JP2021174901A - Component crimping device and cleaning method of component crimping device - Google Patents

Abstract

To provide a component crimping device capable of improving productivity.SOLUTION: A component crimping device 100 includes: a bottom-receiving part 36 that supports a crimping target part of a circuit board 3 from below; a crimping tool 34 that crimps a component 5 to the crimping target part supported by the bottom-receiving part 36; a cleaning tool 71 that cleans the bottom-receiving part 36; a foreign matter removing unit 73 that removes foreign matters adhering to the cleaning tool 71; and a tool moving mechanism 72 that moves the cleaning tool 71. The foreign matter removing unit 73 is arranged below a support face 36a of the bottom-receiving part 36. The tool moving mechanism 72 is configured to perform alternately a cleaning operation to move the cleaning tool 71 along a longitudinal direction of the bottom-receiving part 36 while sliding over the support face 36a of the bottom-receiving part 36 and an evacuation operation to evacuate the cleaning tool 71 to an evacuation position below the support face 36a of the bottom-receiving part 36 where foreign matter is removed by the foreign matter removing unit 73.SELECTED DRAWING: Figure 5

Description

The present disclosure relates to a component crimping device for crimping components to a substrate and the like.

Conventionally, a component crimping device for crimping an electronic component (hereinafter, simply referred to as a “component”) to a panel such as a liquid crystal panel has been provided (see Patent Documents 1 and 2). This component crimping device crimps components to the edges of a liquid crystal panel via an ACF (Anisotropic Conductive Film), which is an anisotropic conductive member. That is, ACF is attached to the end of the liquid crystal panel as an adhesive member. The component crimping device mounts the component on the portion of the liquid crystal panel to which the ACF is attached and crimps the component to the liquid crystal panel.

Japanese Patent No. 4773209 Japanese Unexamined Patent Publication No. 2008-85147

However, the component crimping devices of Patent Documents 1 and 2 have a problem that productivity may decrease.

Therefore, in the present disclosure, a component crimping device and the like capable of improving productivity are provided.

The component crimping device according to the first aspect of the present disclosure includes a long lower receiving portion that supports a crimping target portion, which is a predetermined portion of the substrate, from below, and the lower receiving portion that is supported by the lower receiving portion. A crimping tool for crimping a part to a crimping target portion, a cleaning tool for cleaning the lower receiving portion, a foreign matter removing portion for removing foreign matter adhering to the cleaning tool, and a tool moving for moving the cleaning tool. The foreign matter removing portion includes a mechanism, and the foreign matter removing portion is arranged below the support surface that supports the crimping target portion in the lower receiving portion, and the tool moving mechanism makes the cleaning tool the supporting surface of the lower receiving portion. The cleaning operation of moving the lower receiving portion along the longitudinal direction while rubbing against the surface, and the removal of the foreign matter by the foreign matter removing portion at a position below the supporting surface of the lower receiving portion. The evacuation operation of retracting the cleaning tool to the evacuation position, which is the position, is alternately performed.

It should be noted that these comprehensive or specific embodiments may be realized in a recording medium such as a system, method, integrated circuit, computer program or computer-readable CD-ROM, and the system, method, integrated circuit, computer program. And may be realized by any combination of recording media. Further, the recording medium may be a non-temporary recording medium.

The component crimping device of the present disclosure can improve productivity.

Further advantages and effects in one aspect of the present disclosure will be apparent from the specification and drawings. Such advantages and / or effects are provided by some embodiments and features described herein and drawings, respectively, but not all are provided to obtain one or more identical features. No need.

FIG. 1 is a diagram showing a schematic configuration of a component mounting line according to an embodiment. FIG. 2 is a plan view of the component mounting line according to the embodiment. FIG. 3 is a diagram showing a computer and each component controlled by the computer provided in the component mounting line according to the embodiment. FIG. 4 is a block diagram showing a functional configuration of the component crimping device according to the embodiment. FIG. 5 is a diagram specifically showing a cleaning mechanism according to the embodiment. FIG. 6 is a diagram showing a configuration of a first foreign matter removing portion according to the embodiment. FIG. 7 is a diagram showing a state in which parts are crimped when the cleaning tool according to the embodiment is retracted. FIG. 8 is a flowchart showing a processing operation of the component crimping device according to the embodiment. FIG. 9A is a diagram showing an example of cleaning the lower receiving portion by the cleaning mechanism in the embodiment in chronological order. FIG. 9B is a diagram showing another example of cleaning the lower receiving portion by the cleaning mechanism in the embodiment in chronological order. FIG. 10 is a diagram showing the removal of foreign matter by the first foreign matter removing portion in the embodiment. FIG. 11 is a diagram showing an example of the shape of the cleaning tool according to the embodiment. FIG. 12 is a plan view of a component mounting line according to a modified example of the embodiment.

(Knowledge on which this disclosure was based)
The present inventor has found that the following problems occur with respect to the component crimping apparatus of Patent Documents 1 and 2 described in the column of "Background Art".

A backup unit and a crimping element are used for crimping parts to a panel such as a liquid crystal panel or an organic EL (electro-luminescence) panel as in the part crimping device of Patent Document 1. The backup unit, also called the backup stage, supports the edge of the panel from below. The crimping tool, also called a crimping tool, crimps the part to the edge of the panel supported by the backup stage via the ACF.

Here, particles of each member may adhere to the backup stage as foreign matter. Examples of the foreign matter include glass fragments of liquid crystal panels or fragments of ACF. The adhesion of such foreign matter greatly affects the quality of the product produced by crimping the component to the panel.

Therefore, the component crimping device of Patent Document 1 includes a brush for cleaning, and moves the brush along the longitudinal direction of the backup stage. As a result, foreign matter adhering to the backup stage is removed. In addition, the component crimping device includes a suction unit that sucks foreign matter discharged by the brush. However, since the suction portion of this component crimping device is located at a position away from the brush, it is difficult to sufficiently remove the foreign matter adhering to the brush even if the foreign matter discharged by the brush is sucked.

The component crimping device (specifically, an electronic component crimping device) of Patent Document 2 includes a rotating brush, and cleans the backup stage with the rotating brush. As a result, foreign matter adhering to the backup stage is scraped out. Further, the component crimping device includes a suction portion for sucking foreign matter scraped by a rotating brush. However, since the suction portion of this component crimping device is also located at a position away from the rotating brush as in Patent Document 1, even if the foreign matter scraped by the rotating brush is sucked, the foreign matter adhering to the rotating brush is removed. It is difficult to remove it sufficiently.

Therefore, in the component crimping devices of Patent Documents 1 and 2, it is difficult to sufficiently remove the foreign matter adhering to the brush or the rotating brush, and for example, the foreign matter may reattach to the backup stage. As a result, the component crimping devices of Patent Documents 1 and 2 cannot remove foreign substances, and it is difficult to sufficiently improve the quality of the product. That is, it is difficult to improve the yield. As a result, productivity may decrease.

