JP2022012849A - 加工装置 - Google Patents
加工装置 Download PDFInfo
- Publication number
- JP2022012849A JP2022012849A JP2020114973A JP2020114973A JP2022012849A JP 2022012849 A JP2022012849 A JP 2022012849A JP 2020114973 A JP2020114973 A JP 2020114973A JP 2020114973 A JP2020114973 A JP 2020114973A JP 2022012849 A JP2022012849 A JP 2022012849A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- frame body
- chuck table
- suction
- grinding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000007788 liquid Substances 0.000 claims description 22
- 238000004891 communication Methods 0.000 claims description 21
- 238000001179 sorption measurement Methods 0.000 abstract 5
- 235000015250 liver sausages Nutrition 0.000 abstract 1
- 230000007246 mechanism Effects 0.000 description 24
- 238000003754 machining Methods 0.000 description 20
- 239000012530 fluid Substances 0.000 description 15
- 230000002093 peripheral effect Effects 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 239000000428 dust Substances 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 239000006061 abrasive grain Substances 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000008262 pumice Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B19/00—Single-purpose machines or devices for particular grinding operations not covered by any other main group
- B24B19/22—Single-purpose machines or devices for particular grinding operations not covered by any other main group characterised by a special design with respect to properties of the material of non-metallic articles to be ground
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/02—Frames; Beds; Carriages
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/04—Headstocks; Working-spindles; Features relating thereto
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
- B24B41/061—Work supports, e.g. adjustable steadies axially supporting turning workpieces, e.g. magnetically, pneumatically
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
- B24B47/12—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces by mechanical gearing or electric power
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/10—Removing layers, or parts of layers, mechanically or chemically
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
- B32B43/006—Delaminating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
- Y10T156/1126—Using direct fluid current against work during delaminating
- Y10T156/1132—Using vacuum directly against work during delaminating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/19—Delaminating means
- Y10T156/1928—Differential fluid pressure delaminating means
- Y10T156/1944—Vacuum delaminating means [e.g., vacuum chamber, etc.]
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Abstract
Description
2:装置ハウジング
21:本体部
22:直立壁
221:案内レール
3、3’:チャックテーブル機構
31、31’:テーブルカバー
32、32’:チャックテーブル
321:ポーラスプレート
321a:吸着面
321b:側面
321c:裏面
322、322’:枠体
322a、322a’:枠上面
322b、322b’:プレート載置面
322c、322c’:ウエーハ吸引孔
322d、322d’:外周段差部
322e、322e’:ボルト孔
322g、322g’:底面
322h、322h’:側壁
34、34’:テーブルベース
341、341’:載置面
342、342’:枠体吸引孔
343、343’:ボルト締結孔
344:第一の連通孔
344’:第二の連通孔
345:側面
346:連通路
4:研削手段
41:移動基台
42:スピンドルユニット
421:スピンドルハウジング
422:回転スピンドル
423:サーボモータ
424:マウンター
425:研削ホイール
426:研削砥石
5:加工液供給手段
51:加工液タンク
52:加工液供給路
53:開閉バルブ
6a、6b:蛇腹手段
7:研削送り手段
71:ロッド
72:パルスモータ
8:ボルト
10:ウエーハ
Vm1:第一の吸引力
Vm2:第二の吸引力
Claims (3)
