CN106086502B - 具有涂层的物件及涂布方法 - Google Patents

具有涂层的物件及涂布方法 Download PDF

Info

Publication number
CN106086502B
CN106086502B CN201610459169.2A CN201610459169A CN106086502B CN 106086502 B CN106086502 B CN 106086502B CN 201610459169 A CN201610459169 A CN 201610459169A CN 106086502 B CN106086502 B CN 106086502B
Authority
CN
China
Prior art keywords
coating
silver
layer
base alloy
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201610459169.2A
Other languages
English (en)
Chinese (zh)
Other versions
CN106086502A (zh
Inventor
娜兹拉·戴德范德
克里斯托弗·A·舒
艾伦·C·伦德
乔纳森·C·特伦克尔
约翰·克海伦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xtalic Corp
Original Assignee
Xtalic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US12/723,044 external-priority patent/US20110220511A1/en
Priority claimed from US12/723,020 external-priority patent/US9694562B2/en
Application filed by Xtalic Corp filed Critical Xtalic Corp
Publication of CN106086502A publication Critical patent/CN106086502A/zh
Application granted granted Critical
Publication of CN106086502B publication Critical patent/CN106086502B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C5/00Alloys based on noble metals
    • C22C5/06Alloys based on silver
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60Electroplating characterised by the structure or texture of the layers
    • C25D5/615Microstructure of the layers, e.g. mixed structure
    • C25D5/617Crystalline layers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/01Layered products comprising a layer of metal all layers being exclusively metallic
    • B32B15/018Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of a noble metal or a noble metal alloy
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/56Electroplating: Baths therefor from solutions of alloys
    • C25D3/64Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of silver
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10Electroplating with more than one layer of the same or of different metals
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10Electroplating with more than one layer of the same or of different metals
    • C25D5/12Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60Electroplating characterised by the structure or texture of the layers
    • C25D5/615Microstructure of the layers, e.g. mixed structure
    • C25D5/619Amorphous layers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Non-Insulated Conductors (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Paints Or Removers (AREA)
CN201610459169.2A 2010-03-12 2011-03-11 具有涂层的物件及涂布方法 Active CN106086502B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US12/723,020 2010-03-12
US12/723,044 US20110220511A1 (en) 2010-03-12 2010-03-12 Electrodeposition baths and systems
US12/723,044 2010-03-12
US12/723,020 US9694562B2 (en) 2010-03-12 2010-03-12 Coated articles and methods
CN201180023944.5A CN102947473B (zh) 2010-03-12 2011-03-11 具有涂层的物件及涂布方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201180023944.5A Division CN102947473B (zh) 2010-03-12 2011-03-11 具有涂层的物件及涂布方法

Publications (2)

Publication Number Publication Date
CN106086502A CN106086502A (zh) 2016-11-09
CN106086502B true CN106086502B (zh) 2018-12-04

Family

ID=44563865

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201610459169.2A Active CN106086502B (zh) 2010-03-12 2011-03-11 具有涂层的物件及涂布方法
CN201180023944.5A Active CN102947473B (zh) 2010-03-12 2011-03-11 具有涂层的物件及涂布方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201180023944.5A Active CN102947473B (zh) 2010-03-12 2011-03-11 具有涂层的物件及涂布方法

Country Status (5)

Country Link
EP (1) EP2545194B1 (enExample)
JP (2) JP5872492B2 (enExample)
KR (1) KR20130006658A (enExample)
CN (2) CN106086502B (enExample)
WO (1) WO2011112939A1 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104080606B (zh) * 2011-09-14 2016-12-07 克斯塔里克公司 涂覆制品、电沉积浴及相关系统
JP2014182976A (ja) * 2013-03-21 2014-09-29 Enplas Corp 電気接触子及び電気部品用ソケット
KR102365939B1 (ko) 2014-12-05 2022-02-22 에이지씨 플랫 글래스 노스 아메리카, 인코퍼레이티드 거대-입자 감소 코팅을 활용하는 플라즈마 소스 및 박막 코팅의 증착과 표면의 개질을 위해 거대-입자 감소 코팅을 활용하는 플라즈마 소스의 사용 방법
CN105154930A (zh) * 2015-08-21 2015-12-16 无锡桥阳机械制造有限公司 一种无氰镀银电镀液及其电镀方法
CN105112952A (zh) * 2015-09-21 2015-12-02 无锡清杨机械制造有限公司 一种无氰镀银用电镀液及其电镀方法
CN105463524A (zh) * 2015-12-23 2016-04-06 苏州市金星工艺镀饰有限公司 一种无氰镀银电镀液的电镀方法
CN108018518A (zh) * 2016-10-31 2018-05-11 通用电气公司 抗硫腐蚀涂层,包括其的物件,及使用其的方法
JP2018203040A (ja) 2017-06-02 2018-12-27 デルタ工業株式会社 サスペンション機構
KR102143753B1 (ko) * 2018-10-18 2020-08-12 전영화전(주) 전해부식에 대한 내식성이 우수한 은 도금층 함유 커넥터용 금속단자
CN110518126B (zh) * 2019-08-05 2023-08-08 中国民用航空飞行学院 一种基于银纳米线薄膜的柔性太阳能电池及其制备方法
US11242609B2 (en) * 2019-10-15 2022-02-08 Rohm and Hass Electronic Materials LLC Acidic aqueous silver-nickel alloy electroplating compositions and methods
JP7770766B2 (ja) * 2020-02-25 2025-11-17 Dowaメタルテック株式会社 銀めっき材およびその製造方法
FR3121688B1 (fr) * 2021-04-13 2023-04-14 Axon Cable Sa Fils et cables electriques pour applications spatiales

