JP2013531729A5 - - Google Patents
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- Publication number
- JP2013531729A5 JP2013531729A5 JP2012557281A JP2012557281A JP2013531729A5 JP 2013531729 A5 JP2013531729 A5 JP 2013531729A5 JP 2012557281 A JP2012557281 A JP 2012557281A JP 2012557281 A JP2012557281 A JP 2012557281A JP 2013531729 A5 JP2013531729 A5 JP 2013531729A5
- Authority
- JP
- Japan
- Prior art keywords
- silver
- coating
- based alloy
- article
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 claims description 61
- 229910052709 silver Inorganic materials 0.000 claims description 59
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 51
- 239000004332 silver Substances 0.000 claims description 51
- 239000000956 alloy Substances 0.000 claims description 46
- 229910045601 alloy Inorganic materials 0.000 claims description 46
- 239000011248 coating agent Substances 0.000 claims description 44
- 238000000576 coating method Methods 0.000 claims description 44
- 238000004070 electrodeposition Methods 0.000 claims description 34
- 239000000758 substrate Substances 0.000 claims description 27
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 27
- 229910052721 tungsten Inorganic materials 0.000 claims description 27
- 239000010937 tungsten Substances 0.000 claims description 27
- 229910052750 molybdenum Inorganic materials 0.000 claims description 25
- 239000011733 molybdenum Substances 0.000 claims description 25
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 23
- 239000002245 particle Substances 0.000 claims description 18
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- 229910052737 gold Inorganic materials 0.000 claims description 8
- 229910052741 iridium Inorganic materials 0.000 claims description 8
- 229910052762 osmium Inorganic materials 0.000 claims description 8
- 229910052763 palladium Inorganic materials 0.000 claims description 8
- 229910052697 platinum Inorganic materials 0.000 claims description 8
- 229910052703 rhodium Inorganic materials 0.000 claims description 8
- 229910052707 ruthenium Inorganic materials 0.000 claims description 8
- 229910052702 rhenium Inorganic materials 0.000 claims description 7
- 238000000151 deposition Methods 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 239000008139 complexing agent Substances 0.000 description 10
- -1 pyridine compound Chemical class 0.000 description 8
- 239000007864 aqueous solution Substances 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 6
- 125000005462 imide group Chemical group 0.000 description 6
- JUJWROOIHBZHMG-UHFFFAOYSA-N pyridine Substances C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 6
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 6
- 239000002253 acid Substances 0.000 description 3
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 2
- FOIXSVOLVBLSDH-UHFFFAOYSA-N Silver ion Chemical compound [Ag+] FOIXSVOLVBLSDH-UHFFFAOYSA-N 0.000 description 2
- 239000000080 wetting agent Substances 0.000 description 2
- 239000002659 electrodeposit Substances 0.000 description 1
- 238000001208 nuclear magnetic resonance pulse sequence Methods 0.000 description 1
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/723,044 | 2010-03-12 | ||
| US12/723,020 | 2010-03-12 | ||
| US12/723,044 US20110220511A1 (en) | 2010-03-12 | 2010-03-12 | Electrodeposition baths and systems |
| US12/723,020 US9694562B2 (en) | 2010-03-12 | 2010-03-12 | Coated articles and methods |
| PCT/US2011/028104 WO2011112939A1 (en) | 2010-03-12 | 2011-03-11 | Coated articles and methods |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016004371A Division JP2016153526A (ja) | 2010-03-12 | 2016-01-13 | 被覆物および方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013531729A JP2013531729A (ja) | 2013-08-08 |
| JP2013531729A5 true JP2013531729A5 (enExample) | 2014-04-24 |
| JP5872492B2 JP5872492B2 (ja) | 2016-03-01 |
Family
ID=44563865
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012557281A Active JP5872492B2 (ja) | 2010-03-12 | 2011-03-11 | 被覆物および方法 |
| JP2016004371A Pending JP2016153526A (ja) | 2010-03-12 | 2016-01-13 | 被覆物および方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016004371A Pending JP2016153526A (ja) | 2010-03-12 | 2016-01-13 | 被覆物および方法 |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP2545194B1 (enExample) |
| JP (2) | JP5872492B2 (enExample) |
| KR (1) | KR20130006658A (enExample) |
| CN (2) | CN102947473B (enExample) |
