IL278024A - An electroplating preparation with tin or a tin alloy containing a suppressant - Google Patents

An electroplating preparation with tin or a tin alloy containing a suppressant

Info

Publication number
IL278024A
IL278024A IL278024A IL27802420A IL278024A IL 278024 A IL278024 A IL 278024A IL 278024 A IL278024 A IL 278024A IL 27802420 A IL27802420 A IL 27802420A IL 278024 A IL278024 A IL 278024A
Authority
IL
Israel
Prior art keywords
tin
composition
suppressing agent
alloy electroplating
tin alloy
Prior art date
Application number
IL278024A
Other languages
English (en)
Hebrew (he)
Original Assignee
Basf Se
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Basf Se filed Critical Basf Se
Publication of IL278024A publication Critical patent/IL278024A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01231—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using blanket deposition
    • H10W72/01233—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using blanket deposition in liquid form, e.g. spin coating, spray coating or immersion coating
    • H10W72/01235—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using blanket deposition in liquid form, e.g. spin coating, spray coating or immersion coating by plating, e.g. electroless plating or electroplating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/231—Shapes
    • H10W72/232—Plan-view shape, i.e. in top view

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
IL278024A 2018-04-20 2020-10-13 An electroplating preparation with tin or a tin alloy containing a suppressant IL278024A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP18168462 2018-04-20
PCT/EP2019/059344 WO2019201753A1 (en) 2018-04-20 2019-04-11 Composition for tin or tin alloy electroplating comprising suppressing agent

Publications (1)

Publication Number Publication Date
IL278024A true IL278024A (en) 2020-11-30

Family

ID=62044554

Family Applications (1)

Application Number Title Priority Date Filing Date
IL278024A IL278024A (en) 2018-04-20 2020-10-13 An electroplating preparation with tin or a tin alloy containing a suppressant

Country Status (9)

Country Link
US (2) US11242606B2 (enExample)
EP (1) EP3781729B1 (enExample)
JP (1) JP2021522410A (enExample)
KR (1) KR102769982B1 (enExample)
CN (1) CN112135929B (enExample)
IL (1) IL278024A (enExample)
SG (1) SG11202009106XA (enExample)
TW (1) TWI813670B (enExample)
WO (1) WO2019201753A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20240113774A (ko) 2021-11-22 2024-07-23 바스프 에스이 피라졸 타입 산화방지제를 포함하는 주석 또는 주석 합금 전기도금을 위한 조성물
KR102568529B1 (ko) * 2022-11-25 2023-08-22 주식회사 호진플라텍 보이드 생성이 억제되고 두께편차가 개선된 웨이퍼 범프용 주석 전기 도금액
KR20250124510A (ko) * 2024-02-13 2025-08-20 한국생산기술연구원 솔더 범프용 주석 도금액