In order to solve such a problem, the component crimping device according to one aspect of the present disclosure includes a long lower receiving portion that supports a crimping target portion, which is a predetermined portion of the substrate, from below, and the lower portion. A crimping tool for crimping a part to the crimping target portion supported by the receiving portion, a cleaning tool for cleaning the lower receiving portion, and a foreign matter removing portion for removing foreign matter adhering to the cleaning tool. The cleaning tool is provided with a tool moving mechanism for moving the cleaning tool, the foreign matter removing portion is arranged below the support surface supporting the crimping target portion in the lower receiving portion, and the tool moving mechanism moves the cleaning tool. A cleaning operation of moving the lower receiving portion along the longitudinal direction while rubbing against the supporting surface of the lower receiving portion, and a position below the supporting surface of the lower receiving portion of the foreign matter removing portion. The cleaning tool is retracted to the retracted position, which is the position where the foreign matter is removed.

As a result, the cleaning operation and the evacuation operation are performed separately. Therefore, during the evacuation operation, the cleaning tool is retracted to a retracted position close to the foreign matter removing portion, and the foreign matter adhering to the cleaning tool is sufficiently removed by the foreign matter removing portion. Can be removed. As a result, it is possible to prevent foreign matter adhering to the cleaning tool from adhering to the lower receiving portion again. Therefore, it is possible to effectively clean the lower receiving portion and remove the foreign matter adhering to the cleaning tool. As a result, deterioration of the quality of the product produced by crimping the component to the substrate such as the liquid crystal panel can be sufficiently suppressed. That is, the yield can be improved and the productivity can be improved. Further, since the foreign matter removing portion is arranged below the support surface of the lower receiving portion, interference between the substrate supported by the lower receiving portion and the foreign matter removing portion can be suppressed.

Further, in the retracting operation, the tool moving mechanism retracts the cleaning tool to the retracted position to support the substrate supported by the lower receiving portion and the cleaning tool retracted to the retracted position. May be separated from each other. For example, the substrate and the cleaning tool are separated in the vertical direction, that is, in the direction perpendicular to the support surface.

As a result, it is possible to suppress the interference between the retracted cleaning tool and the substrate, and it is possible to suppress the interruption of work and the deterioration of the quality of the above-mentioned product due to the interference.

Further, the crimping tool may crimp the component to the crimping target portion of the substrate supported by the lower receiving portion when the cleaning tool is retracted to the retracted position.

As a result, the crimping of the component to the substrate and the removal of the foreign matter of the cleaning tool can be performed in parallel. As a result, the efficiency of crimping work of parts can be improved, and the productivity can be further improved.

Further, the foreign matter removing portion includes a first foreign matter removing portion and a second foreign matter removing portion for removing foreign matter adhering to the cleaning tool, respectively, and the first foreign matter removing portion and the second foreign matter removing portion are , The lower receiving portion may be arranged on both ends in the longitudinal direction.

As a result, when the cleaning tool moves from one end side to the other end side in the longitudinal direction of the lower receiving portion in the cleaning operation, either the first foreign matter removing portion or the second foreign matter removing portion is placed on the other end side. Since one of them is arranged, it is possible to remove the foreign matter of the cleaning tool without returning the cleaning tool to one end side. On the contrary, when the cleaning tool moves from the other end side to the one end side as described above, the foreign matter of the cleaning tool can be removed without returning the cleaning tool to the other end side as described above. That is, it is possible to remove the foreign matter adhering to the cleaning tool without reciprocating the cleaning tool along the longitudinal direction of the lower receiving portion. As a result, the throughput can be improved.

Hereinafter, embodiments will be specifically described with reference to the drawings.

It should be noted that all of the embodiments described below show comprehensive or specific examples. Numerical values, shapes, materials, components, arrangement positions and connection forms of components, steps, order of steps, etc. shown in the following embodiments are examples, and are not intended to limit the present disclosure. Further, among the components in the following embodiments, the components not described in the independent claims indicating the highest level concept are described as arbitrary components. Further, each figure is a schematic view and is not necessarily exactly illustrated. Further, in each figure, the same components are designated by the same reference numerals.

(Embodiment)
[Outline configuration of component mounting line]
FIG. 1 is a diagram showing a schematic configuration of a component mounting line according to the present embodiment.

The component mounting line 1 in the present embodiment is a system for producing a product such as a liquid crystal display by mounting the component 5 on a substrate 3 such as a liquid crystal panel. The component 5 is an electronic component such as a drive circuit. Specifically, as shown in FIG. 1, the component mounting line 1 includes a substrate carry-in portion 10, a sticking portion 20, a temporary crimping portion 30, a main crimping portion 40, and a substrate carry-out portion 50. The substrate carry-in portion 10, the sticking portion 20, the temporary crimping portion 30, the main crimping portion 40, and the substrate carry-out portion 50 are connected in this order.

The board loading unit 10 receives the rectangular board 3 carried in from the operator or another device on the upstream side. Then, the substrate 3 is carried out to the attachment portion 20 on the downstream side.

The attachment portion 20 receives the substrate 3 carried out from the substrate carry-in portion 10, and attaches an adhesive member to each of the plurality of electrode portions 4 on the peripheral edge of the substrate 3. Then, the substrate 3 to which the adhesive member is attached is carried out to the temporary crimping portion 30. Each of the plurality of electrode portions 4 is composed of, for example, a plurality of electrodes.

The temporary crimping portion 30 receives the substrate 3 carried out from the sticking portion 20, and mounts the component 5 on the portion where the adhesive member of the substrate 3 is attached and temporarily crimps the substrate 3. Then, the substrate 3 on which the component 5 is temporarily crimped is carried out to the main crimping portion 40.

The main crimping portion 40 receives the substrate 3 carried out from the temporary crimping portion 30, and performs main crimping (also referred to as thermocompression bonding) on the component 5 temporarily crimped to the substrate 3. Then, the substrate 3 to which the main crimping has been performed is carried out to the board carrying-out portion 50.

The substrate carry-out portion 50 receives the substrate 3 carried out from the main crimping portion 40. The substrate 3 received by the substrate carry-out unit 50 is carried out to the downstream side.

In this way, the component mounting line 1 executes the component mounting work of mounting the component 5 on each of the plurality of electrode portions 4 provided on the peripheral edge of the carried-in substrate 3, and mounts the substrate 3 on which the component 5 is mounted. It is carried out from the board carry-out unit 50.

[Detailed configuration of component mounting line]
FIG. 2 is a plan view of the component mounting line 1 according to the present embodiment. Specifically, FIG. 1 shows a configuration in which the component mounting line 1 is viewed from above. In the present embodiment, the transport direction of the substrate is referred to as the X-axis direction, the vertical direction is referred to as the Z-axis direction, and the direction perpendicular to the X-axis direction and the Z-axis direction, that is, the depth direction is referred to as the Y-axis direction. Further, the negative side and the positive side in the X-axis direction correspond to the upstream side and the downstream side in the transport direction of the substrate, respectively, and the negative side and the positive side in the Z-axis direction correspond to the lower side and the upper side in the vertical direction, respectively. , The negative side and the positive side in the Y-axis direction correspond to the front side and the back side in the depth direction, or the front side and the rear side, respectively.

The board loading section 10 includes a base 1a on which the board 3 to be loaded is placed. A stage 11 on which the substrate 3 is placed is provided on the base 1a of the substrate loading portion 10. The stage 11 moves up and down in the Z-axis direction with respect to the base 1a. Further, a plurality of suction holes 11a are provided on the upper surface of the stage 11. Such a stage 11 holds the substrate 3 carried in from an operator or another device on the upstream side and placed on the stage 11 by vacuum suction from the suction hole 11a by a suction device such as a pump (not shown). ..