| WO (1) | WO2011112939A1 (enExample) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2755819B1 (en) * | 2011-09-14 | 2016-09-14 | Xtalic Corporation | Silver alloy coated articles |
| JP2014182976A (ja) * | 2013-03-21 | 2014-09-29 | Enplas Corp | 電気接触子及び電気部品用ソケット |
| EA201791237A1 (ru) | 2014-12-05 | 2017-11-30 | Эй-Джи-Си Флет Гласс Норт Эмерике, Инк. | Плазменный источник с применением уменьшающего образование макрочастиц покрытия и способ использования плазменного источника с применением уменьшающего образование макрочастиц покрытия для осаждения тонкопленочных покрытий и модификации поверхностей |
| CN105154930A (zh) * | 2015-08-21 | 2015-12-16 | 无锡桥阳机械制造有限公司 | 一种无氰镀银电镀液及其电镀方法 |
| CN105112952A (zh) * | 2015-09-21 | 2015-12-02 | 无锡清杨机械制造有限公司 | 一种无氰镀银用电镀液及其电镀方法 |
| CN105463524A (zh) * | 2015-12-23 | 2016-04-06 | 苏州市金星工艺镀饰有限公司 | 一种无氰镀银电镀液的电镀方法 |
| CN108018518A (zh) * | 2016-10-31 | 2018-05-11 | 通用电气公司 | 抗硫腐蚀涂层，包括其的物件，及使用其的方法 |
| JP2018203040A (ja) | 2017-06-02 | 2018-12-27 | デルタ工業株式会社 | サスペンション機構 |
| KR102143753B1 (ko) * | 2018-10-18 | 2020-08-12 | 전영화전(주) | 전해부식에 대한 내식성이 우수한 은 도금층 함유 커넥터용 금속단자 |
| CN110518126B (zh) * | 2019-08-05 | 2023-08-08 | 中国民用航空飞行学院 | 一种基于银纳米线薄膜的柔性太阳能电池及其制备方法 |
| US11242609B2 (en) * | 2019-10-15 | 2022-02-08 | Rohm and Hass Electronic Materials LLC | Acidic aqueous silver-nickel alloy electroplating compositions and methods |
| JP7770766B2 (ja) * | 2020-02-25 | 2025-11-17 | Ｄｏｗａメタルテック株式会社 | 銀めっき材およびその製造方法 |
| FR3121688B1 (fr) * | 2021-04-13 | 2023-04-14 | Axon Cable Sa | Fils et cables electriques pour applications spatiales |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS583039B2 (ja) * | 1975-06-30 | 1983-01-19 | 松下電工株式会社 | フクゴウメツキホウ |
| JPS5688209A (en) * | 1979-12-21 | 1981-07-17 | Tokyo Shibaura Electric Co | Electric contactor |
| SU1035655A1 (ru) * | 1980-12-12 | 1983-08-15 | Предприятие П/Я А-1955 | Электрохимический управл емый резистор |
| US5225253A (en) | 1992-04-17 | 1993-07-06 | General Motors Corporation | Method of forming silver/molybdenum surface coating material |
| JPH08287758A (ja) * | 1994-08-31 | 1996-11-01 | Toshiba Corp | 断路接点装置 |
| US5640808A (en) | 1995-01-09 | 1997-06-24 | Simeone; Al | Enforcer |
| JP3303594B2 (ja) * | 1995-04-11 | 2002-07-22 | 古河電気工業株式会社 | 耐熱銀被覆複合体とその製造方法 |
| JP3816241B2 (ja) * | 1998-07-14 | 2006-08-30 | 株式会社大和化成研究所 | 金属を還元析出させるための水溶液 |
| JP3365762B2 (ja) * | 2000-04-28 | 2003-01-14 | 株式会社神戸製鋼所 | 光情報記録媒体用の反射層または半透明反射層、光情報記録媒体及び光情報記録媒体用スパッタリングターゲット |
| JP2003105586A (ja) * | 2001-09-27 | 2003-04-09 | Kyowa Densen Kk | 電子部品用リード部材および該リード部材の製造方法 |
| DK1516076T3 (da) * | 2002-06-25 | 2008-06-23 | Integran Technologies Inc | Fremgangsmåde til elektroplettering af metalliske og metalmatrixkompositfolier, overtræk og mikrokomponenter |
| DE10318890B4 (de) * | 2003-04-17 | 2014-05-08 | Ami Doduco Gmbh | Elektrische Steckkontakte und ein Halbzeug für deren Herstellung |
| US20050173255A1 (en) * | 2004-02-05 | 2005-08-11 | George Bokisa | Electroplated quaternary alloys |
| US7354354B2 (en) * | 2004-12-17 | 2008-04-08 | Integran Technologies Inc. | Article comprising a fine-grained metallic material and a polymeric material |
| US7320832B2 (en) * | 2004-12-17 | 2008-01-22 | Integran Technologies Inc. | Fine-grained metallic coatings having the coefficient of thermal expansion matched to the one of the substrate |
| US20060154084A1 (en) | 2005-01-10 | 2006-07-13 | Massachusetts Institute Of Technology | Production of metal glass in bulk form |
| KR101234872B1 (ko) * | 2005-03-15 | 2013-02-19 | 후지필름 가부시키가이샤 | 도금 방법, 투광성 도전성막 및 전자기파 차폐막 |
| US7425255B2 (en) | 2005-06-07 | 2008-09-16 | Massachusetts Institute Of Technology | Method for producing alloy deposits and controlling the nanostructure thereof using negative current pulsing electro-deposition |
| JP2008056950A (ja) * | 2006-08-29 | 2008-03-13 | Shinshu Univ | 銀複合材料およびその製造方法 |
| US20090283410A1 (en) * | 2008-05-14 | 2009-11-19 | Xtalic Corporation | Coated articles and related methods |
-
2011
- 2011-03-11 WO PCT/US2011/028104 patent/WO2011112939A1/en not_active Ceased
- 2011-03-11 CN CN201180023944.5A patent/CN102947473B/zh active Active
- 2011-03-11 KR KR1020127026569A patent/KR20130006658A/ko not_active Ceased
- 2011-03-11 CN CN201610459169.2A patent/CN106086502B/zh active Active
- 2011-03-11 JP JP2012557281A patent/JP5872492B2/ja active Active
- 2011-03-11 EP EP11754165.6A patent/EP2545194B1/en active Active
-
2016
- 2016-01-13 JP JP2016004371A patent/JP2016153526A/ja active Pending
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