Family Cites Families (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4135991A (en) 1977-08-12 1979-01-23 R. O. Hull & Company, Inc. Bath and method for electroplating tin and/or lead
GB1567235A (en) 1978-05-15 1980-05-14 Pmd Chemicals Ltd Electrodeposition of tin or tin/lead alloys
US4871429A (en) 1981-09-11 1989-10-03 Learonal, Inc Limiting tin sludge formation in tin or tin/lead electroplating solutions
US5174887A (en) 1987-12-10 1992-12-29 Learonal, Inc. High speed electroplating of tinplate
JP3301707B2 (ja) 1997-01-20 2002-07-15 ディップソール株式会社 錫−銀合金酸性電気めっき浴
JP4296358B2 (ja) 1998-01-21 2009-07-15 石原薬品株式会社 銀及び銀合金メッキ浴
US7628903B1 (en) 2000-05-02 2009-12-08 Ishihara Chemical Co., Ltd. Silver and silver alloy plating bath
US6818545B2 (en) 2001-03-05 2004-11-16 Megic Corporation Low fabrication cost, fine pitch and high reliability solder bump
TWI245402B (en) 2002-01-07 2005-12-11 Megic Corp Rod soldering structure and manufacturing process thereof
JP2004002970A (ja) * 2002-03-05 2004-01-08 Shipley Co Llc スズ又はスズ合金電気メッキ浴液における酸化によるスズ損失の制限
TWI353395B (en) * 2003-12-31 2011-12-01 Microfabrica Inc Method and apparatus for maintaining parallelism o
TWI240979B (en) 2004-10-28 2005-10-01 Advanced Semiconductor Eng Bumping process
KR100921919B1 (ko) 2007-11-16 2009-10-16 (주)화백엔지니어링 반도체 칩에 형성되는 구리기둥-주석범프 및 그의 형성방법
JP5583894B2 (ja) 2008-06-12 2014-09-03 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． 電気錫めっき液および電気錫めっき方法
EP2199315B1 (en) 2008-12-19 2013-12-11 Basf Se Composition for metal electroplating comprising leveling agent
WO2010115757A1 (en) * 2009-04-07 2010-10-14 Basf Se Composition for metal plating comprising suppressing agent for void free submicron feature filling
WO2010115756A1 (en) 2009-04-07 2010-10-14 Basf Se Composition for metal plating comprising suppressing agent for void free submicron feature filling
SG174264A1 (en) * 2009-04-07 2011-10-28 Basf Se Composition for metal plating comprising suppressing agent for void free submicron feature filling
JP5952738B2 (ja) * 2009-11-27 2016-07-13 ビーエーエスエフ ソシエタス・ヨーロピアＢａｓｆ Ｓｅ 平滑化剤を含む金属電気メッキのための組成物
US8262895B2 (en) * 2010-03-15 2012-09-11 Rohm And Haas Electronic Materials Llc Plating bath and method
EP2655457B1 (en) * 2010-12-21 2019-04-10 Basf Se Composition for metal electroplating comprising leveling agent
US8888984B2 (en) * 2012-02-09 2014-11-18 Rohm And Haas Electronic Materials Llc Plating bath and method
US8980077B2 (en) 2012-03-30 2015-03-17 Rohm And Haas Electronic Materials Llc Plating bath and method
JP6411354B2 (ja) * 2012-11-09 2018-10-24 ビーエーエスエフ ソシエタス・ヨーロピアＢａｓｆ Ｓｅ 平坦化剤を含む金属電気めっきのための組成物
JP6133056B2 (ja) * 2012-12-27 2017-05-24 ローム・アンド・ハース電子材料株式会社 スズまたはスズ合金めっき液
US20150122661A1 (en) * 2013-11-05 2015-05-07 Rohm And Haas Electronic Materials Llc Plating bath and method
US20150122662A1 (en) * 2013-11-05 2015-05-07 Rohm And Haas Electronic Materials Llc Plating bath and method
JP2015193916A (ja) * 2014-03-18 2015-11-05 上村工業株式会社 錫または錫合金の電気めっき浴、およびバンプの製造方法
WO2016020216A1 (en) 2014-08-06 2016-02-11 Basf Se Improved process for preparing polymeric, ionic imidazolium compounds
WO2016172851A1 (en) * 2015-04-28 2016-11-03 Rohm And Haas Electronic Materials Llc Reaction products of bisanhydrids and diamines as additives for electroplating baths
US10988852B2 (en) * 2015-10-27 2021-04-27 Rohm And Haas Electronic Materials Llc Method of electroplating copper into a via on a substrate from an acid copper electroplating bath
JP2019503420A (ja) 2016-01-12 2019-02-07 ビーエーエスエフ ソシエタス・ヨーロピアＢａｓｆ Ｓｅ モノアルデヒドを使用しない又はモノアルデヒドをほぼ使用しない高分子イミダゾリウム化合物の製造方法
KR102457310B1 (ko) * 2016-12-20 2022-10-20 바스프 에스이 무-보이드 충전을 위한 억제 작용제를 포함하는 금속 도금용 조성물
CN110678583B (zh) 2017-06-01 2022-09-30 巴斯夫欧洲公司 包含流平剂的锡合金电镀组合物

Also Published As

Publication number Publication date
WO2019201753A1 (en) 2019-10-24
TWI813670B (zh) 2023-09-01
TW201943895A (zh) 2019-11-16
CN112135929A (zh) 2020-12-25
US20210180201A1 (en) 2021-06-17
US20220119972A1 (en) 2022-04-21
JP2021522410A (ja) 2021-08-30
SG11202009106XA (en) 2020-11-27
KR102769982B1 (ko) 2025-02-18
EP3781729A1 (en) 2021-02-24
CN112135929B (zh) 2023-12-15
US11242606B2 (en) 2022-02-08
EP3781729B1 (en) 2024-09-25
KR20210002514A (ko) 2021-01-08
US11840771B2 (en) 2023-12-12

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