The sticking portion 20 has a function of performing a sticking operation (in other words, a sticking step) of sticking ACF, which is an adhesive member, to the electrode portion 4 of the substrate 3. The sticking portion 20 includes a substrate moving mechanism 21 and a sticking mechanism 22.

The board moving mechanism 21 is a mechanism for moving the board 3. The substrate moving mechanism 21 includes, for example, an X-axis table movable in the X-axis direction, a Y-axis table movable in the Y-axis direction, a Z-axis table movable in the Z-axis direction, and a stage 23. The substrate moving mechanism 21 is provided with an X-axis table, a Y-axis table, a Z-axis table, and a stage 23 stacked on the base 1b in this order from the bottom.

The Y-axis table is provided so as to extend in the Y-axis direction, and freely moves on the X-axis table in the X-axis direction. The Z-axis table freely moves on the Y-axis table in the Y-axis direction, and the stage 23 provided on the upper part is moved up and down in the Z-axis direction and rotated around the Z-axis.

Further, a plurality of suction holes 23a are provided on the upper surface of the stage 23, and the stage 23 vacuum sucks and holds the substrate 3 placed on the upper surface thereof. In this way, the substrate moving mechanism 21 attracts and holds the substrate 3 and moves the substrate 3 in the horizontal plane (specifically, the X-axis direction and the Y-axis direction) in the vertical direction (specifically, the Z-axis direction). Raise and lower and rotate around the Z axis.

The sticking mechanism 22 includes, for example, two sticking heads arranged in the X-axis direction above the base 1b. Each sticking head includes a supply unit for supplying ACF and a sticking tool for sticking ACF to the substrate 3. ACF is attached to each of the two attachment heads at positions corresponding to the plurality of electrode portions 4 on the substrate 3. Further, a sticking support base is provided at a lower position corresponding to each of the two sticking heads.

The temporary crimping portion 30 executes a temporary crimping step in which the component 5 is mounted on the region where the ACF of the substrate 3 is attached (that is, the crimping target portion) and temporarily crimped. The temporary crimping portion 30 includes a substrate moving mechanism 31, a component mounting mechanism 32, a component supply unit 33, a component transfer unit 35a, and a cleaning mechanism 70.

The substrate moving mechanism 31 has the same structure as the substrate moving mechanism 21 of the sticking portion 20. Specifically, the substrate moving mechanism 31 has a stage 37 that holds the substrate 3. A plurality of suction holes 37a are provided on the upper surface of the stage 37. The substrate moving mechanism 31 vacuum-sucks and holds the substrate 3 mounted on the stage 37 by the plurality of suction holes 37a. Further, the substrate moving mechanism 31 has a function of moving the stage 37 that attracts and holds the substrate 3 in a horizontal plane, raises and lowers it in the vertical direction, and rotates it around the Z axis. The substrate moving mechanism 31 positions the region to which the ACF of the substrate 3 attracted and held is attached above the lower receiving portion 36 which is the backup stage of the component mounting mechanism 32 by the movement and rotation of the stage 37. ..

The component supply unit 33 is provided on the back side (that is, the positive side in the Y-axis direction) of the component mounting mechanism 32 so as to project from the rear portion of the base 1b. For example, the component supply unit 33 includes a supply reel 33a around which a strip-shaped component storage body such as TCP (Tape carrier package) is wound, a punching unit 33b, a movable stage 33c, and a rail 33d. Such a component supply unit 33 sequentially supplies the component 5 from the strip-shaped component accommodating body by the movement of those components.

The component transfer unit 35a moves the component 5 supplied from the component supply unit 33 to the crimping tool 34 side included in the component mounting mechanism 32.

The component mounting mechanism 32 is provided on the base 1b and includes a crimping tool 34 and a lower receiving portion 36.

The lower receiving portion 36 is a member formed in a long shape, and supports a crimping target portion, which is a predetermined portion of the substrate 3 held on the stage 37, from below. The crimping target portion is a portion on the substrate 3 to which the ACF is attached.

The crimping tool 34 holds the component 5 and crimps the component 5 to the crimp target portion supported by the lower receiving portion 36. Specifically, the crimping tool 34 moves up and down in the Z-axis direction, and sucks (that is, picks up) the component 5 moved by the component transfer unit 35a from above. Then, the crimping tool 34 temporarily crimps the component 5 to the substrate 3 by mounting the adsorbed component 5 on the ACF and pressing the component 5 together with the substrate 3 against the lower receiving portion 36. The temporary crimping portion 30 may include a mechanism for rotating the direction of the substrate 3 held by the substrate moving mechanism 31 by 90 degrees.

The cleaning mechanism 70 cleans the component mounting mechanism 32. Specifically, the cleaning unit 70 cleans the lower receiving unit 36 included in the component mounting mechanism 32.

The main crimping portion 40 executes a main crimping step (that is, a thermocompression bonding step) of main crimping (that is, thermocompression bonding) the component 5 temporarily crimped to the substrate 3 by the temporary crimping portion 30 to the substrate 3. By doing so, the electrode portion 4 formed on the substrate 3 and the component 5 are electrically connected via the ACF. Such a crimping portion 40 includes a substrate moving mechanism 41 and a crimping mechanism 42.

The substrate moving mechanism 41 has the same structure as the substrate moving mechanism 21 of the sticking portion 20. Specifically, the substrate moving mechanism 41 has a stage 49. A plurality of suction holes 49a are provided on the upper surface of the stage 49. The substrate moving mechanism 41 vacuum-sucks and holds the substrate 3 mounted on the stage 49 by its plurality of suction holes 49a. Further, the substrate moving mechanism 41 has a function of moving the stage 49 that attracts and holds the substrate 3 in a horizontal plane, raises and lowers it in the vertical direction, and rotates it around the Z axis. The substrate moving mechanism 41 positions the region where the component 5 of the substrate 3 which is attracted and held is temporarily crimped by the movement and rotation of the stage 49 above the crimping support portion of the crimping mechanism 42.

The crimping mechanism 42 presses the component 5 of the substrate 3 toward the crimping support portion side with the heated head. As a result, the component 5 is finally crimped, and the electrode portion 4 formed on the substrate 3 and the component 5 are electrically connected via the ACF.

The substrate carry-out portion 50 has a function of vacuum-sucking and holding the substrate 3 conveyed from the main crimping portion 40 on the stage 51. The substrate 3 held by the substrate carry-out unit 50 is carried out to another device on the downstream side, or is taken out from the stage 51 by an operator.

The stage 51 moves up and down in the Z-axis direction with respect to the base 1c. Further, a plurality of suction holes 51a are provided on the upper surface of the stage 51, and the stage 51 vacuum sucks and holds the substrate 3 transferred from the main crimping portion 40 on the upper surface thereof.

The transport unit 60 is a device that transports the substrate 3. Specifically, the transport unit 60 delivers the substrate 3 carried into the substrate carry-in portion 10 to the sticking portion 20, the temporary crimping portion 30, the main crimping portion 40, and the substrate carry-out portion 50 in this order (transfer). It has a function. The transport portion 60 is arranged in the front region (that is, the negative side in the Y-axis direction) of the sticking portion 20, the temporary crimping portion 30, and the main crimping portion 40.

The transfer unit 60 is arranged in order from the upstream side on the base 1a, the base 1b, and the moving base 61 extending in the X-axis direction over the base 1c. It includes a substrate transfer mechanism 62C and a substrate transfer mechanism 62D.

