JP2021510628A5 - - Google Patents
Info
- Publication number
- JP2021510628A5 JP2021510628A5 JP2020538938A JP2020538938A JP2021510628A5 JP 2021510628 A5 JP2021510628 A5 JP 2021510628A5 JP 2020538938 A JP2020538938 A JP 2020538938A JP 2020538938 A JP2020538938 A JP 2020538938A JP 2021510628 A5 JP2021510628 A5 JP 2021510628A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- liquid
- work surface
- real
- stroboscope
- Prior art date
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201862617345P | 2018-01-15 | 2018-01-15 | |
| US62/617,345 | 2018-01-15 | ||
| PCT/US2019/013588 WO2019140423A1 (en) | 2018-01-15 | 2019-01-15 | System and method for fluid dispense and coverage control |
Publications (4)
| Publication Number | Publication Date |
|---|---|
| JP2021510628A JP2021510628A (ja) | 2021-04-30 |
| JPWO2019140423A5 JPWO2019140423A5 (https=) | 2022-01-21 |
| JP2021510628A5 true JP2021510628A5 (https=) | 2022-01-21 |
| JP7357844B2 JP7357844B2 (ja) | 2023-10-10 |
Family
ID=67212581
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020538938A Active JP7357844B2 (ja) | 2018-01-15 | 2019-01-15 | 流体分配及びカバレージ制御のためのシステム及び方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (4) | US10946411B2 (https=) |
| JP (1) | JP7357844B2 (https=) |
| KR (1) | KR102735312B1 (https=) |
| CN (1) | CN111587479B (https=) |
| TW (1) | TWI804563B (https=) |
| WO (1) | WO2019140423A1 (https=) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3934445A4 (en) * | 2019-03-07 | 2022-10-26 | RLMB Group, LLC | SYSTEMS AND METHODS OF APPLICATION OF TREATMENTS FOR PRESERVATION OF PERISHABLE GOODS |
| WO2021076320A1 (en) | 2019-10-15 | 2021-04-22 | Tokyo Electron Limited | Systems and methods for monitoring one or more characteristics of a substrate |
| US20210129166A1 (en) | 2019-11-04 | 2021-05-06 | Tokyo Electron Limited | Systems and Methods for Spin Process Video Analysis During Substrate Processing |
| US11276157B2 (en) | 2019-11-14 | 2022-03-15 | Tokyo Electron Limited | Systems and methods for automated video analysis detection techniques for substrate process |
| US11624607B2 (en) * | 2020-01-06 | 2023-04-11 | Tokyo Electron Limited | Hardware improvements and methods for the analysis of a spinning reflective substrates |
| KR102874193B1 (ko) | 2020-03-10 | 2025-10-20 | 도쿄엘렉트론가부시키가이샤 | 트랙 시스템 내로의 통합을 위한 장파 적외선 열 센서 |
| US11883837B2 (en) | 2020-05-01 | 2024-01-30 | Tokyo Electron Limited | System and method for liquid dispense and coverage control |
| JP7443163B2 (ja) | 2020-05-27 | 2024-03-05 | 株式会社Screenホールディングス | 基板処理方法および基板処理装置 |
| CN112076958B (zh) * | 2020-09-18 | 2021-11-19 | 吉林华微电子股份有限公司 | 芯片涂胶方法、装置及匀胶机 |
| CN112206978A (zh) * | 2020-09-23 | 2021-01-12 | 广西欣亿光电科技有限公司 | 一种新型高亮白光Side-LED点胶封装结构 |
| CN113117979A (zh) * | 2021-04-26 | 2021-07-16 | 高彬 | 一种半导体晶片加工处理装置 |
| US11738363B2 (en) | 2021-06-07 | 2023-08-29 | Tokyo Electron Limited | Bath systems and methods thereof |
| US12488452B2 (en) | 2021-06-16 | 2025-12-02 | Tokyo Electron Limited | Wafer bath imaging |
| US12272576B2 (en) * | 2021-06-18 | 2025-04-08 | Taiwan Semiconductor Manufacturing Company, Ltd. | Apparatus and methods for determining fluid dynamics of liquid film on wafer surface |
| JP7774472B2 (ja) * | 2022-03-02 | 2025-11-21 | 株式会社Screenホールディングス | 基板処理方法、及び基板処理装置 |
| CN114975183B (zh) * | 2022-05-31 | 2025-09-16 | 北京北方华创微电子装备有限公司 | 半导体工艺设备的补水控制方法和半导体工艺设备 |
| KR102737928B1 (ko) * | 2022-10-06 | 2024-12-05 | 주식회사 램스 | 반도체 pr장비의 노즐장치에 대한 불량 도포의 ai 검출 및 제어 시스템 |
| TWI910439B (zh) * | 2023-07-03 | 2026-01-01 | 群創光電股份有限公司 | 製造電子裝置的方法 |
| US20250271774A1 (en) * | 2024-02-27 | 2025-08-28 | Nanya Technology Corporation | Method of manufacturing semiconductor device and semiconductor device manufacturing system |
