JP2022080881A - テストヘッド接続方法 - Google Patents
テストヘッド接続方法 Download PDFInfo
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- JP2022080881A JP2022080881A JP2021186106A JP2021186106A JP2022080881A JP 2022080881 A JP2022080881 A JP 2022080881A JP 2021186106 A JP2021186106 A JP 2021186106A JP 2021186106 A JP2021186106 A JP 2021186106A JP 2022080881 A JP2022080881 A JP 2022080881A
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- test
- test head
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- 238000012360 testing method Methods 0.000 title claims abstract description 195
- 238000000034 method Methods 0.000 title claims abstract description 30
- 235000012431 wafers Nutrition 0.000 claims description 25
- 230000004308 accommodation Effects 0.000 claims description 15
- 239000000834 fixative Substances 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 10
- 230000003213 activating effect Effects 0.000 claims description 2
- 239000000758 substrate Substances 0.000 description 16
- 239000000523 sample Substances 0.000 description 14
- 238000007789 sealing Methods 0.000 description 7
- 238000003032 molecular docking Methods 0.000 description 6
- 230000008054 signal transmission Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2889—Interfaces, e.g. between probe and tester
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2868—Complete testing stations; systems; procedures; software aspects
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- General Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Environmental & Geological Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Tests Of Electronic Circuits (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Cable Accessories (AREA)
- Magnetic Heads (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
Description
本出願は、その内容全体が参照によりこの出願に組み込まれる2020年11月18日に出願された台湾特許出願第109140284号明細書に対する優先権を主張する。
2 プロービング機械
10 ハウジング
10a 底面
12 基体
12a テスト面
20 ハウジング
22 テスト固定具
22a 上面
24 固定プレート
24a 上面
26 ロードボード
26a 上面
100 係合部材
102 固定部材
104 整列部材
120 開口
122 シーリング帯
220 係合部材
222 整列部材
224 収容空間
226 スロット
240 収容空間
260 パッド
262 真空領域
264 金属帯
S30 ステップ
S32 ステップ
S34 ステップ
S36 ステップ
S38 ステップ
Claims (10)
- テストヘッド及びプロービング機械を接続するためのテストヘッド接続方法であって、
ロードボード及びテスト固定具を前記テストヘッドと前記プロービング機械との間に配置することと、
前記テストヘッドの真空機能を作動させることと、
前記テスト固定具を整列させるように前記テストヘッドを移動させることと、
前記テストヘッドを前記テスト固定具において前記ロードボードに接触するまで移動させることと、
前記テストヘッド及び前記テスト固定具を少なくとも1つの係合部材により固定することと
を含み、
前記テスト固定具が前記プロービング機械において配置され、前記テスト固定具が前記ロードボードを収容するために使用され、
前記ロードボードが直接プロービングによりウエハを接続するように構成される、
テストヘッド接続方法。 - 前記テスト固定具が第1上面を画定し、前記第1上面が第1収容空間を画定し、前記第1収容空間が前記ロードボードを収容するために使用される、請求項1に記載のテストヘッド接続方法。
- 前記ロードボードが前記第1収容空間に収容されるとき、前記ロードボード及び前記第1上面が同一平面を形成する、請求項2に記載のテストヘッド接続方法。
- 前記テストヘッド接続方法が、
前記プロービング機械に取り外し可能に係止された固定プレートを提供すること
をさらに含み、
前記固定プレートの第2上面が第2収容空間を画定し、前記第2収容空間が前記テスト固定具を収容するために使用される、請求項2に記載のテストヘッド接続方法。 - 前記第1上面及び前記第2上面が同一平面上にない、請求項4に記載のテストヘッド接続方法。
- 前記テスト固定具が前記固定プレートの前記第2収容空間において取り外し可能に係止される、請求項4に記載のテストヘッド接続方法。
- 前記ロードボードが前記第1収容空間において取り外し可能に係止される、請求項2に記載のテストヘッド接続方法。
- 前記テスト固定具を整列させるように前記テストヘッドを移動させる前記ステップにおいて、
前記テストヘッドを前記テスト固定具と整列するように案内するために、前記テスト固定具に配置された整列部材を提供すること
