CN102947473B - 具有涂层的物件及涂布方法 - Google Patents

具有涂层的物件及涂布方法 Download PDF

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Publication number
CN102947473B
CN102947473B CN201180023944.5A CN201180023944A CN102947473B CN 102947473 B CN102947473 B CN 102947473B CN 201180023944 A CN201180023944 A CN 201180023944A CN 102947473 B CN102947473 B CN 102947473B
Authority
CN
China
Prior art keywords
silver
coating
based alloy
bath
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201180023944.5A
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English (en)
Chinese (zh)
Other versions
CN102947473A (zh
Inventor
娜兹拉·戴德范德
克里斯托弗·A·舒
艾伦·C·伦德
乔纳森·C·特伦克尔
约翰·克海伦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xtalic Corp
Original Assignee
Xtalic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US12/723,020 external-priority patent/US9694562B2/en
Priority claimed from US12/723,044 external-priority patent/US20110220511A1/en
Application filed by Xtalic Corp filed Critical Xtalic Corp
Priority to CN201610459169.2A priority Critical patent/CN106086502B/zh
Publication of CN102947473A publication Critical patent/CN102947473A/zh
Application granted granted Critical
Publication of CN102947473B publication Critical patent/CN102947473B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/06—Alloys based on silver
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/617—Crystalline layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B32B15/018—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of a noble metal or a noble metal alloy
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/64—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of silver
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/619—Amorphous layers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Non-Insulated Conductors (AREA)
  • Paints Or Removers (AREA)
CN201180023944.5A 2010-03-12 2011-03-11 具有涂层的物件及涂布方法 Active CN102947473B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610459169.2A CN106086502B (zh) 2010-03-12 2011-03-11 具有涂层的物件及涂布方法

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US12/723,020 2010-03-12
US12/723,020 US9694562B2 (en) 2010-03-12 2010-03-12 Coated articles and methods
US12/723,044 2010-03-12
US12/723,044 US20110220511A1 (en) 2010-03-12 2010-03-12 Electrodeposition baths and systems
PCT/US2011/028104 WO2011112939A1 (en) 2010-03-12 2011-03-11 Coated articles and methods

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN201610459169.2A Division CN106086502B (zh) 2010-03-12 2011-03-11 具有涂层的物件及涂布方法

Publications (2)

Publication Number Publication Date
CN102947473A CN102947473A (zh) 2013-02-27
CN102947473B true CN102947473B (zh) 2016-07-20

Family

ID=44563865

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201180023944.5A Active CN102947473B (zh) 2010-03-12 2011-03-11 具有涂层的物件及涂布方法
CN201610459169.2A Active CN106086502B (zh) 2010-03-12 2011-03-11 具有涂层的物件及涂布方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201610459169.2A Active CN106086502B (zh) 2010-03-12 2011-03-11 具有涂层的物件及涂布方法

Country Status (5)

Country Link
EP (1) EP2545194B1 (enExample)
JP (2) JP5872492B2 (enExample)
KR (1) KR20130006658A (enExample)
CN (2) CN102947473B (enExample)
WO (1) WO2011112939A1 (enExample)

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JP6159726B2 (ja) * 2011-09-14 2017-07-05 エクスタリック コーポレイションＸｔａｌｉｃ Ｃｏｒｐｏｒａｔｉｏｎ 被覆された製品、電着浴、及び関連するシステム
JP2014182976A (ja) * 2013-03-21 2014-09-29 Enplas Corp 電気接触子及び電気部品用ソケット
EP3228161B1 (en) 2014-12-05 2021-11-03 AGC Flat Glass North America, Inc. Plasma source utilizing a macro-particle reduction coating and method of using a plasma source utilizing a macro-particle reduction coating for deposition of thin film coatings and modification of surfaces
CN105154930A (zh) * 2015-08-21 2015-12-16 无锡桥阳机械制造有限公司 一种无氰镀银电镀液及其电镀方法
CN105112952A (zh) * 2015-09-21 2015-12-02 无锡清杨机械制造有限公司 一种无氰镀银用电镀液及其电镀方法
CN105463524A (zh) * 2015-12-23 2016-04-06 苏州市金星工艺镀饰有限公司 一种无氰镀银电镀液的电镀方法
CN108018518A (zh) * 2016-10-31 2018-05-11 通用电气公司 抗硫腐蚀涂层，包括其的物件，及使用其的方法
JP2018203040A (ja) 2017-06-02 2018-12-27 デルタ工業株式会社 サスペンション機構
KR102143753B1 (ko) * 2018-10-18 2020-08-12 전영화전(주) 전해부식에 대한 내식성이 우수한 은 도금층 함유 커넥터용 금속단자
CN110518126B (zh) * 2019-08-05 2023-08-08 中国民用航空飞行学院 一种基于银纳米线薄膜的柔性太阳能电池及其制备方法
US11242609B2 (en) * 2019-10-15 2022-02-08 Rohm and Hass Electronic Materials LLC Acidic aqueous silver-nickel alloy electroplating compositions and methods
JP7770766B2 (ja) * 2020-02-25 2025-11-17 Ｄｏｗａメタルテック株式会社 銀めっき材およびその製造方法
FR3121688B1 (fr) * 2021-04-13 2023-04-14 Axon Cable Sa Fils et cables electriques pour applications spatiales