Family Cites Families (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5043904A (en) * | 1990-04-27 | 1991-08-27 | Web Printing Controls Co., Inc. | Web handling apparatus monitoring system with user defined outputs |
| JP3960633B2 (ja) * | 1995-02-27 | 2007-08-15 | リソテック ジャパン株式会社 | 膜厚制御方法および装置 |
| US5843527A (en) * | 1995-06-15 | 1998-12-01 | Dainippon Screen Mfg. Co., Ltd. | Coating solution applying method and apparatus |
| JPH09153453A (ja) * | 1995-09-28 | 1997-06-10 | Dainippon Screen Mfg Co Ltd | 処理液供給装置 |
| JPH09171955A (ja) * | 1995-12-20 | 1997-06-30 | Seiko Epson Corp | レジスト処理装置及びその方法 |
| JP3578577B2 (ja) * | 1997-01-28 | 2004-10-20 | 大日本スクリーン製造株式会社 | 処理液供給方法及びその装置 |
| JP3641162B2 (ja) * | 1998-04-20 | 2005-04-20 | 東京エレクトロン株式会社 | 塗布膜形成装置及びその方法並びにパターン形成方法 |
| JP3847965B2 (ja) * | 1998-07-30 | 2006-11-22 | キヤノン株式会社 | 撮像装置 |
| KR100604024B1 (ko) * | 1999-04-19 | 2006-07-24 | 동경 엘렉트론 주식회사 | 도포막 형성방법 및 도포장치 |
| JP3284121B2 (ja) * | 2000-02-25 | 2002-05-20 | 株式会社東芝 | レジスト塗布方法、レジストパターン形成方法及び溶液供給装置 |
| KR100882520B1 (ko) * | 2001-06-01 | 2009-02-06 | 가부시키가이샤 아루박 | 해상도를 개선하기 위한 미세 증착 제어 시스템에서의오버-클록킹 |
| US6680078B2 (en) * | 2001-07-11 | 2004-01-20 | Micron Technology, Inc. | Method for dispensing flowable substances on microelectronic substrates |
| KR100470682B1 (ko) * | 2001-09-11 | 2005-03-07 | 나노에프에이 주식회사 | 포토레지스트의 흘림 길이를 조절할 수 있는 포토레지스트공급 장치 및 이를 이용한 포토레지스트 공급 방법 |
| US6493078B1 (en) * | 2001-09-19 | 2002-12-10 | International Business Machines Corporation | Method and apparatus to improve coating quality |
| JP3988817B2 (ja) * | 2001-09-25 | 2007-10-10 | 大日本スクリーン製造株式会社 | 塗布液塗布方法及びその装置並びにその装置の塗布条件調整方法 |
| JP2003133193A (ja) * | 2001-10-19 | 2003-05-09 | Canon Inc | 情報処理装置及びその方法、コンピュータ可読メモリ |
| JP4170643B2 (ja) * | 2002-03-14 | 2008-10-22 | 大日本スクリーン製造株式会社 | 基板処理装置 |
| US6890050B2 (en) * | 2002-08-20 | 2005-05-10 | Palo Alto Research Center Incorporated | Method for the printing of homogeneous electronic material with a multi-ejector print head |
| JP2004214385A (ja) * | 2002-12-27 | 2004-07-29 | Tokyo Electron Ltd | 塗布膜形成装置及びその方法 |
| US20040139985A1 (en) * | 2003-01-22 | 2004-07-22 | Applied Materials, Inc. | Rate monitor for wet wafer cleaning |
| JP2007313439A (ja) * | 2006-05-26 | 2007-12-06 | Hitachi High-Technologies Corp | 樹脂塗布装置及び樹脂塗布方法 |
| KR101130208B1 (ko) * | 2009-11-26 | 2012-03-30 | 세메스 주식회사 | 처리액 토출 방법 |
| JP5944132B2 (ja) * | 2011-10-05 | 2016-07-05 | 株式会社Screenセミコンダクターソリューションズ | 塗布方法および塗布装置 |
| JP6352824B2 (ja) * | 2015-01-23 | 2018-07-04 | 東芝メモリ株式会社 | 基板処理装置、制御プログラムおよび制御方法 |
| JP6498006B2 (ja) * | 2015-03-25 | 2019-04-10 | 株式会社Screenホールディングス | 塗布方法 |
| US9653367B2 (en) * | 2015-06-29 | 2017-05-16 | Globalfoundries Inc. | Methods including a processing of wafers and spin coating tool |
| GB2545671B (en) * | 2015-12-21 | 2019-06-12 | Xaar Technology Ltd | Droplet deposition apparatus and methods of driving thereof |
| WO2018213640A1 (en) * | 2017-05-17 | 2018-11-22 | Mariana Bertoni | Systems and methods for controlling the morphology and porosity of printed reactive inks for high precision printing |
| US20190287793A1 (en) * | 2018-03-19 | 2019-09-19 | Tokyo Electron Limited | System and Method for Tuning Thickness of Resist Films |
-
2019
- 2019-01-15 WO PCT/US2019/013588 patent/WO2019140423A1/en not_active Ceased
- 2019-01-15 US US16/247,780 patent/US10946411B2/en active Active
- 2019-01-15 JP JP2020538938A patent/JP7357844B2/ja active Active
- 2019-01-15 US US16/247,769 patent/US20190217325A1/en not_active Abandoned
- 2019-01-15 US US16/247,777 patent/US20190217327A1/en not_active Abandoned
- 2019-01-15 US US16/247,772 patent/US20190217326A1/en not_active Abandoned
- 2019-01-15 CN CN201980008258.7A patent/CN111587479B/zh active Active
- 2019-01-15 KR KR1020207021074A patent/KR102735312B1/ko active Active
- 2019-01-15 TW TW108101468A patent/TWI804563B/zh active
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