JP2021522410A5 - - Google Patents
Info
- Publication number
- JP2021522410A5 JP2021522410A5 JP2020558445A JP2020558445A JP2021522410A5 JP 2021522410 A5 JP2021522410 A5 JP 2021522410A5 JP 2020558445 A JP2020558445 A JP 2020558445A JP 2020558445 A JP2020558445 A JP 2020558445A JP 2021522410 A5 JP2021522410 A5 JP 2021522410A5
- Authority
- JP
- Japan
- Prior art keywords
- composition according
- aqueous composition
- substrate
- tin
- ethylene oxide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP18168462.2 | 2018-04-20 | ||
| EP18168462 | 2018-04-20 | ||
| PCT/EP2019/059344 WO2019201753A1 (en) | 2018-04-20 | 2019-04-11 | Composition for tin or tin alloy electroplating comprising suppressing agent |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2021522410A JP2021522410A (ja) | 2021-08-30 |
| JP2021522410A5 true JP2021522410A5 (enExample) | 2022-04-18 |
Family
ID=62044554
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020558445A Withdrawn JP2021522410A (ja) | 2018-04-20 | 2019-04-11 | 抑制剤を含むスズ又はスズ合金電気メッキのための組成物 |
Country Status (9)
| Country | Link |
|---|---|
| US (2) | US11242606B2 (enExample) |
| EP (1) | EP3781729B1 (enExample) |
| JP (1) | JP2021522410A (enExample) |
| KR (1) | KR102769982B1 (enExample) |
| CN (1) | CN112135929B (enExample) |
| IL (1) | IL278024A (enExample) |
| SG (1) | SG11202009106XA (enExample) |
| TW (1) | TWI813670B (enExample) |
| WO (1) | WO2019201753A1 (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP4437167A1 (en) | 2021-11-22 | 2024-10-02 | Basf Se | Composition for tin or tin alloy electroplating comprising a pyrazole-type antioxidant |
| KR102568529B1 (ko) * | 2022-11-25 | 2023-08-22 | 주식회사 호진플라텍 | 보이드 생성이 억제되고 두께편차가 개선된 웨이퍼 범프용 주석 전기 도금액 |
| KR20250124510A (ko) * | 2024-02-13 | 2025-08-20 | 한국생산기술연구원 | 솔더 범프용 주석 도금액 |
Family Cites Families (34)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4135991A (en) | 1977-08-12 | 1979-01-23 | R. O. Hull & Company, Inc. | Bath and method for electroplating tin and/or lead |
| GB1567235A (en) | 1978-05-15 | 1980-05-14 | Pmd Chemicals Ltd | Electrodeposition of tin or tin/lead alloys |
| US4871429A (en) | 1981-09-11 | 1989-10-03 | Learonal, Inc | Limiting tin sludge formation in tin or tin/lead electroplating solutions |
| US5174887A (en) | 1987-12-10 | 1992-12-29 | Learonal, Inc. | High speed electroplating of tinplate |
| JP3301707B2 (ja) | 1997-01-20 | 2002-07-15 | ディップソール株式会社 | 錫−銀合金酸性電気めっき浴 |
| JP4296358B2 (ja) | 1998-01-21 | 2009-07-15 | 石原薬品株式会社 | 銀及び銀合金メッキ浴 |
| US7628903B1 (en) | 2000-05-02 | 2009-12-08 | Ishihara Chemical Co., Ltd. | Silver and silver alloy plating bath |
| US6818545B2 (en) | 2001-03-05 | 2004-11-16 | Megic Corporation | Low fabrication cost, fine pitch and high reliability solder bump |
| TWI245402B (en) | 2002-01-07 | 2005-12-11 | Megic Corp | Rod soldering structure and manufacturing process thereof |
| EP1342817A3 (en) * | 2002-03-05 | 2006-05-24 | Shipley Co. L.L.C. | Limiting the loss of tin through oxidation in tin or tin alloy electroplating bath solutions |
| TWI353395B (en) * | 2003-12-31 | 2011-12-01 | Microfabrica Inc | Method and apparatus for maintaining parallelism o |
| TWI240979B (en) | 2004-10-28 | 2005-10-01 | Advanced Semiconductor Eng | Bumping process |
| KR100921919B1 (ko) | 2007-11-16 | 2009-10-16 | (주)화백엔지니어링 | 반도체 칩에 형성되는 구리기둥-주석범프 및 그의 형성방법 |
