JP2022072048A - 温度センサ、ヒータユニット、基板処理装置及び半導体装置の製造方法 - Google Patents
温度センサ、ヒータユニット、基板処理装置及び半導体装置の製造方法 Download PDFInfo
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/02—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/1927—Control of temperature characterised by the use of electric means using a plurality of sensors
- G05D23/193—Control of temperature characterised by the use of electric means using a plurality of sensors sensing the temperaure in different places in thermal relationship with one or more spaces
- G05D23/1931—Control of temperature characterised by the use of electric means using a plurality of sensors sensing the temperaure in different places in thermal relationship with one or more spaces to control the temperature of one space
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/275—Control of temperature characterised by the use of electric means with sensing element expanding, contracting, or fusing in response to changes of temperature
- G05D23/27535—Details of the sensing element
- G05D23/2754—Details of the sensing element using bimetallic element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
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- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Remote Sensing (AREA)
- Automation & Control Theory (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
Abstract
Description
Claims (16)
- 開口部が設けられた取付部材に設けられる温度センサであって、
微小空間を設けつつ前記開口部に貫通するよう前記取付部材に接続される本体部と、
前記取付部材を中心に前記本体部の先端部側に取り付けられる第1位置決め部と、
前記取付部材を中心に前記本体部の末端部側に取り付けられる第2位置決め部と、
を有し、
前記微小空間、前記第1位置決め部と前記第2位置決め部により決められた範囲で前記本体部を可動に構成される温度センサ。 - 前記第1位置決め部が取り付けられる部分の前記本体部と前記第2位置決め部が取り付けられる部分の前記本体部の間の前記本体部が前記開口部に挿入されるよう構成される請求項1記載の温度センサ。
- 前記第1位置決め部の前記取付部材側の端部と前記第2位置決め部の前記取付部材側の端部の間の長さが前記開口部の前記本体部の軸心方向の長さより大きく構成される請求項1記載の温度センサ。
- 前記本体部と前記第1位置決め部および第2位置決め部が取り付けられるそれぞれの部分の径が、前記取付部材に設けられる前記開口部の径より大きく構成される請求項1記載の温度センサ。
- 更に、前記第1位置決め部を覆うように第1断熱材が設けられ、
前記第1位置決め部及び前記第1断熱材は、前記取付部材に密着される請求項1記載の温度センサ。 - 更に、前記第1断熱材と密着するように前記本体部を覆う第2断熱材が設けられる請求項5記載の温度センサ。
- 前記本体部、前記第1位置決め部及び前記第2位置決め部は、それぞれ接着剤により前記取付け部材に固定されないように構成されている請求項1記載の温度センサ。
- 前記本体部、前記第1位置決め部、前記取付部材は、それぞれ接着剤により前記第1断熱材に固定されないように構成されている請求項5記載の温度センサ。
- 前記本体部、前記第1位置決め部は、それぞれ接着剤により前記第1断熱材に固定されないように構成されている請求項5記載の温度センサ。
- 更に、少なくとも前記本体部の末端部を内部に有するカバー部と、コネクタ部と、を備えた接続部を有し、
前記末端部から出た素線は、絶縁部材により被覆されるように構成されている請求項1記載の温度センサ。 - 前記末端部から前記コネクタ部までの前記素線の配線は、たわみを含むように構成されている請求項10記載の温度センサ。
- 前記末端部から前記コネクタ部までの前記素線は、スパイラル状に配線されるように構成されている請求項10記載の温度センサ。
- 更に、前記本体部の内部には、測温部を構成する素線が連通され、
前記測温部は、前記本体部の先端に設けられる請求項1記載の温度センサ。 - 開口部が設けられた取付部材に設けられる温度センサであって、
微小空間を設けつつ前記開口部に貫通するよう前記取付部材に接続される本体部と、
前記取付部材を中心に前記本体部の先端部側に取り付けられる第1位置決め部と、
前記取付部材を中心に前記本体部の末端部側に取り付けられる第2位置決め部と、
を有し、前記微小空間、前記第1位置決め部と前記第2位置決め部により、前記本体部の移動を制限することが可能に構成される温度センサを有するヒータユニット。 - 開口部が設けられた取付部材に設けられる温度センサであって、
微小空間を設けつつ前記開口部に貫通するよう前記取付部材に接続される本体部と、
前記取付部材を中心に前記本体部の先端部側に取り付けられる第1位置決め部と、
前記取付部材を中心に前記本体部の末端部側に取り付けられる第2位置決め部と、
を有し、前記微小空間、前記第1位置決め部と前記第2位置決め部により、前記本体部の移動を制限することが可能に構成される温度センサを有するヒータユニットを備えた処理装置。 - 開口部が設けられた取付部材に設けられる温度センサであって、
微小空間を設けつつ前記開口部に貫通するよう前記取付部材に接続される本体部と、
前記取付部材を中心に前記本体部の先端部側に取り付けられる第1位置決め部と、