The substrate transport mechanisms 62A to 62D include a base 63 and one or more arm units 64, respectively. In this embodiment, the case where the substrate transport mechanisms 62A to 62D each include two arm units 64 is illustrated.

The base 63 is provided on the moving base 61 and freely moves in the X-axis direction. Two arm units 64 are provided side by side in the X-axis direction on the base portion 63. The arm unit 64 vacuum-sucks the substrate 3 from above.

Each of the substrate transport mechanisms 62A to 62D moves the substrate 3 held by the stages 11, 23, 37, 49, 51 to the substrate transfer position where the substrate 3 is vacuum-sucked from above, and moves up and down the stages 11, 23, 37, 49, respectively. Receive or deliver the substrate 3 from 51. For example, the substrate transfer mechanism 62A receives the substrate 3 mounted on the stage 11 of the substrate carry-in portion 10 and delivers it to the stage 23 of the attachment portion 20. Further, for example, the substrate transport mechanism 62B receives the substrate 3 from the stage 23 of the sticking portion 20 and delivers it to the stage 37 of the temporary crimping portion 30. Further, for example, the substrate transfer mechanism 62C receives the substrate 3 from the stage 37 of the temporary crimping portion 30 and delivers it to the stage 49 of the main crimping portion 40. Further, for example, the substrate transfer mechanism 62D receives the substrate 3 from the stage 49 of the main crimping portion 40 and delivers it to the stage 51 of the substrate carry-out portion 50.

FIG. 3 is a diagram showing a computer provided in the component mounting line 1 and each component controlled by the computer.

The component mounting line 1 includes a computer 2 as shown in FIG. The computer 2 is communicably connected to, for example, a sticking portion 20, a temporary crimping portion 30, a main crimping portion 40, a transport portion 60, and the like by, for example, a control line, and controls each of these portions. The computer 2 includes a control unit 2a and a storage unit 2b.

The storage unit 2b contains various data necessary for component mounting work such as the size of the board 3, the type of the component 5 mounted on the board 3, the mounting position, the mounting direction, and the timing of transferring the board 3, and the control unit 2a. Stores the control program etc. executed by. The storage unit 2b is realized by a ROM (Read Only Memory), a RAM (Random Access Memory), or the like.

The control unit 2a controls the substrate moving mechanism 21 of the sticking portion 20, the substrate moving mechanism 31 of the temporary crimping portion 30, the substrate moving mechanism 41 of the main crimping portion 40, and the transporting portion 60, and transfers the substrate 3 between the respective parts. Execute the substrate transfer work to transfer to the next process. The transfer of the substrate 3 from the upstream side to the downstream side in the substrate transfer work is performed synchronously between the respective parts.

For example, the control unit 2a changes the orientation and position of the substrate 3 held by the substrate moving mechanism 21 by controlling the sticking unit 20, and changes the spacing between the plurality of sticking heads by the head moving motor. The sticking unit 20 is made to perform the sticking operation of sticking the ACF to the substrate 3 by the sticking mechanism 22.

Further, for example, the control unit 2a changes the orientation and position of the substrate 3 held by the substrate moving mechanism 31 by controlling the temporary crimping portion 30, and temporarily crimps the component 5 to the substrate 3 by the component mounting mechanism. Let 32 execute. Further, the control unit 2a moves the component 5 temporarily crimped to the substrate 3 to the component mounting mechanism 32 side by controlling the component supply unit 33 and the component transfer unit 35a. Further, the control unit 2a controls the cleaning mechanism 70 to cause the cleaning mechanism 70 to clean the lower receiving portion 36 of the component mounting mechanism 32.

Further, for example, the control unit 2a changes the orientation and position of the substrate 3 held by the substrate moving mechanism 41 by controlling the main crimping portion 40, and the component 5 temporarily crimped to the substrate 3 is transferred to the crimping mechanism 42. This is crimped.

Such a control unit 2a is, for example, a control program stored in the storage unit 2b for controlling each unit and each mechanism of the component mounting line 1, and a CPU (Central Processing Unit) that executes the control program. It is realized by such a processor.

[Structure of parts crimping device]
FIG. 4 is a block diagram showing a functional configuration of the component crimping device 100 according to the present embodiment.

The component crimping device 100 includes a temporary crimping portion 30 in the component mounting line 1 and a control unit 2a of the computer 2.

Specifically, the component crimping device 100 includes a control unit 2a, a component supply unit 33, a component transfer unit 35a, a cleaning mechanism 70, a crimping tool 34, a lower receiving unit 36, a stage 37, and a camera 39. And.

The control unit 2a controls the component supply unit 33, the component transfer unit 35a, the cleaning mechanism 70, the crimping tool 34, the stage 37, and the camera 39.

The camera 39 photographs the component 5 held by the crimping tool 34 from the lower side (that is, the negative side in the Z-axis direction), for example, based on the control by the control unit 2a. The control unit 2a determines whether or not the component 5 is a defective product based on the image of the component 5 photographed in this way.

The cleaning mechanism 70 includes a cleaning tool 71, a tool moving mechanism 72, and a foreign matter removing unit 73. The cleaning tool 71 is, for example, a brush. The tool moving mechanism 72 is a mechanism for moving the cleaning tool 71. The foreign matter removing unit 73 removes foreign matter adhering to the cleaning tool 71. For example, the foreign matter removing unit 72 removes the foreign matter by suction. The tool moving mechanism 72 and the foreign matter removing unit 73 of the cleaning mechanism 70 move the cleaning tool 71 to clean the lower receiving portion 36 based on the control by the control unit 2a, and remove the foreign matter adhering to the cleaning tool 71 by the cleaning. Remove. For example, the control unit 2a periodically executes cleaning by the cleaning mechanism 70. Specifically, the control unit 2a cleans the lower receiving portion 36 every time the substrate 3 is carried into the temporary crimping portion 30 before the substrate 3 is supported by the lower receiving portion 36. To execute. Alternatively, the control unit 2a may have the cleaning mechanism 70 perform cleaning of the component 5 each time the temporary crimping of the component 5 to the N sheets (N is an integer of 2 or more) is completed. As a result, for example, it is possible to save the trouble of manually stopping the operation of the component crimping device 100 and manually cleaning the lower receiving portion 36. That is, cleaning can be performed during production, and the component crimping device 100 can be continuously operated.

[Cleaning mechanism]
FIG. 5 is a diagram specifically showing the cleaning mechanism 70. Note that FIG. 5A shows a state in which the cleaning mechanism 70 and the lower receiving portion 36 are viewed from above, and FIG. 5B shows a state in which the cleaning mechanism 70 and the lower receiving portion 36 are viewed from the front side. Is shown.

As described above, the cleaning mechanism 70 in the present embodiment includes a cleaning tool 71, a tool moving mechanism 72, and a foreign matter removing unit 73.

The cleaning tool 71 is a tool for cleaning the lower receiving portion 36, and is, for example, a cylindrical brush as shown in FIGS. 5A and 5B.