をさらに含む、請求項1に記載のテストヘッド接続方法。 - 前記テストヘッドが前記ロードボードの上面に接触し、前記テスト固定具が前記ロードボードの下面に接触する、請求項1に記載のテストヘッド接続方法。
- 前記ロードボードの前記上面が少なくとも真空領域を画定し、前記真空領域が金属帯により囲まれる、請求項9に記載のテストヘッド接続方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW109140284A TWI771805B (zh) | 2020-11-18 | 2020-11-18 | 探針頭連接方法 |
TW109140284 | 2020-11-18 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2022080881A true JP2022080881A (ja) | 2022-05-30 |
JP7297034B2 JP7297034B2 (ja) | 2023-06-23 |
Family
ID=78676394
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021186106A Active JP7297034B2 (ja) | 2020-11-18 | 2021-11-16 | テストヘッド接続方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US11908753B2 (ja) |
EP (1) | EP4006561A1 (ja) |
JP (1) | JP7297034B2 (ja) |
TW (1) | TWI771805B (ja) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002076073A (ja) * | 2000-08-28 | 2002-03-15 | Nec Corp | ウェハの検査装置及びウェハの検査方法 |
JP2007538263A (ja) * | 2004-05-20 | 2007-12-27 | ナノネクサス インク | 速い製作サイクルを有する高密度の相互接続システム |
JP2013137241A (ja) * | 2011-12-28 | 2013-07-11 | Micronics Japan Co Ltd | プローブカードの平行確認方法及び平行確認装置並びにプローブカード及びテストヘッド |
US9903885B1 (en) * | 2011-03-25 | 2018-02-27 | Maxim Integrated Products, Inc. | Universal direct docking at probe test |
JP2020161631A (ja) * | 2019-03-26 | 2020-10-01 | 東京エレクトロン株式会社 | 検査装置 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6166552A (en) * | 1996-06-10 | 2000-12-26 | Motorola Inc. | Method and apparatus for testing a semiconductor wafer |
US6794889B2 (en) * | 2002-04-26 | 2004-09-21 | Agilent Technologies, Inc. | Unified apparatus and method to assure probe card-to-wafer parallelism in semiconductor automatic wafer test, probe card measurement systems, and probe card manufacturing |
WO2007057944A1 (ja) * | 2005-11-15 | 2007-05-24 | Advantest Corporation | 電子部品試験装置及び電子部品試験装置へのパフォーマンスボードの装着方法 |
SG180056A1 (en) * | 2010-10-28 | 2012-05-30 | Sony Corp | An antenna |
TWI447414B (zh) * | 2012-06-07 | 2014-08-01 | 矽品精密工業股份有限公司 | 測試裝置及測試方法 |
JP6895772B2 (ja) * | 2017-03-07 | 2021-06-30 | 東京エレクトロン株式会社 | 検査装置およびコンタクト方法 |
-
2020
- 2020-11-18 TW TW109140284A patent/TWI771805B/zh active
-
2021
- 2021-11-06 US US17/520,631 patent/US11908753B2/en active Active
- 2021-11-16 EP EP21208608.6A patent/EP4006561A1/en active Pending
- 2021-11-16 JP JP2021186106A patent/JP7297034B2/ja active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002076073A (ja) * | 2000-08-28 | 2002-03-15 | Nec Corp | ウェハの検査装置及びウェハの検査方法 |
JP2007538263A (ja) * | 2004-05-20 | 2007-12-27 | ナノネクサス インク | 速い製作サイクルを有する高密度の相互接続システム |
US9903885B1 (en) * | 2011-03-25 | 2018-02-27 | Maxim Integrated Products, Inc. | Universal direct docking at probe test |
JP2013137241A (ja) * | 2011-12-28 | 2013-07-11 | Micronics Japan Co Ltd | プローブカードの平行確認方法及び平行確認装置並びにプローブカード及びテストヘッド |
JP2020161631A (ja) * | 2019-03-26 | 2020-10-01 | 東京エレクトロン株式会社 | 検査装置 |
Also Published As
Publication number | Publication date |
---|---|
US11908753B2 (en) | 2024-02-20 |
US20220068726A1 (en) | 2022-03-03 |
JP7297034B2 (ja) | 2023-06-23 |
TWI771805B (zh) | 2022-07-21 |
EP4006561A1 (en) | 2022-06-01 |
TW202221334A (zh) | 2022-06-01 |
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