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6183545B1 (en) * 1998-07-14 2001-02-06 Daiwa Fine Chemicals Co., Ltd. Aqueous solutions for obtaining metals by reductive deposition
US20050173255A1 (en) * 2004-02-05 2005-08-11 George Bokisa Electroplated quaternary alloys
US20090218127A1 (en) * 2005-03-15 2009-09-03 Fujifilm Corporation Plating processing method, light-transmitting conductive film and electromagnetic wave-shielding film
US20090283410A1 (en) * 2008-05-14 2009-11-19 Xtalic Corporation Coated articles and related methods
US20100028714A1 (en) * 2004-12-17 2010-02-04 Integran Technologies, Inc. Fine-Grained Metallic Coatings Having the Coefficient of Thermal Expansion Matched to the One of the Substrate

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JPS583039B2 (ja) * 1975-06-30 1983-01-19 松下電工株式会社 フクゴウメツキホウ
JPS5688209A (en) * 1979-12-21 1981-07-17 Tokyo Shibaura Electric Co Electric contactor
SU1035655A1 (ru) * 1980-12-12 1983-08-15 Предприятие П/Я А-1955 Электрохимический управл емый резистор
US5225253A (en) * 1992-04-17 1993-07-06 General Motors Corporation Method of forming silver/molybdenum surface coating material
JPH08287758A (ja) * 1994-08-31 1996-11-01 Toshiba Corp 断路接点装置
US5640808A (en) 1995-01-09 1997-06-24 Simeone; Al Enforcer
JP3303594B2 (ja) * 1995-04-11 2002-07-22 古河電気工業株式会社 耐熱銀被覆複合体とその製造方法
JP3365762B2 (ja) * 2000-04-28 2003-01-14 株式会社神戸製鋼所 光情報記録媒体用の反射層または半透明反射層、光情報記録媒体及び光情報記録媒体用スパッタリングターゲット
JP2003105586A (ja) * 2001-09-27 2003-04-09 Kyowa Densen Kk 電子部品用リード部材および該リード部材の製造方法
BR0215787B1 (pt) * 2002-06-25 2013-12-03 Processo para eletrodeposição catódica de um material metálico selecionado em um substrato permanente ou temporário e microcomponente produzido por um processo de eletrodeposição de pulso
DE10318890B4 (de) * 2003-04-17 2014-05-08 Ami Doduco Gmbh Elektrische Steckkontakte und ein Halbzeug für deren Herstellung
US7354354B2 (en) * 2004-12-17 2008-04-08 Integran Technologies Inc. Article comprising a fine-grained metallic material and a polymeric material
US20060154084A1 (en) 2005-01-10 2006-07-13 Massachusetts Institute Of Technology Production of metal glass in bulk form
US7425255B2 (en) 2005-06-07 2008-09-16 Massachusetts Institute Of Technology Method for producing alloy deposits and controlling the nanostructure thereof using negative current pulsing electro-deposition
JP2008056950A (ja) * 2006-08-29 2008-03-13 Shinshu Univ 銀複合材料およびその製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6183545B1 (en) * 1998-07-14 2001-02-06 Daiwa Fine Chemicals Co., Ltd. Aqueous solutions for obtaining metals by reductive deposition
US20050173255A1 (en) * 2004-02-05 2005-08-11 George Bokisa Electroplated quaternary alloys
US20100028714A1 (en) * 2004-12-17 2010-02-04 Integran Technologies, Inc. Fine-Grained Metallic Coatings Having the Coefficient of Thermal Expansion Matched to the One of the Substrate
US20090218127A1 (en) * 2005-03-15 2009-09-03 Fujifilm Corporation Plating processing method, light-transmitting conductive film and electromagnetic wave-shielding film
US20090283410A1 (en) * 2008-05-14 2009-11-19 Xtalic Corporation Coated articles and related methods

Also Published As

Publication number Publication date
WO2011112939A1 (en) 2011-09-15
CN106086502B (zh) 2018-12-04
EP2545194A4 (en) 2017-04-05
KR20130006658A (ko) 2013-01-17
CN102947473A (zh) 2013-02-27
CN106086502A (zh) 2016-11-09
JP5872492B2 (ja) 2016-03-01
JP2016153526A (ja) 2016-08-25
EP2545194A1 (en) 2013-01-16
JP2013531729A (ja) 2013-08-08
EP2545194B1 (en) 2018-05-30

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