JP2021510628A5 - - Google Patents

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Publication number
JP2021510628A5
JP2021510628A5 JP2020538938A JP2020538938A JP2021510628A5 JP 2021510628 A5 JP2021510628 A5 JP 2021510628A5 JP 2020538938 A JP2020538938 A JP 2020538938A JP 2020538938 A JP2020538938 A JP 2020538938A JP 2021510628 A5 JP2021510628 A5 JP 2021510628A5
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JP
Japan
Prior art keywords
substrate
liquid
work surface
real
stroboscope
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JP2020538938A
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English (en)
Japanese (ja)
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JPWO2019140423A5 (https=
JP7357844B2 (ja
JP2021510628A (ja
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Priority claimed from PCT/US2019/013588 external-priority patent/WO2019140423A1/en
Publication of JP2021510628A publication Critical patent/JP2021510628A/ja
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Publication of JP2021510628A5 publication Critical patent/JP2021510628A5/ja
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JP2020538938A 2018-01-15 2019-01-15 流体分配及びカバレージ制御のためのシステム及び方法 Active JP7357844B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201862617345P 2018-01-15 2018-01-15
US62/617,345 2018-01-15
PCT/US2019/013588 WO2019140423A1 (en) 2018-01-15 2019-01-15 System and method for fluid dispense and coverage control

Publications (4)

Publication Number Publication Date
JP2021510628A JP2021510628A (ja) 2021-04-30
JPWO2019140423A5 JPWO2019140423A5 (https=) 2022-01-21
JP2021510628A5 true JP2021510628A5 (https=) 2022-01-21
JP7357844B2 JP7357844B2 (ja) 2023-10-10

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JP2020538938A Active JP7357844B2 (ja) 2018-01-15 2019-01-15 流体分配及びカバレージ制御のためのシステム及び方法

Country Status (6)

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US (4) US10946411B2 (https=)
JP (1) JP7357844B2 (https=)
KR (1) KR102735312B1 (https=)
CN (1) CN111587479B (https=)
TW (1) TWI804563B (https=)
WO (1) WO2019140423A1 (https=)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3934445A4 (en) * 2019-03-07 2022-10-26 RLMB Group, LLC SYSTEMS AND METHODS OF APPLICATION OF TREATMENTS FOR PRESERVATION OF PERISHABLE GOODS
WO2021076320A1 (en) 2019-10-15 2021-04-22 Tokyo Electron Limited Systems and methods for monitoring one or more characteristics of a substrate
US20210129166A1 (en) 2019-11-04 2021-05-06 Tokyo Electron Limited Systems and Methods for Spin Process Video Analysis During Substrate Processing
US11276157B2 (en) 2019-11-14 2022-03-15 Tokyo Electron Limited Systems and methods for automated video analysis detection techniques for substrate process
US11624607B2 (en) * 2020-01-06 2023-04-11 Tokyo Electron Limited Hardware improvements and methods for the analysis of a spinning reflective substrates
KR102874193B1 (ko) 2020-03-10 2025-10-20 도쿄엘렉트론가부시키가이샤 트랙 시스템 내로의 통합을 위한 장파 적외선 열 센서
US11883837B2 (en) 2020-05-01 2024-01-30 Tokyo Electron Limited System and method for liquid dispense and coverage control
JP7443163B2 (ja) 2020-05-27 2024-03-05 株式会社Screenホールディングス 基板処理方法および基板処理装置
CN112076958B (zh) * 2020-09-18 2021-11-19 吉林华微电子股份有限公司 芯片涂胶方法、装置及匀胶机
CN112206978A (zh) * 2020-09-23 2021-01-12 广西欣亿光电科技有限公司 一种新型高亮白光Side-LED点胶封装结构
CN113117979A (zh) * 2021-04-26 2021-07-16 高彬 一种半导体晶片加工处理装置
US11738363B2 (en) 2021-06-07 2023-08-29 Tokyo Electron Limited Bath systems and methods thereof
US12488452B2 (en) 2021-06-16 2025-12-02 Tokyo Electron Limited Wafer bath imaging
US12272576B2 (en) * 2021-06-18 2025-04-08 Taiwan Semiconductor Manufacturing Company, Ltd. Apparatus and methods for determining fluid dynamics of liquid film on wafer surface
JP7774472B2 (ja) * 2022-03-02 2025-11-21 株式会社Screenホールディングス 基板処理方法、及び基板処理装置
CN114975183B (zh) * 2022-05-31 2025-09-16 北京北方华创微电子装备有限公司 半导体工艺设备的补水控制方法和半导体工艺设备
KR102737928B1 (ko) * 2022-10-06 2024-12-05 주식회사 램스 반도체 pr장비의 노즐장치에 대한 불량 도포의 ai 검출 및 제어 시스템
TWI910439B (zh) * 2023-07-03 2026-01-01 群創光電股份有限公司 製造電子裝置的方法
US20250271774A1 (en) * 2024-02-27 2025-08-28 Nanya Technology Corporation Method of manufacturing semiconductor device and semiconductor device manufacturing system