The foreign matter removing unit 73 removes foreign matter adhering to the cleaning tool 71 by, for example, suction. Further, the foreign matter removing portion 73 in the present embodiment includes a first foreign matter removing portion 73a and a second foreign matter removing portion 73b for removing foreign matter adhering to the cleaning tool 71, respectively. For example, the first foreign matter removing unit 73a and the second foreign matter removing unit 73b each have the same configuration. Further, as shown in FIG. 5B, the foreign matter removing portion 73 is arranged below the support surface 36a of the lower receiving portion 36, that is, the surface that supports the above-mentioned crimping target portion. Further, the first foreign matter removing portion 73a and the second foreign matter removing portion 73a are arranged so as to sandwich the lower receiving portion 36 along the longitudinal direction of the lower receiving portion 36. That is, the first foreign matter removing portion 73a and the second foreign matter removing portion 73b are arranged on both ends in the longitudinal direction of the lower receiving portion 36, respectively. In the present embodiment, the longitudinal direction of the lower receiving portion 36 is the X-axis direction.

Here, a suction hole h is formed on the upper surface of each of the first foreign matter removing portion 73a and the second foreign matter removing portion 73a on the positive side in the Z-axis direction. Each of the first foreign matter removing portion 73a and the second foreign matter removing portion 73a is connected to, for example, a suction pump, and the suction pump sucks air from the suction hole h around the opening of the suction hole h. .. That is, each of the first foreign matter removing portion 73a and the second foreign matter removing portion 73a sucks the foreign matter adhering to the cleaning tool 71 when the cleaning tool 71 is arranged near the opening of the suction hole h. Removes foreign matter from the cleaning tool 71.

The tool moving mechanism 72 is a mechanism for moving the cleaning tool 71, and alternately performs a cleaning operation and a retracting operation. The cleaning operation is an operation of moving the cleaning tool 71 along the longitudinal direction of the lower receiving portion 36 while rubbing it against the support surface 36a of the lower receiving portion 36. Further, the retracting operation is an operation of retracting the cleaning tool 71 to a retracting position which is a position below the support surface 36a of the lower receiving portion 36 and is a position where the foreign matter is removed by the foreign matter removing portion 73. Here, the retracted position is a position near the opening of each suction hole h of the first foreign matter removing portion 73a and the second foreign matter removing portion 73a.

Specifically, the tool moving mechanism 72 includes a tool driving unit 72a and a tool holding unit 72b. As shown in FIG. 5A, the tool holding portion 72b is formed in a substantially L shape when viewed from the positive side in the Z-axis direction, and holds the cleaning tool 71 in a state of being along the Y-axis direction. do. That is, one end of the cleaning tool 71 is fixed to one end side of the tool holding portion 72b. Further, the other end side of the tool holding portion 72b is movably attached to the tool moving mechanism 72.

The tool driving unit 72a includes an actuator such as a motor, and moves the tool holding unit 72b in the X-axis direction and the Z-axis direction. That is, the tool driving unit 72a pulls out the other end side of the tool holding unit 72b to the positive side in the X-axis direction, or conversely pulls it to the negative side. Further, as shown in FIG. 5B, the tool driving unit 72a moves the tool holding unit b to the positive side in the Z-axis direction, or conversely to the negative side. Due to the movement of the tool holding portion 72b by the tool driving portion 72a, the cleaning tool 71 moves along the longitudinal direction of the lower receiving portion 36 while rubbing against the support surface 36a of the lower receiving portion 36, and retracts to the above-mentioned retracted position. do.

FIG. 6 is a diagram showing the configuration of the first foreign matter removing unit 73a. Note that FIG. 6A shows a state in which the first foreign matter removing portion 73a is viewed from above, and FIG. 6B shows a cross section of the first foreign matter removing portion 73a on the XZ plane.

A recess j having a substantially rectangular opening is formed on the upper surface of the first foreign matter removing portion 73a, and the suction hole h described above is formed in the center of the bottom surface of the recess j. Further, the opening of the suction hole h on the positive side in the Z-axis direction is formed wider toward the positive side. For example, the cleaning tool 71 is arranged by the tool moving mechanism 72 at a retracted position, which is a position near the opening of the suction hole h. That is, the cleaning tool 71 retracts to the retracted position. At this time, the bristles of the cleaning tool 71 in the retracted position may be in contact with the first foreign matter removing portion 73a or may be separated from the first foreign matter removing portion 73a.

Then, when the cleaning tool 71 is retracted to the retracted position, the first foreign matter removing unit 73a removes the foreign matter adhering to the cleaning tool 71 by suction.

The second foreign matter removing portion 73b also has the same configuration as the first foreign matter removing portion 73a. Then, when the cleaning tool 71 is retracted to a retracted position near the opening of the suction hole h of the second foreign matter removing portion 73b, the second foreign matter removing portion 73b is attached to the cleaning tool 71. Is removed by suction.

FIG. 7 is a diagram showing a state in which the component 5 is crimped while the cleaning tool 71 is retracted. Note that FIG. 7 shows a state in which the substrate 3, the component 5, the crimping tool 34, the lower receiving portion 36, and the cleaning mechanism 70 are viewed from the front side.

As shown in FIG. 7, the crimping tool 34 crimps the component 5 to the crimping target portion of the substrate 3 supported by the lower receiving portion 36 when the cleaning tool 71 is retracted to the retracted position. The evacuation position is the evacuation position on the first foreign matter removing portion 73a side or the evacuation position on the second foreign matter removing portion 73b side. Therefore, in the component crimping device 100 according to the present embodiment, the crimping of the component 5 to the substrate 3 and the removal of the foreign matter of the cleaning tool 71 can be performed in parallel. As a result, the efficiency of the crimping work of the component 5 can be improved, and the productivity can be further improved. Further, as shown in FIG. 7, in the retracting operation, the tool moving mechanism 72 retracts the cleaning tool 71 to the retracted position, thereby retracting the cleaning tool 71 to the substrate 3 supported by the lower receiving portion 36 and the retracted position. Separate from the cleaning tool 71. For example, the substrate 3 and the cleaning tool 71 are separated from each other in the vertical direction, that is, in the direction perpendicular to the support surface 36a. Therefore, in the component crimping device 100 of the present embodiment, it is possible to suppress the interference between the retracted cleaning tool 71 and the substrate 3, and it is possible to suppress the interruption of work and the deterioration of product quality due to the interference.

Further, as shown in FIG. 7, in the present embodiment, the foreign matter removing portion 73, that is, the first foreign matter removing portion 73a and the second foreign matter removing portion 73b are arranged below the support surface 36a of the lower receiving portion 36. ing. Therefore, it is possible to suppress the interference between the substrate 3 supported by the lower receiving portion 36 and the foreign matter removing portion 73.

FIG. 8 is a flowchart showing a processing operation of the component crimping device 100 according to the present embodiment.

First, the tool moving mechanism 72 of the cleaning mechanism 70 moves the cleaning tool 71 from the retracted position, and the cleaning tool 71 cleans the support surface 36a of the lower receiving portion 36 (step S11). That is, the tool moving mechanism 72 performs a cleaning operation of moving the cleaning tool 71 along the longitudinal direction of the lower receiving portion 36 while rubbing the cleaning tool 71 against the support surface 36a of the lower receiving portion 36. The process in which such a cleaning operation is performed is also called a cleaning process.

Next, the tool moving mechanism 72 moves the cleaning tool 71 to the retracted position (step S14). That is, the tool moving mechanism 72 performs a retracting operation of retracting the cleaning tool 71 to a retracted position below the support surface 36a of the lower receiving portion 36. The step in which such a retracting operation is performed is also called a retracting step. When the cleaning tool 71 retracts to the retracted position, the foreign matter removing unit 73 starts suction. As a result, the foreign matter removing unit 73 removes the foreign matter adhering to the cleaning tool 71 (step S13). That is, in step S13, the foreign matter removing step of removing the foreign matter adhering to the cleaning tool 71 retracted to the retracted position is performed by the foreign matter removing unit 73.

