JP2022058195A5 - - Google Patents

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Publication number
JP2022058195A5
JP2022058195A5 JP2021141362A JP2021141362A JP2022058195A5 JP 2022058195 A5 JP2022058195 A5 JP 2022058195A5 JP 2021141362 A JP2021141362 A JP 2021141362A JP 2021141362 A JP2021141362 A JP 2021141362A JP 2022058195 A5 JP2022058195 A5 JP 2022058195A5
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JP2021141362A
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Japanese (ja)
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JP2022058195A (ja
JP7825393B2 (ja
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Priority to KR1020210127091A priority Critical patent/KR102731481B1/ko
Priority to CN202111155074.9A priority patent/CN114318284B/zh
Priority to TW110136127A priority patent/TWI791295B/zh
Publication of JP2022058195A publication Critical patent/JP2022058195A/ja
Publication of JP2022058195A5 publication Critical patent/JP2022058195A5/ja
Priority to KR1020240160922A priority patent/KR20240167741A/ko
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Publication of JP7825393B2 publication Critical patent/JP7825393B2/ja
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JP2021141362A 2020-09-30 2021-08-31 成膜装置 Active JP7825393B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020210127091A KR102731481B1 (ko) 2020-09-30 2021-09-27 성막 장치
CN202111155074.9A CN114318284B (zh) 2020-09-30 2021-09-29 成膜装置
TW110136127A TWI791295B (zh) 2020-09-30 2021-09-29 成膜裝置
KR1020240160922A KR20240167741A (ko) 2020-09-30 2024-11-13 성막 장치

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020164575 2020-09-30
JP2020164575 2020-09-30

Publications (3)

Publication Number Publication Date
JP2022058195A JP2022058195A (ja) 2022-04-11
JP2022058195A5 true JP2022058195A5 (https=) 2024-09-05
JP7825393B2 JP7825393B2 (ja) 2026-03-06

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ID=81110815

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JP2021141362A Active JP7825393B2 (ja) 2020-09-30 2021-08-31 成膜装置

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JP (1) JP7825393B2 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118086853B (zh) * 2024-04-29 2024-07-16 江苏透波光电科技有限公司 一种陶瓷基板大功率真空溅射设备

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3044735B2 (ja) * 1990-03-30 2000-05-22 ソニー株式会社 スパッタリング装置
JP3281005B2 (ja) * 1991-09-27 2002-05-13 沖電気工業株式会社 スパッタリング装置及びそれを用いた半導体装置の製造方法
JP4036928B2 (ja) * 1996-09-18 2008-01-23 松下電器産業株式会社 成膜装置とそのターゲット交換方法

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