JP2022020424A5 - - Google Patents

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Publication number
JP2022020424A5
JP2022020424A5 JP2020123907A JP2020123907A JP2022020424A5 JP 2022020424 A5 JP2022020424 A5 JP 2022020424A5 JP 2020123907 A JP2020123907 A JP 2020123907A JP 2020123907 A JP2020123907 A JP 2020123907A JP 2022020424 A5 JP2022020424 A5 JP 2022020424A5
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JP
Japan
Prior art keywords
metal layer
flange
substrate
semiconductor light
fixed
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JP2020123907A
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English (en)
Japanese (ja)
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JP7510810B2 (ja
JP2022020424A (ja
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Priority to JP2020123907A priority Critical patent/JP7510810B2/ja
Priority claimed from JP2020123907A external-priority patent/JP7510810B2/ja
Priority to US17/376,317 priority patent/US20220020905A1/en
Publication of JP2022020424A publication Critical patent/JP2022020424A/ja
Publication of JP2022020424A5 publication Critical patent/JP2022020424A5/ja
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JP2020123907A 2020-07-20 2020-07-20 半導体発光装置 Active JP7510810B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2020123907A JP7510810B2 (ja) 2020-07-20 2020-07-20 半導体発光装置
US17/376,317 US20220020905A1 (en) 2020-07-20 2021-07-15 Semiconductor light emitting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020123907A JP7510810B2 (ja) 2020-07-20 2020-07-20 半導体発光装置

Publications (3)

Publication Number Publication Date
JP2022020424A JP2022020424A (ja) 2022-02-01
JP2022020424A5 true JP2022020424A5 (enExample) 2023-06-23
JP7510810B2 JP7510810B2 (ja) 2024-07-04

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ID=79292868

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JP2020123907A Active JP7510810B2 (ja) 2020-07-20 2020-07-20 半導体発光装置

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US (1) US20220020905A1 (enExample)
JP (1) JP7510810B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024002207A (ja) * 2022-06-23 2024-01-11 スタンレー電気株式会社 半導体発光装置
DE102023104440A1 (de) * 2023-02-23 2024-08-29 Ams-Osram International Gmbh Optoelektronisches bauelement und verfahren zur herstellung eines optoelektronischen bauelements

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6881980B1 (en) * 2004-06-17 2005-04-19 Chunghwa Picture Tubes, Ltd. Package structure of light emitting diode
JP4229075B2 (ja) * 2005-03-07 2009-02-25 セイコーエプソン株式会社 有機エレクトロルミネッセンス装置及び電子機器
FR2892594B1 (fr) * 2005-10-21 2007-12-07 Saint Gobain Structure lumineuse comportant au moins une diode electroluminescente, sa fabrication et ses applications
JP4941653B2 (ja) * 2007-02-27 2012-05-30 セイコーインスツル株式会社 電気化学素子の製造方法
US20100237378A1 (en) * 2009-03-19 2010-09-23 Tzu-Han Lin Light emitting diode package structure and fabrication thereof
JP2013077798A (ja) * 2011-09-14 2013-04-25 Toyoda Gosei Co Ltd ガラス封止ｌｅｄランプ及びその製造方法
JP2013074273A (ja) * 2011-09-29 2013-04-22 Ccs Inc Ｌｅｄ発光装置
KR101954944B1 (ko) * 2012-06-26 2019-03-11 삼성디스플레이 주식회사 디스플레이 장치를 포함하는 전자 신분증 및 전자 신분증의 위변조 확인 방법
JP6294418B2 (ja) * 2016-09-01 2018-03-14 日機装株式会社 光半導体装置および光半導体装置の製造方法
JP2018137428A (ja) * 2017-02-20 2018-08-30 京セラ株式会社 紫外線発光装置用部材および紫外線発光装置
KR102336096B1 (ko) * 2017-03-29 2021-12-06 미쓰비시덴키 가부시키가이샤 중공 밀봉 디바이스 및 그 제조 방법
CN108550677B (zh) * 2018-04-03 2024-10-01 林上煜 一种紫外led封装器件
JP6773093B2 (ja) * 2018-09-20 2020-10-21 信越化学工業株式会社 光学素子パッケージ用リッド、光学素子パッケージ及びそれらの製造方法

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