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5225253A (en) * 1992-04-17 1993-07-06 General Motors Corporation Method of forming silver/molybdenum surface coating material

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS583039B2 (ja) * 1975-06-30 1983-01-19 松下電工株式会社 フクゴウメツキホウ
JPS5688209A (en) * 1979-12-21 1981-07-17 Tokyo Shibaura Electric Co Electric contactor
SU1035655A1 (ru) * 1980-12-12 1983-08-15 Предприятие П/Я А-1955 Электрохимический управл емый резистор
JPH08287758A (ja) * 1994-08-31 1996-11-01 Toshiba Corp 断路接点装置
US5640808A (en) 1995-01-09 1997-06-24 Simeone; Al Enforcer
JP3303594B2 (ja) * 1995-04-11 2002-07-22 古河電気工業株式会社 耐熱銀被覆複合体とその製造方法
JP3816241B2 (ja) * 1998-07-14 2006-08-30 株式会社大和化成研究所 金属を還元析出させるための水溶液
JP3365762B2 (ja) * 2000-04-28 2003-01-14 株式会社神戸製鋼所 光情報記録媒体用の反射層または半透明反射層、光情報記録媒体及び光情報記録媒体用スパッタリングターゲット
JP2003105586A (ja) * 2001-09-27 2003-04-09 Kyowa Densen Kk 電子部品用リード部材および該リード部材の製造方法
WO2004001100A1 (en) * 2002-06-25 2003-12-31 Integran Technologies, Inc. Process for electroplating metallic and metall matrix composite foils, coatings and microcomponents
DE10318890B4 (de) * 2003-04-17 2014-05-08 Ami Doduco Gmbh Elektrische Steckkontakte und ein Halbzeug für deren Herstellung
US20050173255A1 (en) * 2004-02-05 2005-08-11 George Bokisa Electroplated quaternary alloys
US7320832B2 (en) * 2004-12-17 2008-01-22 Integran Technologies Inc. Fine-grained metallic coatings having the coefficient of thermal expansion matched to the one of the substrate
US7354354B2 (en) * 2004-12-17 2008-04-08 Integran Technologies Inc. Article comprising a fine-grained metallic material and a polymeric material
US20060154084A1 (en) 2005-01-10 2006-07-13 Massachusetts Institute Of Technology Production of metal glass in bulk form
TWI406084B (zh) * 2005-03-15 2013-08-21 Fujifilm Corp 鍍敷處理方法
US7425255B2 (en) 2005-06-07 2008-09-16 Massachusetts Institute Of Technology Method for producing alloy deposits and controlling the nanostructure thereof using negative current pulsing electro-deposition
JP2008056950A (ja) * 2006-08-29 2008-03-13 Shinshu Univ 銀複合材料およびその製造方法
US20090283410A1 (en) * 2008-05-14 2009-11-19 Xtalic Corporation Coated articles and related methods

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5225253A (en) * 1992-04-17 1993-07-06 General Motors Corporation Method of forming silver/molybdenum surface coating material

Also Published As

Publication number Publication date
WO2011112939A1 (en) 2011-09-15
EP2545194B1 (en) 2018-05-30
EP2545194A4 (en) 2017-04-05
JP2016153526A (ja) 2016-08-25
JP2013531729A (ja) 2013-08-08
KR20130006658A (ko) 2013-01-17
CN102947473B (zh) 2016-07-20
CN106086502A (zh) 2016-11-09
EP2545194A1 (en) 2013-01-16
JP5872492B2 (ja) 2016-03-01
CN102947473A (zh) 2013-02-27

Similar Documents

Publication Publication Date Title
CN106086502B (zh) 具有涂层的物件及涂布方法
US8445116B2 (en) Coated articles and methods
US11634831B2 (en) Coated articles
US20200115815A1 (en) Coated articles, electrodeposition baths, and related systems
CN106947986B (zh) 涂覆制品、电沉积浴及相关系统
US20120121925A1 (en) Coated articles, electrodeposition baths, and related systems
WO2015002838A1 (en) Coated articles comprising a metal layer
US20110220511A1 (en) Electrodeposition baths and systems
JP3711141B1 (ja) Sn−Ag−Cu三元合金薄膜を形成する方法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant