JP2021170675A5 - - Google Patents

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Publication number
JP2021170675A5
JP2021170675A5 JP2021123462A JP2021123462A JP2021170675A5 JP 2021170675 A5 JP2021170675 A5 JP 2021170675A5 JP 2021123462 A JP2021123462 A JP 2021123462A JP 2021123462 A JP2021123462 A JP 2021123462A JP 2021170675 A5 JP2021170675 A5 JP 2021170675A5
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JP
Japan
Prior art keywords
plate
insulating layer
package
substrate
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2021123462A
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English (en)
Japanese (ja)
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JP7196249B2 (ja
JP2021170675A (ja
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Priority claimed from JP2018056149A external-priority patent/JP6923474B2/ja
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Priority to JP2021123462A priority Critical patent/JP7196249B2/ja
Publication of JP2021170675A publication Critical patent/JP2021170675A/ja
Publication of JP2021170675A5 publication Critical patent/JP2021170675A5/ja
Application granted granted Critical
Publication of JP7196249B2 publication Critical patent/JP7196249B2/ja
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JP2021123462A 2018-03-23 2021-07-28 半導体素子用パッケージおよび半導体装置 Active JP7196249B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2021123462A JP7196249B2 (ja) 2018-03-23 2021-07-28 半導体素子用パッケージおよび半導体装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018056149A JP6923474B2 (ja) 2018-03-23 2018-03-23 半導体素子用パッケージおよび半導体装置
JP2021123462A JP7196249B2 (ja) 2018-03-23 2021-07-28 半導体素子用パッケージおよび半導体装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2018056149A Division JP6923474B2 (ja) 2018-03-23 2018-03-23 半導体素子用パッケージおよび半導体装置

Publications (3)

Publication Number Publication Date
JP2021170675A JP2021170675A (ja) 2021-10-28
JP2021170675A5 true JP2021170675A5 (enExample) 2022-04-13
JP7196249B2 JP7196249B2 (ja) 2022-12-26

Family

ID=68106903

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2018056149A Active JP6923474B2 (ja) 2018-03-23 2018-03-23 半導体素子用パッケージおよび半導体装置
JP2021123462A Active JP7196249B2 (ja) 2018-03-23 2021-07-28 半導体素子用パッケージおよび半導体装置

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP2018056149A Active JP6923474B2 (ja) 2018-03-23 2018-03-23 半導体素子用パッケージおよび半導体装置

Country Status (1)

Country Link
JP (2) JP6923474B2 (enExample)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4480598B2 (ja) * 2004-02-26 2010-06-16 京セラ株式会社 電子部品収納用パッケージおよび電子装置
JP2006128261A (ja) * 2004-10-27 2006-05-18 Kyocera Corp 入出力端子ならびにこれを用いた電子部品収納用パッケージおよび電子装置
JP2006128267A (ja) 2004-10-27 2006-05-18 Kyocera Corp 入出力端子ならびにこれを用いた電子部品収納用パッケージおよび電子装置
JP2007005636A (ja) * 2005-06-24 2007-01-11 Kyocera Corp 入出力端子および電子部品収納用パッケージならびに電子装置
JP2009158511A (ja) * 2007-12-25 2009-07-16 Sumitomo Metal Electronics Devices Inc 入出力端子及び半導体素子収納用パッケージ
US9408307B2 (en) * 2012-03-22 2016-08-02 Kyocera Corporation Device housing package
JP6853034B2 (ja) * 2015-12-25 2021-03-31 京セラ株式会社 光半導体素子収納用パッケージおよび光半導体装置

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