JP2022036019A - 樹脂成形体用エッチング処理システム及び樹脂成形体用エッチング処理システムの運転方法 - Google Patents

樹脂成形体用エッチング処理システム及び樹脂成形体用エッチング処理システムの運転方法 Download PDF

Info

Publication number
JP2022036019A
JP2022036019A JP2021129059A JP2021129059A JP2022036019A JP 2022036019 A JP2022036019 A JP 2022036019A JP 2021129059 A JP2021129059 A JP 2021129059A JP 2021129059 A JP2021129059 A JP 2021129059A JP 2022036019 A JP2022036019 A JP 2022036019A
Authority
JP
Japan
Prior art keywords
component
sulfuric acid
concentration
acid solution
solution containing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021129059A
Other languages
English (en)
Japanese (ja)
Inventor
一 井芹
Hajime Iseri
晴義 山川
Haruyoshi Yamakawa
裕都喜 山本
Yuzuki Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kurita Water Industries Ltd
Original Assignee
Kurita Water Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kurita Water Industries Ltd filed Critical Kurita Water Industries Ltd
Publication of JP2022036019A publication Critical patent/JP2022036019A/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/20Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22Roughening, e.g. by etching
    • C23C18/24Roughening, e.g. by etching using acid aqueous solutions
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25BELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
    • C25B1/00Electrolytic production of inorganic compounds or non-metals
    • C25B1/01Products
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25BELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
    • C25B1/00Electrolytic production of inorganic compounds or non-metals
    • C25B1/01Products
    • C25B1/28Per-compounds
    • C25B1/30Peroxides
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25BELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
    • C25B15/00Operating or servicing cells
    • C25B15/08Supplying or removing reactants or electrolytes; Regeneration of electrolytes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Electrochemistry (AREA)
  • Inorganic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Chemically Coating (AREA)
JP2021129059A 2020-08-19 2021-08-05 樹脂成形体用エッチング処理システム及び樹脂成形体用エッチング処理システムの運転方法 Pending JP2022036019A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020138946 2020-08-19
JP2020138946 2020-08-19

Publications (1)

Publication Number Publication Date
JP2022036019A true JP2022036019A (ja) 2022-03-04

Family

ID=80322616

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021129059A Pending JP2022036019A (ja) 2020-08-19 2021-08-05 樹脂成形体用エッチング処理システム及び樹脂成形体用エッチング処理システムの運転方法

Country Status (2)

Country Link
JP (1) JP2022036019A (fr)
WO (1) WO2022038817A1 (fr)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004351363A (ja) * 2003-05-30 2004-12-16 Kurita Water Ind Ltd 金属イオンを含む有機化合物含有水の処理方法及び処理装置
JP5106523B2 (ja) * 2009-12-16 2012-12-26 株式会社東芝 エッチング処理方法、微細構造体の製造方法、およびエッチング処理装置
JP2012169562A (ja) * 2011-02-16 2012-09-06 Kurita Water Ind Ltd 窒化物半導体材料の表面処理方法および表面処理システム
JP6866751B2 (ja) * 2017-04-25 2021-04-28 栗田工業株式会社 洗浄システム

Also Published As

Publication number Publication date
WO2022038817A1 (fr) 2022-02-24

Similar Documents

Publication Publication Date Title
JP6033234B2 (ja) めっき液の再生方法、めっき方法、及びめっき装置
CN112714803B (zh) 不溶性阳极酸性电镀铜的镀液生产和再生工艺及装置
JP2008506035A (ja) クロム鍍金方法
JP5692400B2 (ja) 電気ニッケルめっき液中の希土類不純物の除去方法
WO2018103621A1 (fr) Procédé de dépôt électrolytique de cuivre acide utilisant une anode insoluble et équipement associé
TW201402875A (zh) 用於再生鍍覆組成物之方法及再生裝置
CN111850670A (zh) 一种钢质电镀挂具用电解退镀液及退镀方法
US4435258A (en) Method and apparatus for the recovery of palladium from spent electroless catalytic baths
KR100491178B1 (ko) 전해 인산염 화성처리법
US7520973B2 (en) Method for regenerating etching solutions containing iron for the use in etching or pickling copper or copper alloys and an apparatus for carrying out said method
WO2022038817A1 (fr) Procédé de suppression de réduction de concentration pour composant d'acide peroxysulfurique dans une solution d'acide sulfurique contenant un composant d'acide peroxysulfurique, et dispositif de suppression de réduction de concentration pour composant d'acide peroxysulfurique
KR100558129B1 (ko) 전해질내의 물질의 농도를 조절하는 방법 및 장치
US4164456A (en) Electrolytic process
Idhayachander et al. Electrolytic recovery of nickel from spent electroless nickel bath solution
JP3110444U (ja) 金属の電解回収装置及び電解めっきシステム
JP3454829B2 (ja) プロセス有機物で電解液から金属を電解的に析出する方法
JPH0236677B2 (fr)
EP4077771A1 (fr) Procédé et système de dépôt d'un alliage zinc-nickel sur un substrat
JPH06158397A (ja) 金属の電気メッキ方法
JP6988977B1 (ja) 樹脂成形体のエッチング方法及び樹脂成形体のエッチング処理システム
CN103422150A (zh) 用于电镀的重金属离子浓度调节槽及电镀装置
EP1085111A1 (fr) Procédé de régénération des bains d'électrodéposition métallique
JP3316606B2 (ja) 錫めっき装置および錫めっき方法
JP2005344208A (ja) 無電解ニッケルめっき液の処理方法
JP2013213267A (ja) 貴金属の回収方法