 2023-07-27 | 2025-05-26 | 주식회사 타임링크 | 발광장치 |
| JP2026046013A (ja) * | 2024-08-30 | 2026-03-13 | キヤノン株式会社 | 光源装置、露光装置、および、物品製造方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011165509A (ja) | 2010-02-10 | 2011-08-25 | Moritex Corp | Led照明装置 |
| CN102782581B (zh) * | 2010-02-23 | 2015-05-20 | Asml荷兰有限公司 | 光刻设备和器件制造方法 |
| JP3166157U (ja) * | 2010-10-22 | 2011-02-24 | 楊 泰和 | 半導体応用装置の温度均一化システム |
| NL2019411A (en) * | 2016-09-02 | 2018-03-06 | Asml Netherlands Bv | Lithographic Apparatus |
| EP3301999B1 (en) * | 2016-09-30 | 2020-06-17 | HP Scitex Ltd | Light emitting diode heatsink |
| CN206594446U (zh) * | 2016-10-09 | 2017-10-27 | 激光影像系统有限责任公司 | 扫描系统 |
| JP6989557B2 (ja) * | 2019-04-15 | 2022-01-05 | ファナック株式会社 | レーザ装置 |
| JP2022090891A (ja) * | 2020-12-08 | 2022-06-20 | キヤノン株式会社 | 光源装置、冷却方法、及び物品の製造方法 |
-
2020
- 2020-12-08 JP JP2020203466A patent/JP2022090891A/ja active Pending
-
2021
- 2021-11-18 TW TW110142869A patent/TWI851941B/zh active
- 2021-11-30 KR KR1020210168030A patent/KR20220081288A/ko not_active Ceased
- 2021-12-03 US US17/542,195 patent/US11815253B2/en active Active
- 2021-12-03 CN CN202111463603.1A patent/CN114624962A/zh active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024038538A1 (ja) * | 2022-08-18 | 2024-02-22 | 株式会社ニコン | 光源ユニット、照明ユニット、露光装置、及び露光方法 |
| JP7520278B1 (ja) * | 2023-03-02 | 2024-07-22 | 三菱電機株式会社 | 光源システム |
| WO2024180762A1 (ja) * | 2023-03-02 | 2024-09-06 | 三菱電機株式会社 | 光源システム |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202223551A (zh) | 2022-06-16 |
| US11815253B2 (en) | 2023-11-14 |
| US20220178533A1 (en) | 2022-06-09 |
| KR20220081288A (ko) | 2022-06-15 |
| CN114624962A (zh) | 2022-06-14 |
| TWI851941B (zh) | 2024-08-11 |
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