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5043904A (en) * 1990-04-27 1991-08-27 Web Printing Controls Co., Inc. Web handling apparatus monitoring system with user defined outputs
JP3960633B2 (ja) * 1995-02-27 2007-08-15 リソテック ジャパン株式会社 膜厚制御方法および装置
US5843527A (en) * 1995-06-15 1998-12-01 Dainippon Screen Mfg. Co., Ltd. Coating solution applying method and apparatus
JPH09153453A (ja) * 1995-09-28 1997-06-10 Dainippon Screen Mfg Co Ltd 処理液供給装置
JPH09171955A (ja) * 1995-12-20 1997-06-30 Seiko Epson Corp レジスト処理装置及びその方法
JP3578577B2 (ja) * 1997-01-28 2004-10-20 大日本スクリーン製造株式会社 処理液供給方法及びその装置
JP3641162B2 (ja) * 1998-04-20 2005-04-20 東京エレクトロン株式会社 塗布膜形成装置及びその方法並びにパターン形成方法
JP3847965B2 (ja) * 1998-07-30 2006-11-22 キヤノン株式会社 撮像装置
KR100604024B1 (ko) * 1999-04-19 2006-07-24 동경 엘렉트론 주식회사 도포막 형성방법 및 도포장치
JP3284121B2 (ja) * 2000-02-25 2002-05-20 株式会社東芝 レジスト塗布方法、レジストパターン形成方法及び溶液供給装置
KR100882520B1 (ko) * 2001-06-01 2009-02-06 가부시키가이샤 아루박 해상도를 개선하기 위한 미세 증착 제어 시스템에서의오버-클록킹
US6680078B2 (en) * 2001-07-11 2004-01-20 Micron Technology, Inc. Method for dispensing flowable substances on microelectronic substrates
KR100470682B1 (ko) * 2001-09-11 2005-03-07 나노에프에이 주식회사 포토레지스트의 흘림 길이를 조절할 수 있는 포토레지스트공급 장치 및 이를 이용한 포토레지스트 공급 방법
US6493078B1 (en) * 2001-09-19 2002-12-10 International Business Machines Corporation Method and apparatus to improve coating quality
JP3988817B2 (ja) * 2001-09-25 2007-10-10 大日本スクリーン製造株式会社 塗布液塗布方法及びその装置並びにその装置の塗布条件調整方法
JP2003133193A (ja) * 2001-10-19 2003-05-09 Canon Inc 情報処理装置及びその方法、コンピュータ可読メモリ
JP4170643B2 (ja) * 2002-03-14 2008-10-22 大日本スクリーン製造株式会社 基板処理装置
US6890050B2 (en) * 2002-08-20 2005-05-10 Palo Alto Research Center Incorporated Method for the printing of homogeneous electronic material with a multi-ejector print head
JP2004214385A (ja) * 2002-12-27 2004-07-29 Tokyo Electron Ltd 塗布膜形成装置及びその方法
US20040139985A1 (en) * 2003-01-22 2004-07-22 Applied Materials, Inc. Rate monitor for wet wafer cleaning
JP2007313439A (ja) * 2006-05-26 2007-12-06 Hitachi High-Technologies Corp 樹脂塗布装置及び樹脂塗布方法
KR101130208B1 (ko) * 2009-11-26 2012-03-30 세메스 주식회사 처리액 토출 방법
JP5944132B2 (ja) * 2011-10-05 2016-07-05 株式会社Screenセミコンダクターソリューションズ 塗布方法および塗布装置
JP6352824B2 (ja) * 2015-01-23 2018-07-04 東芝メモリ株式会社 基板処理装置、制御プログラムおよび制御方法
JP6498006B2 (ja) * 2015-03-25 2019-04-10 株式会社Screenホールディングス 塗布方法
US9653367B2 (en) * 2015-06-29 2017-05-16 Globalfoundries Inc. Methods including a processing of wafers and spin coating tool
GB2545671B (en) * 2015-12-21 2019-06-12 Xaar Technology Ltd Droplet deposition apparatus and methods of driving thereof
WO2018213640A1 (en) * 2017-05-17 2018-11-22 Mariana Bertoni Systems and methods for controlling the morphology and porosity of printed reactive inks for high precision printing
US20190287793A1 (en) * 2018-03-19 2019-09-19 Tokyo Electron Limited System and Method for Tuning Thickness of Resist Films

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