Further, when the cleaning tool 71 is retracted to the retracted position and the foreign matter of the cleaning tool 71 is removed by the foreign matter removing unit 73, the above-mentioned temporary crimping step is executed. That is, the control unit 2a of the component crimping device 100 moves the stage 37 so that the crimp target portion of the substrate 3 held by the stage 37 is supported by the lower receiving portion 36 from below (step S14). Then, the crimping tool 34 holds the component 5 and crimps the component 5 to the crimp target portion of the substrate 3 (step S15). When the crimping of the component 5 is completed, the control unit 2a of the component crimping device 100 releases the support of the substrate 3 by the lower receiving portion 36 by moving the stage 37 again (step S16). That is, the substrate 3 is separated from the lower receiving portion 36.

Then, the control unit 2a of the component crimping device 100 determines whether or not there is another substrate 3 to which the component 5 is to be crimped (step S17). Here, when the control unit 2a determines that there is another substrate 3 (Yes in step S17), the control unit 2a repeatedly executes the process from step S11. On the other hand, when the control unit 2a determines that there is no other substrate 3 (No in step S17), the control unit 2a ends the component crimping process.

As described above, the cleaning method of the component crimping device 100 in the present embodiment includes the cleaning step of step S11, the retracting step of step S12, and the foreign matter removing step of step S13. Further, in the cleaning method, the cleaning step, the evacuation step, and the foreign matter removing step are alternately performed.

As a result, the cleaning step, the retracting step, and the foreign matter removing step are performed separately. Therefore, during the retracting step and the foreign matter removing step, the cleaning tool 71 is retracted to a retracting position close to the foreign matter removing portion 73, and the cleaning tool is retracted. The foreign matter adhering to the 71 can be sufficiently removed by the foreign matter removing unit 73.

9A and 9B are diagrams showing an example of cleaning the lower receiving portion 36 by the cleaning mechanism 70 in chronological order. 9A and 9B show a state in which the cleaning tool 71 of the cleaning mechanism 70, the first foreign matter removing portion 73a and the second foreign matter removing portion 73b, and the lower receiving portion 36 are viewed from the front side.

First, as shown in FIG. 9A (a), the cleaning tool 71 is moved by the tool moving mechanism 72 and is arranged at the end on the support surface 36a of the lower receiving portion 36 on the positive side in the X-axis direction. Then, as shown in FIG. 9A (b), the cleaning tool 71 is moved toward the negative side in the X-axis direction by the tool moving mechanism 72. The negative direction in the X-axis direction is also hereinafter referred to as a first direction. At this time, the cleaning tool 71 moves while the bristles of the cleaning tool 71 rub against the support surface 36a. Then, as shown in FIG. 9A (c), the cleaning tool 71 is arranged at the end on the support surface 36a of the lower receiving portion 36 on the negative side in the X-axis direction. As a result, the entire support surface 36a of the lower receiving portion 36 is swept in the first direction, and foreign matter on the support surface 36a is discharged. However, the foreign matter may be attached to the cleaning tool 71.

Therefore, as shown in FIG. 9A (d), the cleaning tool 71 is moved to the negative side (that is, the lower side) in the Z-axis direction by the tool moving mechanism 72, and is retracted to the retracted position of the first foreign matter removing portion 73a. .. At this time, the first foreign matter removing unit 73a removes the foreign matter adhering to the cleaning tool 71 by performing suction. That is, the foreign matter is removed from the cleaning tool 71 and sucked into the suction hole h of the first foreign matter removing portion 73a. Further, when the cleaning tool 71 is retracted to the retracted position and the foreign matter of the cleaning tool 71 is removed by the first foreign matter removing portion 73a, the crimping target portion of the substrate 3 is supported by the lower receiving portion 36, and the crimping tool 34 crimps the component 5 to the crimping target portion.

Then, when the removal of the foreign matter of the cleaning tool 71 is completed and the substrate 3 supported by the lower receiving portion 36 is separated from the lower receiving portion 36, the cleaning tool 71 from which the foreign matter has been removed is shown in FIG. 9A (e). As shown in, the tool moving mechanism 72 moves to the positive side (that is, the upper side) in the Z-axis direction.

Next, the cleaning tool 71 cleans the lower receiving portion 36 by moving in the direction opposite to the first direction. That is, the cleaning tool 71 is first moved by the tool moving mechanism 72 as shown in FIG. 9B (a), and is arranged at the end on the support surface 36a of the lower receiving portion 36 on the negative side in the X-axis direction. Then, as shown in FIG. 9B (b), the cleaning tool 71 is moved toward the positive side in the X-axis direction by the tool moving mechanism 72. The positive direction in the X-axis direction is also hereinafter referred to as a second direction. At this time, the cleaning tool 71 moves while the bristles of the cleaning tool 71 rub against the support surface 36a. Then, as shown in FIG. 9B (c), the cleaning tool 71 is arranged at the end on the support surface 36a of the lower receiving portion 36 on the positive side in the X-axis direction. As a result, the entire support surface 36a of the lower receiving portion 36 is swept in the second direction, and the foreign matter on the support surface 36a is discharged. However, the foreign matter may be attached to the cleaning tool 71.

Therefore, as shown in FIG. 9B (d), the cleaning tool 71 is moved to the negative side (that is, the lower side) in the Z-axis direction by the tool moving mechanism 72, and is retracted to the retracted position of the second foreign matter removing portion 73b. .. At this time, the second foreign matter removing unit 73b removes the foreign matter adhering to the cleaning tool 71 by performing suction. That is, the foreign matter is removed from the cleaning tool 71 and sucked into the suction hole h of the second foreign matter removing portion 73b. Further, when the cleaning tool 71 is retracted to the retracted position and the foreign matter of the cleaning tool 71 is removed by the second foreign matter removing portion 73b, the crimping target portion of the substrate 3 is supported by the lower receiving portion 36, and the crimping tool 34 crimps the component 5 to the crimping target portion.

Then, when the removal of the foreign matter of the cleaning tool 71 is completed and the substrate 3 supported by the lower receiving portion 36 is separated from the lower receiving portion 36, the cleaning tool 71 from which the foreign matter has been removed is shown in FIG. 9B (e). As shown in, the tool moving mechanism 72 moves to the positive side (that is, the upper side) in the Z-axis direction.

As described above, in the present embodiment, the first foreign matter removing portion 73a and the second foreign matter removing portion 73b are arranged on both ends in the longitudinal direction of the lower receiving portion 36, respectively. As a result, when the cleaning tool 71 moves from the positive end to the negative end of the lower receiving portion 36 in the X-axis direction in the cleaning operation, the first foreign matter removing portion 73a is arranged at the negative end. ing. Therefore, foreign matter can be removed from the cleaning tool 71 without returning the cleaning tool 71 to the positive end. On the contrary, when the cleaning tool 71 moves from the negative end in the X-axis direction of the lower receiving portion 36 to the positive end, the cleaning tool 71 is cleaned without returning the cleaning tool 71 to the negative end as described above. The foreign matter of the tool 71 can be removed. That is, foreign matter adhering to the cleaning tool 71 can be removed without reciprocating the cleaning tool 71 along the longitudinal direction (that is, the X-axis direction) of the lower receiving portion 36. As a result, the throughput can be improved.