前記取付部材を中心に前記本体部の末端部側に取り付けられる第2位置決め部と、
を有し、前記微小空間、前記第1位置決め部と前記第2位置決め部により、前記本体部の移動を制限することが可能に構成される温度センサを有するヒータユニットにより加熱する工程を有する半導体装置の製造方法。
Priority Applications (5)
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JP2020181250A JP7236420B2 (ja) | 2020-10-29 | 2020-10-29 | 温度センサ、ヒータユニット、基板処理装置及び半導体装置の製造方法 |
TW110137260A TWI826837B (zh) | 2020-10-29 | 2021-10-07 | 溫度感測器、加熱器單元、基板處理裝置及半導體裝置之製造方法暨使電腦執行藉由加熱器單元加熱基板的程序之程式 |
CN202111255167.9A CN114427917A (zh) | 2020-10-29 | 2021-10-27 | 温度传感器、加热器单元、基板处理装置、半导体装置的制造方法和存储介质 |
KR1020210144650A KR102654476B1 (ko) | 2020-10-29 | 2021-10-27 | 온도 센서, 히터 유닛, 기판 처리 장치, 반도체 장치의 제조 방법 및 프로그램 |
US17/513,354 US20220139737A1 (en) | 2020-10-29 | 2021-10-28 | Temperature sensor, heater unit, and substrate processing apparatus |
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JP (1) | JP7236420B2 (ja) |
KR (1) | KR102654476B1 (ja) |
CN (1) | CN114427917A (ja) |
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JPH0195637U (ja) * | 1987-12-17 | 1989-06-23 | ||
JPH0718446A (ja) * | 1993-07-06 | 1995-01-20 | Tokyo Electron Ltd | 熱処理装置 |
JP2001221692A (ja) * | 2000-02-08 | 2001-08-17 | Honda Motor Co Ltd | 真空槽内部の温度測定装置 |
JP2009033115A (ja) * | 2007-06-25 | 2009-02-12 | Hitachi Kokusai Electric Inc | 加熱装置及びこれを用いた基板処理装置並びに半導体装置の製造方法並びに絶縁体 |
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JP2014235093A (ja) * | 2013-06-03 | 2014-12-15 | 新日鐵住金株式会社 | 温度測定装置 |
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KR19980039936A (ko) * | 1996-11-28 | 1998-08-17 | 김광호 | 반도체 제조용 공정챔버의 내부온도 측정장치 |
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JP6579974B2 (ja) * | 2015-02-25 | 2019-09-25 | 株式会社Kokusai Electric | 基板処理装置、温度センサ及び半導体装置の製造方法 |
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WO2020145183A1 (ja) | 2019-01-07 | 2020-07-16 | 株式会社Kokusai Electric | 基板処理装置、半導体装置の製造方法およびヒータユニット |
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- 2021-10-27 CN CN202111255167.9A patent/CN114427917A/zh active Pending
- 2021-10-27 KR KR1020210144650A patent/KR102654476B1/ko active IP Right Grant
- 2021-10-28 US US17/513,354 patent/US20220139737A1/en active Pending
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JPS54171387U (ja) * | 1978-05-24 | 1979-12-04 | ||
JPH0195637U (ja) * | 1987-12-17 | 1989-06-23 | ||
JPH0718446A (ja) * | 1993-07-06 | 1995-01-20 | Tokyo Electron Ltd | 熱処理装置 |
JP2001221692A (ja) * | 2000-02-08 | 2001-08-17 | Honda Motor Co Ltd | 真空槽内部の温度測定装置 |
JP2009033115A (ja) * | 2007-06-25 | 2009-02-12 | Hitachi Kokusai Electric Inc | 加熱装置及びこれを用いた基板処理装置並びに半導体装置の製造方法並びに絶縁体 |
JP2010038675A (ja) * | 2008-08-04 | 2010-02-18 | Toyo Seikan Kaisha Ltd | パウチ詰め流動性食品の温度測定方法および温度測定治具 |
JP2014235093A (ja) * | 2013-06-03 | 2014-12-15 | 新日鐵住金株式会社 | 温度測定装置 |
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CN114427917A (zh) | 2022-05-03 |
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JP7236420B2 (ja) | 2023-03-09 |
US20220139737A1 (en) | 2022-05-05 |
KR20220057450A (ko) | 2022-05-09 |
KR102654476B1 (ko) | 2024-04-05 |
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