- ウエーハを吸引保持する保持手段と、該保持手段に保持されたウエーハを研削する研削ホイールを回転可能に備えた加工手段と、ウエーハに加工液を供給する加工液供給手段と、
を少なくとも備えた加工装置であって、
該保持手段は、ウエーハを保持するチャックテーブルと、該チャックテーブルを着脱自在に支持するテーブルベースと、を含み、
該チャックテーブルは、ウエーハを吸着する吸着面を備えたポーラスプレートと、該ポーラスプレートの吸着面以外を囲繞する枠体と、該枠体に形成され該ポーラスプレートの吸着面に吸引力を伝達するウエーハ吸引孔と、該枠体に形成され該テーブルベースに該枠体を固定するためのボルト孔と、を含み構成され、
該テーブルベースは、該枠体の該ポーラスプレートが載置される面とは反対側の面を載置する載置面と、該載置面に形成され該枠体を吸引して引き付ける枠体吸引孔と、から少なくとも構成される加工装置。 - 該ウエーハ吸引孔は該枠体の該ポーラスプレートが載置される面とは反対側の面に開口するように形成され、該テーブルベースの載置面に該ウエーハ吸引孔に連通すると共に該枠体吸引孔とは独立した連通孔が形成される請求項1に記載の加工装置。
- 該ウエーハ吸引孔は該枠体の側面に開口するように形成され、該テーブルベースの側面に該ウエーハ吸引孔に連通される連通孔が形成される請求項1に記載の加工装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020114973A JP2022012849A (ja) | 2020-07-02 | 2020-07-02 | 加工装置 |
US17/344,007 US11398400B2 (en) | 2020-07-02 | 2021-06-10 | Processing apparatus |
TW110122946A TW202203315A (zh) | 2020-07-02 | 2021-06-23 | 加工裝置 |
CN202110717193.2A CN113953941A (zh) | 2020-07-02 | 2021-06-28 | 加工装置 |
KR1020210083959A KR20220003970A (ko) | 2020-07-02 | 2021-06-28 | 가공 장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020114973A JP2022012849A (ja) | 2020-07-02 | 2020-07-02 | 加工装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2022012849A true JP2022012849A (ja) | 2022-01-17 |
Family
ID=79167581
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020114973A Pending JP2022012849A (ja) | 2020-07-02 | 2020-07-02 | 加工装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US11398400B2 (ja) |
JP (1) | JP2022012849A (ja) |
KR (1) | KR20220003970A (ja) |
CN (1) | CN113953941A (ja) |
TW (1) | TW202203315A (ja) |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6602380B1 (en) * | 1998-10-28 | 2003-08-05 | Micron Technology, Inc. | Method and apparatus for releasably attaching a polishing pad to a chemical-mechanical planarization machine |
JP4090416B2 (ja) * | 2003-09-30 | 2008-05-28 | 日東電工株式会社 | 粘着テープ付ワークの離脱方法及び離脱装置 |
JP4464113B2 (ja) | 2003-11-27 | 2010-05-19 | 株式会社ディスコ | ウエーハの加工装置 |
KR20100122643A (ko) * | 2009-05-13 | 2010-11-23 | 삼성전기주식회사 | 범프 인쇄장치 |
US8500182B2 (en) * | 2010-06-17 | 2013-08-06 | Taiwan Semiconductor Manufacturing Company, Ltd. | Vacuum wafer carriers for strengthening thin wafers |
JP5635363B2 (ja) * | 2010-10-19 | 2014-12-03 | 日東電工株式会社 | 保護テープ剥離方法および保護テープ剥離装置 |
JP5652832B2 (ja) * | 2013-01-08 | 2015-01-14 | レーザーテック株式会社 | チャック装置、及びチャック方法 |
JP2014200888A (ja) * | 2013-04-05 | 2014-10-27 | ローム株式会社 | 吸引保持装置およびウエハ研磨装置 |
US9227261B2 (en) * | 2013-08-06 | 2016-01-05 | Globalfoundries Inc. | Vacuum carriers for substrate bonding |
US9630269B2 (en) * | 2013-10-30 | 2017-04-25 | Globalfoundries Inc. | Mechanism to attach a die to a substrate |
WO2017090681A1 (ja) * | 2015-11-26 | 2017-06-01 | 日立化成株式会社 | 電子部品の製造方法、仮固定用樹脂組成物、仮固定用樹脂フィルム及び仮固定用樹脂フィルムシート |
-
2020
- 2020-07-02 JP JP2020114973A patent/JP2022012849A/ja active Pending
-
2021
- 2021-06-10 US US17/344,007 patent/US11398400B2/en active Active
- 2021-06-23 TW TW110122946A patent/TW202203315A/zh unknown
- 2021-06-28 CN CN202110717193.2A patent/CN113953941A/zh active Pending
- 2021-06-28 KR KR1020210083959A patent/KR20220003970A/ko active Search and Examination
Also Published As
Publication number | Publication date |
---|---|
CN113953941A (zh) | 2022-01-21 |
US11398400B2 (en) | 2022-07-26 |
US20220005725A1 (en) | 2022-01-06 |
KR20220003970A (ko) | 2022-01-11 |
TW202203315A (zh) | 2022-01-16 |
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