| JP5583894B2 (ja) | 2008-06-12 | 2014-09-03 | ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． | 電気錫めっき液および電気錫めっき方法 |
| EP2199315B1 (en) | 2008-12-19 | 2013-12-11 | Basf Se | Composition for metal electroplating comprising leveling agent |
| EP2417283B1 (en) * | 2009-04-07 | 2014-07-30 | Basf Se | Composition for metal plating comprising suppressing agent for void free submicron feature filling |
| WO2010115757A1 (en) * | 2009-04-07 | 2010-10-14 | Basf Se | Composition for metal plating comprising suppressing agent for void free submicron feature filling |
| KR20170034948A (ko) | 2009-04-07 | 2017-03-29 | 바스프 에스이 | 무공극 서브미크론 특징부 충전을 위한 억제제를 포함하는 금속 도금용 조성물 |
| JP5952738B2 (ja) * | 2009-11-27 | 2016-07-13 | ビーエーエスエフ ソシエタス・ヨーロピアＢａｓｆ Ｓｅ | 平滑化剤を含む金属電気メッキのための組成物 |
| US8262895B2 (en) * | 2010-03-15 | 2012-09-11 | Rohm And Haas Electronic Materials Llc | Plating bath and method |
| WO2012085811A1 (en) * | 2010-12-21 | 2012-06-28 | Basf Se | Composition for metal electroplating comprising leveling agent |
| US8888984B2 (en) * | 2012-02-09 | 2014-11-18 | Rohm And Haas Electronic Materials Llc | Plating bath and method |
| US8980077B2 (en) | 2012-03-30 | 2015-03-17 | Rohm And Haas Electronic Materials Llc | Plating bath and method |
| RU2015121797A (ru) * | 2012-11-09 | 2017-01-10 | Басф Се | Композиция для электролитического осаждения металла, содержащая выравнивающий агент |
| JP6133056B2 (ja) * | 2012-12-27 | 2017-05-24 | ローム・アンド・ハース電子材料株式会社 | スズまたはスズ合金めっき液 |
| US20150122661A1 (en) * | 2013-11-05 | 2015-05-07 | Rohm And Haas Electronic Materials Llc | Plating bath and method |
| US20150122662A1 (en) * | 2013-11-05 | 2015-05-07 | Rohm And Haas Electronic Materials Llc | Plating bath and method |
| JP2015193916A (ja) * | 2014-03-18 | 2015-11-05 | 上村工業株式会社 | 錫または錫合金の電気めっき浴、およびバンプの製造方法 |
| WO2016020216A1 (en) | 2014-08-06 | 2016-02-11 | Basf Se | Improved process for preparing polymeric, ionic imidazolium compounds |
| WO2016172851A1 (en) * | 2015-04-28 | 2016-11-03 | Rohm And Haas Electronic Materials Llc | Reaction products of bisanhydrids and diamines as additives for electroplating baths |
| US10988852B2 (en) * | 2015-10-27 | 2021-04-27 | Rohm And Haas Electronic Materials Llc | Method of electroplating copper into a via on a substrate from an acid copper electroplating bath |
| EP3402831A1 (en) | 2016-01-12 | 2018-11-21 | Basf Se | Process for preparing polymeric imidazolium compounds without or with less monoaldehyde |
| KR102457310B1 (ko) * | 2016-12-20 | 2022-10-20 | 바스프 에스이 | 무-보이드 충전을 위한 억제 작용제를 포함하는 금속 도금용 조성물 |
| WO2018219848A1 (en) | 2017-06-01 | 2018-12-06 | Basf Se | Composition for tin alloy electroplating comprising leveling agent |
-
2019
- 2019-04-11 US US17/048,770 patent/US11242606B2/en active Active
- 2019-04-11 EP EP19715960.1A patent/EP3781729B1/en active Active
- 2019-04-11 KR KR1020207031530A patent/KR102769982B1/ko active Active
- 2019-04-11 WO PCT/EP2019/059344 patent/WO2019201753A1/en not_active Ceased
- 2019-04-11 JP JP2020558445A patent/JP2021522410A/ja not_active Withdrawn
- 2019-04-11 CN CN201980033676.1A patent/CN112135929B/zh active Active
- 2019-04-11 SG SG11202009106XA patent/SG11202009106XA/en unknown
- 2019-04-18 TW TW108113573A patent/TWI813670B/zh active
-
2020
- 2020-10-13 IL IL278024A patent/IL278024A/en unknown
-
2021
- 2021-12-30 US US17/566,426 patent/US11840771B2/en active Active
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