KR20130006658A - 코팅된 물품 및 방법 - Google Patents

코팅된 물품 및 방법 Download PDF

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Publication number
KR20130006658A
KR20130006658A KR1020127026569A KR20127026569A KR20130006658A KR 20130006658 A KR20130006658 A KR 20130006658A KR 1020127026569 A KR1020127026569 A KR 1020127026569A KR 20127026569 A KR20127026569 A KR 20127026569A KR 20130006658 A KR20130006658 A KR 20130006658A
Authority
KR
South Korea
Prior art keywords
silver
coating
bath
based alloy
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020127026569A
Other languages
English (en)
Korean (ko)
Inventor
나질라 다드반드
크리스토퍼 에이. 슈
알란 씨. 룬드
조나단 씨. 트렌클
존 카할렌
Original Assignee
엑스탤릭 코포레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US12/723,044 external-priority patent/US20110220511A1/en
Priority claimed from US12/723,020 external-priority patent/US9694562B2/en
Application filed by 엑스탤릭 코포레이션 filed Critical 엑스탤릭 코포레이션
Publication of KR20130006658A publication Critical patent/KR20130006658A/ko
Ceased legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/06—Alloys based on silver
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/617—Crystalline layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B32B15/018—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of a noble metal or a noble metal alloy
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/64—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of silver
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/619—Amorphous layers

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  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Non-Insulated Conductors (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Paints Or Removers (AREA)
KR1020127026569A 2010-03-12 2011-03-11 코팅된 물품 및 방법 Ceased KR20130006658A (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US12/723,020 2010-03-12
US12/723,044 US20110220511A1 (en) 2010-03-12 2010-03-12 Electrodeposition baths and systems
US12/723,044 2010-03-12
US12/723,020 US9694562B2 (en) 2010-03-12 2010-03-12 Coated articles and methods
PCT/US2011/028104 WO2011112939A1 (en) 2010-03-12 2011-03-11 Coated articles and methods

Publications (1)

Publication Number Publication Date
KR20130006658A true KR20130006658A (ko) 2013-01-17

Family

ID=44563865

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020127026569A Ceased KR20130006658A (ko) 2010-03-12 2011-03-11 코팅된 물품 및 방법

Country Status (5)

Country Link
EP (1) EP2545194B1 (enExample)
JP (2) JP5872492B2 (enExample)
KR (1) KR20130006658A (enExample)
CN (2) CN106086502B (enExample)
WO (1) WO2011112939A1 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104080606B (zh) * 2011-09-14 2016-12-07 克斯塔里克公司 涂覆制品、电沉积浴及相关系统
JP2014182976A (ja) * 2013-03-21 2014-09-29 Enplas Corp 電気接触子及び電気部品用ソケット
KR102365939B1 (ko) 2014-12-05 2022-02-22 에이지씨 플랫 글래스 노스 아메리카, 인코퍼레이티드 거대-입자 감소 코팅을 활용하는 플라즈마 소스 및 박막 코팅의 증착과 표면의 개질을 위해 거대-입자 감소 코팅을 활용하는 플라즈마 소스의 사용 방법
CN105154930A (zh) * 2015-08-21 2015-12-16 无锡桥阳机械制造有限公司 一种无氰镀银电镀液及其电镀方法
CN105112952A (zh) * 2015-09-21 2015-12-02 无锡清杨机械制造有限公司 一种无氰镀银用电镀液及其电镀方法
CN105463524A (zh) * 2015-12-23 2016-04-06 苏州市金星工艺镀饰有限公司 一种无氰镀银电镀液的电镀方法
CN108018518A (zh) * 2016-10-31 2018-05-11 通用电气公司 抗硫腐蚀涂层，包括其的物件，及使用其的方法
JP2018203040A (ja) 2017-06-02 2018-12-27 デルタ工業株式会社 サスペンション機構
KR102143753B1 (ko) * 2018-10-18 2020-08-12 전영화전(주) 전해부식에 대한 내식성이 우수한 은 도금층 함유 커넥터용 금속단자
CN110518126B (zh) * 2019-08-05 2023-08-08 中国民用航空飞行学院 一种基于银纳米线薄膜的柔性太阳能电池及其制备方法
US11242609B2 (en) * 2019-10-15 2022-02-08 Rohm and Hass Electronic Materials LLC Acidic aqueous silver-nickel alloy electroplating compositions and methods
JP7770766B2 (ja) * 2020-02-25 2025-11-17 Ｄｏｗａメタルテック株式会社 銀めっき材およびその製造方法
FR3121688B1 (fr) * 2021-04-13 2023-04-14 Axon Cable Sa Fils et cables electriques pour applications spatiales

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS583039B2 (ja) * 1975-06-30 1983-01-19 松下電工株式会社 フクゴウメツキホウ
JPS5688209A (en) * 1979-12-21 1981-07-17 Tokyo Shibaura Electric Co Electric contactor
SU1035655A1 (ru) * 1980-12-12 1983-08-15 Предприятие П/Я А-1955 Электрохимический управл емый резистор
US5225253A (en) * 1992-04-17 1993-07-06 General Motors Corporation Method of forming silver/molybdenum surface coating material
JPH08287758A (ja) * 1994-08-31 1996-11-01 Toshiba Corp 断路接点装置
US5640808A (en) 1995-01-09 1997-06-24 Simeone; Al Enforcer
JP3303594B2 (ja) * 1995-04-11 2002-07-22 古河電気工業株式会社 耐熱銀被覆複合体とその製造方法
JP3816241B2 (ja) * 1998-07-14 2006-08-30 株式会社大和化成研究所 金属を還元析出させるための水溶液
JP3365762B2 (ja) * 2000-04-28 2003-01-14 株式会社神戸製鋼所 光情報記録媒体用の反射層または半透明反射層、光情報記録媒体及び光情報記録媒体用スパッタリングターゲット
JP2003105586A (ja) * 2001-09-27 2003-04-09 Kyowa Densen Kk 電子部品用リード部材および該リード部材の製造方法
WO2004001100A1 (en) * 2002-06-25 2003-12-31 Integran Technologies, Inc. Process for electroplating metallic and metall matrix composite foils, coatings and microcomponents
DE10318890B4 (de) * 2003-04-17 2014-05-08 Ami Doduco Gmbh Elektrische Steckkontakte und ein Halbzeug für deren Herstellung
US20050173255A1 (en) * 2004-02-05 2005-08-11 George Bokisa Electroplated quaternary alloys
US7320832B2 (en) * 2004-12-17 2008-01-22 Integran Technologies Inc. Fine-grained metallic coatings having the coefficient of thermal expansion matched to the one of the substrate
US7354354B2 (en) * 2004-12-17 2008-04-08 Integran Technologies Inc. Article comprising a fine-grained metallic material and a polymeric material
US20060154084A1 (en) 2005-01-10 2006-07-13 Massachusetts Institute Of Technology Production of metal glass in bulk form
TWI406084B (zh) * 2005-03-15 2013-08-21 Fujifilm Corp 鍍敷處理方法
US7425255B2 (en) 2005-06-07 2008-09-16 Massachusetts Institute Of Technology Method for producing alloy deposits and controlling the nanostructure thereof using negative current pulsing electro-deposition
JP2008056950A (ja) * 2006-08-29 2008-03-13 Shinshu Univ 銀複合材料およびその製造方法
US20090283410A1 (en) * 2008-05-14 2009-11-19 Xtalic Corporation Coated articles and related methods

Also Published As

Publication number Publication date
WO2011112939A1 (en) 2011-09-15
EP2545194B1 (en) 2018-05-30
CN106086502B (zh) 2018-12-04
EP2545194A4 (en) 2017-04-05
JP2016153526A (ja) 2016-08-25
JP2013531729A (ja) 2013-08-08
CN102947473B (zh) 2016-07-20
CN106086502A (zh) 2016-11-09
EP2545194A1 (en) 2013-01-16
JP5872492B2 (ja) 2016-03-01
CN102947473A (zh) 2013-02-27

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