FIG. 10 is a diagram showing the removal of foreign matter by the first foreign matter removing unit 73a. Note that FIG. 10 shows a state in which the cleaning tool 71 is viewed from the front side, and also shows a cross section of the first foreign matter removing portion 73a in the XZ plane.

For example, as shown in FIG. 10A, the first foreign matter removing unit 73a removes the foreign matter adhering to the cleaning tool 71 by suction. At this time, the tool moving mechanism 72 may vibrate the cleaning tool 71 in the X-axis direction as shown in FIG. 10B. As a result, foreign matter adhering to the cleaning tool 71 can be removed more effectively. On the contrary, when the first foreign matter removing portion 73a is held so as to be movable in the X-axis direction, the first foreign matter removing portion 73a vibrates in the X-axis direction as shown in FIG. 10 (c). May be good. Thereby, as in the example shown in FIG. 10B, the foreign matter adhering to the cleaning tool 71 can be removed more effectively.

In the example shown in FIG. 10, either one of the cleaning tool 71 and the first foreign matter removing portion 73a vibrates, but both may vibrate. Further, the vibration directions of the cleaning tool 71 and the first foreign matter removing portion 73a are not limited to the X-axis direction, and may be the Y-axis direction or the Z-axis direction. Further, vibration may be performed in two or more directions. Further, in the case of the example shown in FIG. 10A, the cleaning tool 71 may rotate with the central axis along the Y-axis direction as the rotation axis. As a result, foreign matter adhering to the cleaning tool 71 can be removed more effectively.

FIG. 11 is a diagram showing an example of the shape of the cleaning tool 71 and the shape of another cleaning tool according to the present embodiment. Note that FIG. 11 shows a state in which the cleaning tool 71 and other cleaning tools are viewed from the front side.

As shown in FIG. 11A, the cleaning tool 71 has a shape in which a plurality of hairs radiate from the center in the XZ plane. However, the component crimping device 100 may include the cleaning tool 71a shown in FIG. 11B instead of the cleaning tool 71. The cleaning tool 71a has a plurality of hairs extending downward in the Z-axis direction, and does not have hairs extending upward in the Z-axis direction and hairs extending in the X-axis direction. Further, the component crimping device 100 may include the cleaning tool 71b shown in FIG. 11 (c) instead of the cleaning tool 71. The cleaning tool 71b has the shape of the lower half of the cleaning tool 71 shown in FIG. 11 (a) in the Z-axis direction. In the XZ plane, when the positive direction in the X-axis direction is 0 ° and the angle increasing clockwise from the positive direction is specified, the cleaning tool 71b is oriented in the range of 0 ° to 180 ° from the center. Has multiple hairs that extend.

Even if the cleaning tool 71a or the cleaning tool 71b is used instead of the cleaning tool 71, the same effects as described above can be obtained.

As described above, the component crimping device 100 according to the present embodiment includes a cleaning tool 71, a foreign matter removing portion 73, and a tool moving mechanism 72. Then, the tool moving mechanism 72 moves the cleaning tool 71 along the longitudinal direction of the lower receiving portion 36 while rubbing against the supporting surface 36a of the lower receiving portion 36, and from the supporting surface 36a of the lower receiving portion 36. The cleaning tool 71 is retracted to the retracted position, which is the lower position where the foreign matter is removed by the foreign matter removing unit 73, and the retracting operation is alternately performed.

As a result, the cleaning operation and the evacuation operation are performed separately. Therefore, during the evacuation operation, the cleaning tool 71 is retracted to a retracting position close to the foreign matter removing unit 73, and the foreign matter adhering to the cleaning tool 71 is removed from the foreign matter removing unit. It can be sufficiently removed by 73. As a result, it is possible to prevent foreign matter adhering to the cleaning tool 71 from adhering to the lower receiving portion 36 again. Therefore, it is possible to effectively clean the lower receiving portion 36 and remove the foreign matter adhering to the cleaning tool 71. As a result, deterioration of the quality of the product produced by crimping the component 5 to the substrate 3 such as the liquid crystal panel can be sufficiently suppressed. That is, the yield can be improved and the productivity can be improved.

(Modification example)
In the above embodiment, the component supply section 33 of the temporary crimping section 30 punches and supplies the component 5 from the strip-shaped component housing such as TCP, but the component 5 mounted on the tray may be supplied.

FIG. 12 is a plan view of the component mounting line 1 according to this modification. Specifically, FIG. 12 shows a configuration in which the component mounting line 1 is viewed from above.

Similar to the above embodiment, the component mounting line 1 according to this modification includes a board loading section 10, a sticking section 20, a main crimping section 40, a board unloading section 50, and a transport section 60, and further, a temporary crimping section. A temporary crimping portion 30A is provided instead of the 30. That is, the component crimping device 100 according to this modification is composed of a temporary crimping portion 30A and a control portion 2a of the computer 2.

The temporary crimping unit 30A includes a component supply unit 33H instead of the component supply unit 33 of the above embodiment.

Two tray sets are arranged along the X-axis direction in the component supply unit 33H. The tray set is composed of a plurality of trays 7, and these trays 7 are stacked along the Z-axis direction. Further, a plurality of parts 5 are placed on these trays 7 in a matrix, for example. The component supply unit 33H supplies a plurality of components 5 together with the tray 7.

The component transfer unit 35a in this modification moves the tray 7 on which the plurality of components 5 are placed, which is supplied from the component supply unit 33H, to the negative side in the Y-axis direction.

Further, the component mounting mechanism 32 in this modification includes a crimping tool 34, a component moving mechanism 35, and a lower receiving portion 36. The component moving mechanism 35 moves the crimping tool 34 in the X-axis direction and the Y-axis direction. Therefore, the crimping tool 34 is moved in the X-axis direction and the Y-axis direction by the component moving mechanism 35, and stops on the component 5 to be crimped mounted on the tray 7. After that, the crimping tool 34 descends and rises while sucking and holding the part 5 to be crimped. Then, the crimping tool 34 moves in the X-axis direction and the Y-axis direction by the component moving mechanism 35, and stops on the lower receiving portion 36. The crimping tool 34 descends and crimps the component 5 to the crimping target portion of the substrate 3 supported by the lower receiving portion 36.

The component crimping device 100 according to the present modification also includes a cleaning mechanism 70 similar to that of the above embodiment. Thereby, the same action and effect as those of the above-described embodiment can be obtained.

(Other variants)
The component crimping device according to one or more aspects has been described above based on the above-described embodiment and its modification, but the present disclosure is not limited to this embodiment and the modification. As long as the gist of the present disclosure is not deviated, various modifications that can be conceived by those skilled in the art are applied to the above-described embodiment and its modified examples, and a form constructed by combining the components of the above-described embodiment and its modified examples is also available. It may be included within the scope of the present disclosure.

For example, in the above embodiment and its modification, the substrate 3 is a liquid crystal panel, and the component 5 is temporarily crimped and main crimped to the liquid crystal panel, but the substrate 3 may be a substrate other than the liquid crystal panel. ..

Further, in the above-described embodiment and its modification, the moving direction of the cleaning tool 71 of the cleaning mechanism 70 is the X-axis direction, but it may be in another direction.

Further, in the above-described embodiment and its modification, the cleaning tool 71 of the cleaning mechanism 70 is a brush, but may be a cloth. Further, the cleaning tool 71 may be a rotating brush. That is, in the above-described embodiment and its modification, the cleaning tool 71 cleans the lower receiving portion 36 by moving along the X-axis direction, but may move while rotating. For example, the cleaning tool 71 rotates with the central axis along the Y-axis direction as the rotation axis.

Further, in the above-described embodiment and its modification, when the crimping target portion of the substrate 3 is not supported by the lower receiving portion 36, the cleaning tool 71 is oriented in the first direction along the longitudinal direction of the lower receiving portion 36. Or move in the second direction. That is, the cleaning tool 71 wipes out the support surface 36a of the lower receiving portion 36. However, when the crimping target portion of the substrate 3 is not supported by the lower receiving portion 36, the cleaning tool 71 may sweep the support surface 36a twice or more as well as sweeping. For example, when it is difficult to remove the foreign matter adhering to the support surface 36a of the lower receiving portion 36, the cleaning tool 71 may repeatedly move in the first direction and the second direction. In this case, the foreign matter adhering to the cleaning tool 71 may be removed by the foreign matter removing unit 73 for each sweep. Alternatively, the foreign matter adhering to the cleaning tool 71 may be removed by the foreign matter removing unit 73 each time the cleaning tool 71 performs two or more sweeping operations in succession. That is, every time the cleaning tool 71 reciprocates once or twice or more along the longitudinal direction of the lower receiving portion 26, the foreign matter adhering to the cleaning tool 71 may be removed by the foreign matter removing portion 73. .. Further, the number of round trips may be changed according to the degree of dirtiness of the lower receiving portion 36 and the like.

Further, in the above-described embodiment and modification, the crimping target portion is a portion to which the ACF is attached, but may be a portion to which the ACF is not attached.

Further, in the above-described embodiment and modification, the cleaning mechanism 70 is provided in the temporary crimping portion 30, but may be provided in the main crimping portion 40 or in the sticking portion 20. ..

Further, in the above-described embodiment and modification, the foreign matter removing portion 73 includes a first foreign matter removing portion 73a and a second foreign matter removing portion 73b, and is among the first foreign matter removing portion 73a and the second foreign matter removing portion 73b. It may be composed of only one of them. Further, the first foreign matter removing portion 73a and the second foreign matter removing portion 73b are arranged along the longitudinal direction of the lower receiving portion 36 so as to sandwich the lower receiving portion 36, but are arranged at other positions. You may. For example, at least one of the first foreign matter removing portion 73a and the second foreign matter removing portion 73b may be arranged so as to be displaced from the lower receiving portion 36 in the Y-axis direction.

The hair held by the cleaning tool 71 in the above-described embodiment and modified example may be a resin molded product, a fiber, or a wire.

Further, in the above-described embodiment and its modification, all or a part of the components of the computer 2 may be configured by dedicated hardware, or by executing a software program suitable for each component. It may be realized. Each component may be realized by a program execution unit such as a CPU (Central Processing Unit) or a processor reading and executing a software program recorded on a recording medium such as an HDD (Hard Disk Drive) or a semiconductor memory. good. For example, the program execution unit causes the temporary crimping unit 30 to execute each step shown in FIG.

Further, the component of the computer 2 may be composed of one or a plurality of electronic circuits. The one or more electronic circuits may be general-purpose circuits or dedicated circuits, respectively. The one or more electronic circuits may include, for example, a semiconductor device, an IC (Integrated Circuit), an LSI (Large Scale Integration), or the like. The IC or LSI may be integrated on one chip or may be integrated on a plurality of chips. Here, it is called IC or LSI, but the name changes depending on the degree of integration, and it may be called system LSI, VLSI (Very Large Scale Integration), or ULSI (Ultra Large Scale Integration). An FPGA (Field Programmable Gate Array) programmed after the LSI is manufactured can also be used for the same purpose.

The present disclosure can be used, for example, in a component crimping device included in a component mounting line for producing a liquid crystal display.

1 Parts mounting line 1a, 1b, 1c Base 2 Computer 2a Control part 2b Storage part 3 Board 4 Electrode part 5 Parts 10 Board carry-in part 11, 23, 37, 49, 51 Stage 20 Adhesion part 21, 31, 41 Board Moving mechanism 22 Adhesive mechanism 30 Temporary crimping part 32 Parts mounting mechanism 33 Parts supply part 34 Crimping tool 35a Parts transfer part 36 Under receiving part 40 Crimping part 42 Crimping mechanism 50 Board carrying part 70 Cleaning mechanism 71 Cleaning tool 72 Tool moving mechanism 72a Tool drive unit 72b Tool holding unit 73 Foreign matter removal unit 73a First foreign matter removal unit 73b Second foreign matter removal unit 100 Parts crimping device

Claims (5)

A long underlaying part that supports the crimping target part, which is a predetermined part of the substrate, from below, and
A crimping tool that crimps a part to the crimping target portion supported by the lower receiving portion,
A cleaning tool for cleaning the lower receiving part and
A foreign matter removing part for removing foreign matter adhering to the cleaning tool,
A tool moving mechanism for moving the cleaning tool is provided.
The foreign matter removing portion is arranged below the support surface that supports the crimping target portion in the lower receiving portion.
The tool movement mechanism is
A cleaning operation in which the cleaning tool is moved along the longitudinal direction of the lower receiving portion while rubbing against the supporting surface of the lower receiving portion, and a position below the supporting surface of the lower receiving portion. The evacuation operation of retracting the cleaning tool to the evacuation position, which is the position where the foreign matter is removed by the foreign matter removing unit, is alternately performed.
Parts crimping device. The tool movement mechanism is
In the retracting operation, the cleaning tool is retracted to the retracted position, so that the substrate supported by the lower receiving portion and the cleaning tool retracted to the retracted position are separated from each other.
The component crimping device according to claim 1. The crimping tool crimps the component to the crimping target portion of the substrate supported by the lower receiving portion when the cleaning tool is retracted to the retracted position.
The component crimping device according to claim 1 or 2. The foreign matter removing portion includes a first foreign matter removing portion and a second foreign matter removing portion for removing foreign matter adhering to the cleaning tool, respectively.
The first foreign matter removing portion and the second foreign matter removing portion are arranged on both ends in the longitudinal direction of the lower receiving portion, respectively.
The component crimping device according to any one of claims 1 to 3. It is a cleaning method for parts crimping equipment.
The component crimping device is
A long underlaying part that supports the crimping target part, which is a predetermined part of the substrate, from below, a crimping tool that crimps a part to the crimping target part supported by the underlaying part, and a cleaning tool. And a foreign matter removing portion arranged below the support surface supporting the crimping target portion in the lower receiving portion.
The cleaning method is
A cleaning step of moving the cleaning tool along the longitudinal direction of the lower receiving portion while rubbing the cleaning tool against the supporting surface of the lower receiving portion.
A retracting step of retracting the cleaning tool to a retracting position below the support surface of the lower receiving portion, and
Including a foreign matter removing step in which the foreign matter removing portion removes foreign matter adhering to the cleaning tool that has been retracted to the retracted position.
The cleaning step, the evacuation step, and the foreign matter removing step are alternately performed.
Cleaning method for parts crimping equipment.

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